MIT-076-02-F-D-A [SAMTEC]

Board Stacking Connector, 152 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT;
MIT-076-02-F-D-A
型号: MIT-076-02-F-D-A
厂家: SAMTEC    SAMTEC
描述:

Board Stacking Connector, 152 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT

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中文:  中文翻译
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F-208-1  
MIT–019–01–F–D–A  
MIT–038–01–F–D–A  
®
MIT–057–01–L–D–A  
MIT  
0,635mm MIX TECH HEADER SERIES  
Mates with:  
MIS, MICD  
Integral metal plane  
for power or ground  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?MIT  
76 signal lines  
per linear inch  
Insulator Material:  
Liquid Crystal  
Choice of  
mated heights  
Polymer  
Contact Material:  
Phospher Bronze  
Plating:  
Au over 50µ" (1,27µm) Ni  
Current Rating:  
Contacts: 1.6A @ 80°C  
Ground Plane: 8.7A @ 80°C  
Operating Temp Range:  
-55°C to +125°C  
Voltage Rating:  
275 VAC  
5mm Stack Height  
Single-Ended Signaling  
Differential Pair Signaling  
Performance data for other stack heights  
available at www.samtec.com?MIT  
Rated @ -3dB Insertion Loss  
Max Cycles:  
100  
8.5 GHz / 17 Gbps  
8.5 GHz / 17 Gbps  
RoHS Compliant:  
Yes  
(0,64mm)  
.025" pitch  
ALSO AVAILABLE  
Polarized  
Processing:  
Board Spacing Standoffs.  
See SO Series.  
Max Processing Temp:  
230°C for 60 seconds, or  
260°C for 20 seconds 3x  
Lead–Free Solderable:  
Yes  
NO. OF POSITIONS  
LEAD  
STYLE  
PLATING  
OPTION  
OTHER  
OPTION  
SMT Lead Coplanarity:  
(0,10mm) .004" max (019-076)  
Board Stacking:  
MIT  
D
A
PER ROW  
For applications requiring  
more than two connectors per  
board or 76 positions or higher,  
contact ipg@samtec.com  
Specify  
LEAD  
STYLE  
from  
–K  
= (7,00mm)  
.275" DIA  
Polyimide  
film Pick &  
Place Pad  
–019, –038, –057, –076  
–L  
(38 total positions per bank)  
= 10µ" (0,25µm) Gold on  
APPLICATION  
SPECIFIC OPTION  
Signal Pins and Ground Plane,  
Matte Tin on tails  
chart  
• 11mm, 16mm, 18,75mm  
and 22mm stack height  
• 30µ" (0,76µm) Gold  
• Differential Pair and  
“Partitionable” (combine  
differential & single-  
ended banks in same  
connector) available.  
• 95, 114 and 133  
positions per row  
–F  
–TR  
= Tape &  
Reel  
= Gold Flash on Signal Pins and  
Ground Plane, Matte Tin on tails  
–C*  
= Electro-Polished Selective  
50µ" (1,27µm) min Au over 150µ"  
(3,81µm) Ni on Signal Pins in contact  
area, 10µ" (0,25µm) min Au over  
50µ" (1,27µm) Ni on Ground Plane  
in contact area, Matte Tin over 50µ"  
(1,27µm) min Ni on all solder tails  
(No. of Positions/19) x (12,70) .500 + (11,43) .450  
• Edge Mount  
(12,70)  
.500  
Call Samtec.  
02  
STACK HEIGHTS  
(5,97)  
.235  
(7,11)  
.280  
LEAD  
MATED  
HEIGHT  
A
STYLE  
(4,27) .168 (5,00) .198  
(7,26).286 (8,00) .315  
–01  
–02  
01  
(0,20)  
.008  
(0,64)  
.025  
(7,11)  
.280  
Processing conditions will  
affect mated height.  
(1,40)  
.055  
A
*Note: –C Plating passes  
10 year MFG testing  
(0,38)  
.015  
(0,58) .023 x (0,38) .015  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
Note: Rugged through-hole ground plane soldered to board  
(requires paste-over-hole, not press-fit) for added retention to PCB.  
WWW.SAMTEC.COM  

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