QTE-060-07-C-D-A-K [SAMTEC]
Board Stacking Connector;
| 型号： | QTE-060-07-C-D-A-K |
| 厂家： | 
SAMTEC |
| 描述： | Board Stacking Connector 连接器 |
| 文件： | 总1页 (文件大小：320K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-217
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0.80 mm) .0315"
QTE SERIES
HIGH-SPEED GROUND PLANE HEADER
Integral metal plane
for power or ground
Board Mates:
QSE
SPECIFICATIONS
Standard stack heights
from 5 mm to 25 mm
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Standoffs:
SO
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
HIGH-SPEED CHANNEL PERFORMANCE
10 YEAR MFG
WITH 50 µ" GOLD
QTE-DP/QSE-DP @ 5 mm Mated Stack Height
EXTENDED LIFE
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
PRODUCT
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles: 100
28
HIGH MATING
CYCLES
or contact SIG@samtec.com
G
b
p
s
RoHS Compliant: Yes
PROCESSING
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
LEAD
STYLE
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
TYPE
QTE
A
Specify
LEAD
STYLE
from
–K
RECOGNITIONS
= (7.00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–020, –040, –060
–F
–D
(40 total pins per bank = –D)
For complete scope of
recognitions see
www.samtec.com/quality
= Gold Flash
= Single-Ended
on Signal Pins and
Ground Plane,
Matte Tin on tails
chart
–014, –028, –042
–D–DP
= Differential Pair
(–01 only)
(14 pairs per bank = –D–DP)
–TR
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
FILE NO. E111594
FILE NO: 090871_0_000
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
PROTOCOLS
• 100 GbE
–D = (No. of Positions per Row/20)
x (20.00) .7875
• XAUI
• PCI Express®
–L
(20.00) .7875
–C*
01
= Latching
Option
= Electro-Polished
Selective
• SATA
(5.97)
.235
(7.11)
.280
• MGT (Rocket I/O)
• InfiniBand™
(N/A on –042 &
–060 positions)
50 µ" (1.27 µm) min
Au over 150µ"
02
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
MatteTin over 50µ"
(1.27 µm) min Ni on
all solder tails
(0.80)
.0315
(0.20)
.008
ALSO AVAILABLE
(MOQ Required)
QTE
LEAD
STYLE
HEIGHT
WITH QSE*
A
• 15 mm, 22 mm and
30 mm stack height
A
(4.27) .168 (5.00) .197
(7.26) .286 (8.00) .315
(10.27) .404 (11.00) .433
(15.25) .600 (16.00) .630
(18.26) .718 (19.00) .748
(24.24) .954 (25.00) .984
(13.26) .522 (14.00) .551
–01
–02
–03
–04
–05
–07
–09
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
(0.76)
.030
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
*Note: –C Plating passes
10 year MFG testing
• 56 (-DP), 80, 100
positions per row
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(0.64)
.025
(0.89)
.035 DIA
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
• Retention Option
Contact Samtec.
–L
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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