MIS-057-01-L-D [SAMTEC]
Board Stacking Connector, 114 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT;
| 型号： | MIS-057-01-L-D |
| 厂家： | 
SAMTEC |
| 描述： | Board Stacking Connector, 114 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT 连接器 |
| 文件： | 总1页 (文件大小：847K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-213
MIS–019–01–F–D
®
MIS–057–01–L–D
MIS–038–01–F–D
(0,635 mm) .025"
MIS SERIES
MIXED TECHNOLOGY SOCKET
Integral metal plane
for power or ground
Board Mates:
SPECIFICATIONS
MIT
For complete specifications and
Polarized
Cable Mates:
MICD
recommended PCB layouts see
www.samtec.com?MIS
Insulator Material:
Liquid Crystal
• Mixed
technology
footprint
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contacts: 1.6A per contact
@ 80°C
MIT/MIS
Type Rated @ 3dB Insertion Loss*
5 mm Stack Height
Ground Plane: 8.7A per ground
plane@ 80°C
Single-Ended Signaling
–D
8.5 GHz / 17 Gbps
8.5 GHz / 17 Gbps
9.5 GHz / 19 Gbps
76 signal lines
per linear inch
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
275 VAC
Differential Pair Signaling –D
Differential Pair Signaling –DP
*Performance data includes effects of a non-optimized PCB.
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
Max Cycles:
Performance data for other stack heights and complete
test data available at www.samtec.com?MIS or contact
sig@samtec.com
100
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (019-057)
Board Stacking:
OTHER
OPTION
PLATING
OPTION
NO. OF POSITIONS
01
MIS
D
PER ROW
For applications requiring more
than two connectors per board
contact ipg@samtec.com
–K
= (7,00 mm)
.275" DIA
APPLICATION
–F
–019, –038, –057
SPECIFIC OPTION
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
Polyimide
film Pick &
Place Pad
(38 total positions per bank)
• 11 mm, 16 mm, 18,75 mm
and 22 mm stack height
• 30µ" (0,76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 76, 95, 114 and 133
positions per row
–L
= 10µ" (0,25 µm)
–TR
= Tape &
Reel
Gold on Signal Pins and
Ground Plane, Matte Tin on tails
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on
Signal Pins in contact area,
10µ" (0,25 µm) min Au over
50µ" (1,27 µm) Ni on Ground
Plane in contact area, Matte Tin
over 50µ" (1,27 µm) min Ni
on all solder tails
(No. of Positions/19) x (12,70) .500 + (12,70) .500
• Edge Mount
(12,70) .500
01
Call Samtec.
(6,22)
.245
02
(0,635)
.025
(0,15)
.006
(1,32)
.052
(3,43)
.135
(3,63)
.143
(7,49)
.295
(0,69) .027
(0,18)
.007
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Note: Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press fit) for added retention to PCB.
WWW.SAMTEC.COM
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