SEAMI-40-11.0-S-10-1-A-K-TR [SAMTEC]
Board Connector;
| 型号： | SEAMI-40-11.0-S-10-1-A-K-TR |
| 厂家： | 
SAMTEC |
| 描述： | Board Connector |
| 文件： | 总1页 (文件大小：641K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEAMP–20–02.0–L–06
F-217
SEAMI–50–11.0–L–10–2–A–K–TR
Press-fit
tails
(1.27 mm) .050"
SEAMP, SEAMI SERIES
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
Mates with:
NO. OF POSITIONS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SEAF, SEAF-RA-GP
OPTION
SEAMP
02.0
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAMP
–L
–04
–GP
= Guide
Post
(Mates with
SEAF-RA-
GP only)
= 10 µ" (0.25 µm)
Gold on
= Four Rows
Insulator Material: Natural LCP
Contact Material: Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
SEAMP
–10, –20, –30, –40, –50
= Press-fit
contact area,
Matte Tin on tail
–06
No. of positions x
(1.27) .050 + (5.18) .204
= Six Rows
Current Rating: 2.5 A per pin
(6 adjacent pins powered)
Plating: Au or Sn over
NO. OF
A
B
ROWS
–S
–08
(7.06) (2.54)
.278 .100
(9.60) (2.54)
.378 .100
(12.14) (5.08)
.478 .200
(14.68) (7.62)
.578 .300
= 30 µ" (0.76 µm)
Gold on
–TR
= Tape
& Reel
–04
–06
–08
–10
= Eight Rows
50 µ" (1.27 µm) Ni
A
Contact Resistance: 8.7 mW
Working Voltage: 215 VAC
RoHS Compliant: Yes
B
contact area,
Matte Tin on tail
–10
= Ten Rows
(1.27) .050
RECOGNITIONS
For complete scope
of recognitions see
HIGH-SPEED CHANNEL PERFORMANCE
SEAMP/SEAF @ 7 mm Mated Stack Height
MATED HEIGHTS*
(4.60)
.181
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
www.samtec.com/quality
SEAMPSEAF LEAD STYLE
32
LEAD
–05.0 –06.0 –06.5
STYLE
–02.0
or contact SIG@samtec.com
G
b p s
(0.59) .023
(1.23)
FILE NO. E111594
7 mm 8 mm 8.5 mm
Processing: Application tooling and one ton
minimum press required. Contact ATG@samtec.com
for more information.
(1.78)
.070
No. of positions x
.048
Note: Compliant pin fixture *Processing conditions will
(1.27) .050 - (1.27) .050
affect mated height.
CAT-SEAMP-XX-XX.
Patent Pending.
Mates with:
NO. PINS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
SEAF
SEAMI
11.0
A
K
TR
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAMI
–1
= Tin/Lead
Alloy
Solder
Charge
–L
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–A
= 10 µ"
= Alignment Pins
–08
Insulator Material:
–40, –50
SEAMI
=Eight Rows
Black LCP
= 85 W tuned
Contact Material:
Copper Alloy
–K
= Polyimide film
Pick & Place Pad
–10
No. of positions x
01 (1.27) .050 + (4.98) .196
Operating Temp Range:
=Ten Rows
Testing Now!
–2
= Lead-Free
Solder
Plating:
NO. OF
ROWS
A
B
–TR
Au or Sn over
50 µ" (1.27 µm) Ni
Contact
–S
=Tape & Reel
(13.41) (5.08)
.528 .200
Charge
= 30 µ"
–08
–10
A
B
Resistance:
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
(15.95) (7.62)
.628 .300
Testing Now!
Working Voltage:
Testing Now!
MATED HEIGHTS*
RoHS Compliant: Yes
08
Lead-Free Solderable: Yes
SEAMI SEAF LEAD STYLE
LEAD
–05.0 –06.0 –06.5
STYLE
ALSO AVAILABLE
16 mm 17 mm 17.5 mm
–11.0
(MOQ Required)
*Processing conditions will
affect mated height.
• Other plating options
• 20 & 30 pins per row
• 04 & 06 rows
(14.66)
.577
HIGH-SPEED CHANNEL PERFORMANCE
Contact Samtec.
SEAMI/SEAF @ 16 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
Note: Patented
(1.27) .050
No. of positions x
(1.27) .050 + (3.58) .141
17
(0.86)
.034
(1.12)
.044
DIA
or contact SIG@samtec.com
G
b p s
Note: Some sizes, styles and
options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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