MIT-076-02-F-D-A [SAMTEC]
Board Stacking Connector, 152 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT;
| 型号： | MIT-076-02-F-D-A |
| 厂家： | 
SAMTEC |
| 描述： | Board Stacking Connector, 152 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT |
| 文件： | 总1页 (文件大小：540K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-208-1
MIT–019–01–F–D–A
MIT–038–01–F–D–A
®
MIT–057–01–L–D–A
MIT
0,635mm MIX TECH HEADER SERIES
Mates with:
MIS, MICD
Integral metal plane
for power or ground
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIT
76 signal lines
per linear inch
Insulator Material:
Liquid Crystal
Choice of
mated heights
Polymer
Contact Material:
Phospher Bronze
Plating:
Au over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 1.6A @ 80°C
Ground Plane: 8.7A @ 80°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
275 VAC
5mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights
available at www.samtec.com?MIT
Rated @ -3dB Insertion Loss
Max Cycles:
100
8.5 GHz / 17 Gbps
8.5 GHz / 17 Gbps
RoHS Compliant:
Yes
(0,64mm)
.025" pitch
ALSO AVAILABLE
Polarized
Processing:
Board Spacing Standoffs.
See SO Series.
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
NO. OF POSITIONS
LEAD
STYLE
PLATING
OPTION
OTHER
OPTION
SMT Lead Coplanarity:
(0,10mm) .004" max (019-076)
Board Stacking:
MIT
D
A
PER ROW
For applications requiring
more than two connectors per
board or 76 positions or higher,
contact ipg@samtec.com
Specify
LEAD
STYLE
from
–K
= (7,00mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–019, –038, –057, –076
–L
(38 total positions per bank)
= 10µ" (0,25µm) Gold on
APPLICATION
SPECIFIC OPTION
Signal Pins and Ground Plane,
Matte Tin on tails
chart
• 11mm, 16mm, 18,75mm
and 22mm stack height
• 30µ" (0,76µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-
ended banks in same
connector) available.
• 95, 114 and 133
positions per row
–F
–TR
= Tape &
Reel
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over 150µ"
(3,81µm) Ni on Signal Pins in contact
area, 10µ" (0,25µm) min Au over
50µ" (1,27µm) Ni on Ground Plane
in contact area, Matte Tin over 50µ"
(1,27µm) min Ni on all solder tails
(No. of Positions/19) x (12,70) .500 + (11,43) .450
• Edge Mount
(12,70)
.500
Call Samtec.
02
STACK HEIGHTS
(5,97)
.235
(7,11)
.280
LEAD
MATED
HEIGHT
A
STYLE
(4,27) .168 (5,00) .198
(7,26).286 (8,00) .315
–01
–02
01
(0,20)
.008
(0,64)
.025
(7,11)
.280
Processing conditions will
affect mated height.
(1,40)
.055
A
*Note: –C Plating passes
10 year MFG testing
(0,38)
.015
(0,58) .023 x (0,38) .015
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Note: Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
WWW.SAMTEC.COM
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