DPAM-06-07.0-H-3-2-A [SAMTEC]
Board Stacking Connector, 18 Contact(s), 3 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT;
| 型号： | DPAM-06-07.0-H-3-2-A |
| 厂家： | 
SAMTEC |
| 描述： | Board Stacking Connector, 18 Contact(s), 3 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT 连接器 |
| 文件： | 总1页 (文件大小：505K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-211
DPAM–23–07.0–H–8–2–A
DPAF–23–03.0–H–8–2–A
(2,16mm) .085"
DPAM, DPAF SERIES
®
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAM Mates with:
PAIRS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
DPAF, RDPAF
OPTION
DPAM
A
DPAF Mates with:
DPAM
Specify
LEAD
STYLE
from
–8
=Eight
Pair
SPECIFICATIONS
–K
–2
–S
=(20,00mm) 0.80"
DIA Polyimide
film Pick &
–04, –06
= Lead-Free
Tin Alloy
=30µ" (0,76µm)
Gold on contact area,
Tin on solder tail
(–11 & –14 only)
For complete specifications and
recommended PCB layouts see
www.samtec.com?DPAM or
www.samtec.com?DPAF
Rows
(–07.0 only)
96.5% Sn/
3% Ag/.5% Cu
Solder Crimp
chart
Place Pad
–08, –15, –23
–3
=Three
Pair
Rows
(–07 only)
(All lead styles)
Insulator Material:
Black LCP
–TR
–H
=30µ" (0,76µm)
Gold on contact area,
Gold Flash
=Tape & Reel
Contact Material:
Copper Alloy
Perimeter
Grounds (TYP)
G1
Plating:
(2,54)
.100
–GP
=Guide Post
(–23 only &
–07 only)
Au over 50µ" (1,27µm) Ni
Current Rating (2x3):
2.9A @ 30°C Temperature Rise
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10.4mΩ max
on solder tail
(–07 only)
B
(2,54)
.100
LEAD
A
02 01 G2 03 04
STYLE
Signal Pairs (TYP)
Working Voltage:
300 VAC
No. of positions x (2,16) .085 + (4,34) .171
(6,66) .262
(10,72) .422
(13,66) .538
–07.0
–11.0
–14.0
®
Staggered pitch DPAM/DPAF Rated @ 3dB Insertion Loss
10mm Stack Height
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.com?DPAM,
www.samtec.com?DPAF or contact sig@samtec.com
Mated Cycles:
100 Cycles
(0,13)
.005
A
RoHS Compliant:
7.0 GHz / 14.0 Gbps
Ye s
NO OF
ROWS
Lead-Free Solderable:
Yes
(1,27)
B
(2,16) .085
.050
(1,27)
.050
(1,08) .0425
DIA
(24,59) .968
(11,89) .468
–8
–3
No. of positions x (2,16) .085 + (2,95) .116
PAIRS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OPTION
DPAF
03.0
A
–8
Pair Rows
–K
=(20,00mm)
0.80" DIA
Polyimide
film
Pick &
Place Pad
=Eight
–H
–2
=30µ" (0,76µm)
= Lead-Free Tin Alloy
96.5% Sn/ 3%Ag/
.5% Cu
–04, –06, –08,
–15, –23
Gold on contact area,
Gold Flash on solder tail
–3
Solder Crimp
=Three
Pair Rows
No. of positions x (2,16) .085 + (4,34) .171
Signal
G1
NO OF
ROWS
Pairs
–TR
=Tape
& Reel
A
(TYP)
ALSO
AVAILABLE
(23,32)
.918
–8
–3
A
04
USABLE PAIRS
PER ARRAY*
(10,62)
.418
(2,54)
.100
02
01
SIZE
(1,52)
.060
Tin-Lead Solder Charge.
Call Samtec.
48 Pairs
104 Pairs
168 Pairs
18 Pairs
39 Pairs
63 Pairs
–08 x –8
–15 x –8
–23 x –8
–08 x –3
–15 x –3
–23 x –3
G2
03
(1,27) .050
DPAF
Perimeter Grounds (TYP)
Solder crimped on tail
DPAM
LEAD
STYLE
MATED HEIGHT*
–03.0
10mm
(6,45)
.254
(0,13)
.005
Note: Other Gold plating
options available.
Contact Samtec.
–07.0
–11.0
–14.0
14mm
(2,16) .085
(1,08) .0425
(1,27)
.050
DIA
17mm
(1,27)
.050
Note: Some sizes, styles and
options are non-standard,
non-returnable.
*Assumes first and last pair in
each row are grounded
*Processing conditions will
affect mated height.
No. of positions x (2,16) .085 + (2,95) .116
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