BTH-030-01-H-D-A [SAMTEC]
Board Stacking Connector, 60 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,;型号: | BTH-030-01-H-D-A |
厂家: | SAMTEC |
描述: | Board Stacking Connector, 60 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, 插座 |
文件: | 总1页 (文件大小:610K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
F-211
BTH–030–01–L–D–A
TM
BSH–090–01–L–D–A
EXTENDED LIFE PRODUCT
BSH–060–01–F–D–A
(0,50mm) .01969"
BTH, BSH SERIES
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles
BASIC BLADE & BEAM HEADER & SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTH or
www.samtec.com?BSH
OTHER
NO. OF POSITIONS
PER ROW
PLATING
OPTION
BTH
01
A
D
OPTION
Mates with:
BSH
Insulator Material:
LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
1.25A @ 80°C ambient
Flammability Rating:
UL 94 VO
–F
–K
= (7,00mm)
.276" DIA
Polyimide Film
Pick
= Gold Flash on contact, Matte Tin on tail
–030, –050, –060,
–090, –120, –150
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
& Place Pad
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC
No. of Positions x (0,50) .0197
+ (5,00) .197
–C*
–TR
01
= Electro-Polished Selective
=Tape & Reel
(120 positions
maximum)
50µ" (1,27µm) min Au over 150µ" (3,81µm)
Ni on Signal Pins in contact area,
10µ" (0,25µm) min Au over 50µ" (1,27µm)
Ni on Ground Plane in contact area,
Matte Tin over 50µ" (1,27µm) min
Ni on all solder tails
(5,97)
.235
(3,94)
.155
Max Cycles:
100
RoHS Compliant:
Yes
02
(0,20)
.008
(0,50)
.01969
Processing:
Lead-Free Solderable:
Yes
(0,76)
.030
SMT Lead Coplanarity:
(0,10mm) .004" max (030-090)
(0,15mm) .006" max (120-150)
Board Stacking:
(4,27)
.168
(0,89)
.035
DIA
For applications requiring
more than two connectors per
board or 90 positions or higher,
contact ipg@samtec.com
• Passes
10 year MFG
MATED HEIGHT
OTHER
OPTION
NO. OF POSITIONS
PER ROW
PLATING
OPTION
BSH
01
A
D
LEAD
MATED
HEIGHT*
STYLE
(5,00) .197
–01
Mates with:
BTH
*Processing conditions will
affect mated height.
–TR
–F
=Tape & Reel
(120 positions
maximum)
= Gold Flash on contact, Matte Tin on tail
–030, –050, –060,
–090, –120, –150
APPLICATION
SPECIFIC
• 30µ" (0,76µm) Gold
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
• Edge Mount Capability
• 8mm, 11mm, 16 mm,
19mm and 22mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
(11mm, 16mm, 19mm and
22mm not available with 50
positions)
No. of Positions x (0,50) .0197
+ (6,27) .247
–C*
= Electro-Polished Selective
02
50µ" (1,27µm) min Au over 150µ" (3,81µm)
Ni on Signal Pins in contact area,
10µ" (0,25µm) min Au over 50µ" (1,27µm)
Ni on Ground Plane in contact area,
Matte Tin over 50µ" (1,27µm) min
Ni on all solder tails
(6,22)
.245
(7,24)
(3,81)
.150
.285
01
(0,50)
.01969
AGILENT LOGIC
Call Samtec.
ANALYZER TEST POINT
(0,15)
.006
(0,89)
.035
DIA
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(3,05)
.120
(3,25)
.128
CONNECTOR
Specify: ASP-65067-01
(0,76)
.030
WWW.SAMTEC.COM
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