ERF8-005-07.0-L-DV-K [SAMTEC]
Board Stacking Connector;
| 型号： | ERF8-005-07.0-L-DV-K |
| 厂家： | 
SAMTEC |
| 描述： | Board Stacking Connector |
| 文件： | 总1页 (文件大小：1096K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-213
ERF8–020–05.0–S–DV–TR
™
ERF8–040–05.0–S–DV–TR
(0,80 mm) .0315"
ERF8 SERIES
ERF8–060–05.0–L–DV–TR
RUGGED HIGH SPEED SOCKET
Robust Edge Rate™
contact improves
10 to 150 I/Os
®
Board Mates:
“Zippered” unmating
SPECIFICATIONS
ERM8
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERF8
Cable Mates:
ERCD, ERDP
Insulator Material:
Black LCP
TM
(1,50 mm)
.059"
Contact Material:
BeCu
NOMINAL
WIPE
EXTENDED LIFE PRODUCT
Plating:
Au or Sn over
10 year Mixed Flowing Gas with 30µ" Gold
Call Samtec for maximum cycles mated with ERM8
50µ" (1,27 µm) Ni
Current Rating:
1.4A per contact @ 95°C
(6 adjacent pins powered)
Operating Temp Range:
-55°C to + 125°C
Voltage Rating:
200 VAC max
Rated @ 3dB Insertion Loss
ERM8/ERF8
7 mm Stack Height
with PCB effects*
w/o PCB effects**
MATED HEIGHT*
Single-Ended
Signaling
ERF8
LEAD
ERM8 LEAD STYLE
10.5 GHz / 21 Gbps
12 GHz / 24 Gbps
RoHS Compliant:
Yes
STYLE –02.0 –05.0 –08.0 –09.0
Differential Pair
Signaling
9.5 GHz / 19 Gbps
15.5 GHz / 31 Gbps
(7,00) (10,00)(13,00)(14,00)
.276 .394 .512 .551
(9,00) (12,00)(15,00)(16,00)
.354 .472 .591 .629
–05.0
Processing:
Lead–Free Solderable:
Yes
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
–07.0
SMT Lead Coplanarity:
(0,10 mm) .004" max (005-030)
(0,12 mm) .005" max (040-060)
(0,15 mm) .006" max (070-075)
Performance data for other stack heights and complete test data
available at www.samtec.com?ERF8 or contact sig@samtec.com
*Processing conditions
will affect mated height.
NO. OF POSITIONS
PER ROW
PLATING
OPTION
LEAD
STYLE
OTHER
OPTION
ERF8
TR
DV
Specify
LEAD
STYLE
from
–L
= 10µ"
–L
–TR
=Tape
& Reel
–005, –010, –013,
–020, –025, –030,
–040, –049, –050,
–060, –070, –075
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
= Latching
(Lead Style –05.0 only)
(N/A with –EGP or
–EGPS option)
Packaging
chart
–EGP
LEAD
STYLE
–S
A
= Extended Guide Post
(Lead Style –07.0 only)
(N/A with –L & –EGPS option)
= 30µ"
(5,10)
.200
(0,76 µm)
Gold on
contact,
Matte Tin
on tail
–05.0
APPLICATIONS
(7,00)
.276
–07.0
STANDARD POS. PART NOs.
SERIES
–EGPS
= Extended
Guide Post Shield
NEXUS5001™.org
11 ASP-137969-01 ERF8-DV
17 ASP-130368-01 ERF8-DV
20 ASP-130367-01 ERF8-DV
23 ASP-130368-01 ERF8-DV
35 ASP-135029-01 ERF8-DV
POWER.org™
No. of Positions x
(0,80) .0315 + (6,00) .236
–L & –EGP = No. of Positions x
(0,80) .0315 + (7,50) .295
(Lead Style –07.0 only)
(N/A with –L & –EGP option)
(–010, –020, –025, –030 only)
ARM/HSSTP
NEXUS5001™.org
POWER.org™
–EGPS = No. of Positions x
(0,80) .0315 + (10,00) .394
(7,25)
.285
–K
01
= (6,00 mm) .236" DIA
Polyimide Film
(3,35)
.132
(5,60)
.220
APPLICATION
Pick & Place Pad
–EGP
SPECIFIC
02
Other positions
and mezzanine stack
heights available.
(6,20)
.244
(5,30)
.209
(2,50)
.098
(1,07)
.042
(3,35)
.132
Call Samtec.
A
(0,64)
.025
(1,32)
.052
DIA
(0,80)
.0315
(7,20)
.283
–EGPS
(5,40)
.213
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(0,94)
.037
–L
WWW.SAMTEC.COM
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