QSE-020-01-L-D-A-FL [SAMTEC]
Board Stacking Connector, 40 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket,;
| 型号： | QSE-020-01-L-D-A-FL |
| 厂家： | 
SAMTEC |
| 描述： | Board Stacking Connector, 40 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, 连接器 集管和边缘连接器 PC 局域网 |
| 文件： | 总1页 (文件大小：1100K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-213
QSE–028–01–F–D–DP–A
®
QSE–060–01–F–D–A
QSE–020–01–L–D–A
(0,80 mm) .0315"
QSE SERIES
HIGH SPEED GROUND PLANE SOCKET
Integral metal plane
Blade &
Beam
for power or ground
Board Mates:
QTE
SPECIFICATIONS
Design
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Insulator Material:
Liquid Crystal
Polymer
TM
Terminal Material:
Phosphor Bronze
Plating:
EXTENDED LIFE PRODUCT
Au or Sn over
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTE
50µ" (1,27 µm) Ni
Current Rating:
Contacts:
1.3A per contact @ 95°C
Ground Plane:
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
QTE/QSE
Type
10.1A per ground plane @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC (5 mm Stack Height)
Max Cycles:
5 mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
–D
–D
9 GHz / 18 Gbps
8 GHz / 16 Gbps
9 GHz / 18 Gbps
14 GHz / 28 Gbps
–DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
100
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
RoHS Compliant:
Yes
Performance data for other stack heights and complete test data
available at www.samtec.com?QSE or contact sig@samtec.com
Processing:
Lead–Free Solderable:
Yes
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
TYPE
QSE
A
01
For applications requiring more
than two connectors per board
contact ipg@samtec.com
–F
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
APPLICATION
–D
= Single-
Ended
–K
–020, –040, –060
SPECIFIC OPTION
= (8,25 mm) .325"
DIA Polyimide
Film Pick &
(40 total pins per bank = –D)
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56 (-DP), 80, 100
positions per row
–014, –028, –042
Place Pad
–D–DP
= Differential
Pair
(14 pairs per bank = –D–DP)
–L
= 10µ" (0,25 µm) Gold
on Signal Pins
–TR
–D–DP = (No. of Positions per Row/14) x
(20,00) .7875 + (1,27) .050
(–01 only)
= Tape & Reel
Packaging
and Ground Plane,
Matte Tin on tails
(N/A on 56 &
80 positions)
–D = (No. of Positions per Row/20) x
(20,00) .7875 + (1,27) .050
–C*
= Electro-Polished
Selective
50µ" (1,27 µm) min
Au over 150µ"
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min
Au over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
MatteTin over 50µ"
(1,27 µm) min Ni on
all solder tails
(20,00) .7875
02
–L
QTE
LEAD
MATED
HEIGHT
= Latching Option
(N/A on 42, 56, 60
& 80 positions)
(7,49)
.295
(7,24)
.285
STYLE WITH QSE*
(5,00) .197
–01
–02
–03
–04
–05
–07
01
(0,80)
.0315
(0,15)
.006
(8,00) .315
(11,00) .433
(3,25)
.128
(16,00) .630
• Guide Posts and Friction
(19,00) .748
Lock options
.
(25,00) .984
• Retention Option
Call Samtec.
*Processing
conditions will
affect mated height.
(3,05)
.120
(0,76)
.030
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
(0,89)
.035
DIA
*Note: –C Plating passes
(0,64)
.025
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–L
WWW.SAMTEC.COM
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