BTH-030-01-H-D-A [SAMTEC]

Board Stacking Connector, 60 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,;
BTH-030-01-H-D-A
型号: BTH-030-01-H-D-A
厂家: SAMTEC    SAMTEC
描述:

Board Stacking Connector, 60 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,

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F-211  
BTH–030–01–L–D–A  
TM  
BSH–090–01–L–D–A  
EXTENDED LIFE PRODUCT  
BSH–060–01–F–D–A  
(0,50mm) .01969"  
BTH, BSH SERIES  
10 year Mixed Flowing Gas with 50µ" Gold  
Call Samtec for maximum cycles  
BASIC BLADE & BEAM HEADER & SOCKET  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?BTH or  
www.samtec.com?BSH  
OTHER  
NO. OF POSITIONS  
PER ROW  
PLATING  
OPTION  
BTH  
01  
A
D
OPTION  
Mates with:  
BSH  
Insulator Material:  
LCP  
Contact Material:  
Phosphor Bronze  
Plating:  
Au or Sn over 50µ" (1,27µm) Ni  
Current Rating:  
1.25A @ 80°C ambient  
Flammability Rating:  
UL 94 VO  
–F  
–K  
= (7,00mm)  
.276" DIA  
Polyimide Film  
Pick  
= Gold Flash on contact, Matte Tin on tail  
–030, –050, –060,  
–090, –120, –150  
–L  
= 10µ" (0,25µm) Gold on contact,  
Matte Tin on tail  
& Place Pad  
Operating Temp Range:  
-55°C to +125°C  
Voltage Rating:  
125 VAC  
No. of Positions x (0,50) .0197  
+ (5,00) .197  
–C*  
–TR  
01  
= Electro-Polished Selective  
=Tape & Reel  
(120 positions  
maximum)  
50µ" (1,27µm) min Au over 150µ" (3,81µm)  
Ni on Signal Pins in contact area,  
10µ" (0,25µm) min Au over 50µ" (1,27µm)  
Ni on Ground Plane in contact area,  
Matte Tin over 50µ" (1,27µm) min  
Ni on all solder tails  
(5,97)  
.235  
(3,94)  
.155  
Max Cycles:  
100  
RoHS Compliant:  
Yes  
02  
(0,20)  
.008  
(0,50)  
.01969  
Processing:  
Lead-Free Solderable:  
Yes  
(0,76)  
.030  
SMT Lead Coplanarity:  
(0,10mm) .004" max (030-090)  
(0,15mm) .006" max (120-150)  
Board Stacking:  
(4,27)  
.168  
(0,89)  
.035  
DIA  
For applications requiring  
more than two connectors per  
board or 90 positions or higher,  
contact ipg@samtec.com  
• Passes  
10 year MFG  
MATED HEIGHT  
OTHER  
OPTION  
NO. OF POSITIONS  
PER ROW  
PLATING  
OPTION  
BSH  
01  
A
D
LEAD  
MATED  
HEIGHT*  
STYLE  
(5,00) .197  
–01  
Mates with:  
BTH  
*Processing conditions will  
affect mated height.  
–TR  
–F  
=Tape & Reel  
(120 positions  
maximum)  
= Gold Flash on contact, Matte Tin on tail  
–030, –050, –060,  
–090, –120, –150  
APPLICATION  
SPECIFIC  
• 30µ" (0,76µm) Gold  
–L  
= 10µ" (0,25µm) Gold on contact,  
Matte Tin on tail  
• Edge Mount Capability  
• 8mm, 11mm, 16 mm,  
19mm and 22mm Stack  
Height (Caution: Some  
automatic placement/  
inspection machines may  
have component height  
restrictions. Please consult  
machinery specifications.)  
(11mm, 16mm, 19mm and  
22mm not available with 50  
positions)  
No. of Positions x (0,50) .0197  
+ (6,27) .247  
–C*  
= Electro-Polished Selective  
02  
50µ" (1,27µm) min Au over 150µ" (3,81µm)  
Ni on Signal Pins in contact area,  
10µ" (0,25µm) min Au over 50µ" (1,27µm)  
Ni on Ground Plane in contact area,  
Matte Tin over 50µ" (1,27µm) min  
Ni on all solder tails  
(6,22)  
.245  
(7,24)  
(3,81)  
.150  
.285  
01  
(0,50)  
.01969  
AGILENT LOGIC  
Call Samtec.  
ANALYZER TEST POINT  
(0,15)  
.006  
(0,89)  
.035  
DIA  
*Note: –C Plating passes  
10 year MFG testing  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
(3,05)  
.120  
(3,25)  
.128  
CONNECTOR  
Specify: ASP-65067-01  
(0,76)  
.030  
WWW.SAMTEC.COM  

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