SEAMP-40-02.0-S-06-TR [SAMTEC]
Board Connector;
| 型号： | SEAMP-40-02.0-S-06-TR |
| 厂家： | 
SAMTEC |
| 描述： | Board Connector 连接器 |
| 文件： | 总1页 (文件大小：521K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEAMP–20–02.0–L–06
F-215
SEAMI–50–11.0–L–10–2–A–K–TR
Press fit
tails
(1,27 mm) .050"
SEAMP, SEAMI SERIES
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD
Mates with:
NO. OF POSITIONS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SEAF, SEAF-RA-GP
OPTION
SEAMP
02.0
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAMP
–L
–04
–GP
= Guide
Post
(Mates with
SEAF-RA-
GP only)
= 10 µ" (0,25 µm)
Gold on
= Four Rows
Insulator Material: Natural LCP
Contact Material: Copper Alloy
Operating Temp Range:
-55°C to +125°C
SEAMP
–10, –20, –30, –40, –50
= Press Fit
contact area,
Matte Tin on tail
–06
No. of positions x
(1,27) .050 + (5,18) .204
= Six Rows
Current Rating: 2.5 A per pin
(6 adjacent pins powered)
Plating: Au or Sn over
NO. OF
A
B
ROWS
–S
–08
(7,06) (2,54)
.278 .100
(9,60) (2,54)
.378 .100
(12,14) (5,08)
.478 .200
(14,68) (7,62)
.578 .300
= 30 µ" (0,76 µm)
Gold on
–TR
= Tape
& Reel
–04
–06
–08
–10
= Eight Rows
50 µ" (1,27 µm) Ni
A
Contact Resistance: 8.7 mΩ
Working Voltage: 215 VAC
RoHS Compliant: Yes
B
contact area,
Matte Tin on tail
–10
= Ten Rows
(1,27) .050
RECOGNITIONS
For complete scope
of recognitions see
SEAMP/SEAF-RA
Single-Ended Signaling
Differential Pair Signaling
*Test board losses de-embedded from performance data.
Complete test data available at www.samtec.com?SEAMP
or contact sig@samtec.com
Processing: Application tooling and one ton
minimum press required. Contact ATG@samtec.com
for more information.
Rated @ 3dB Insertion Loss*
11 GHz / 22 Gbps
MATED HEIGHTS*
11 GHz / 22 Gbps
(4,60)
.181
www.samtec.com/quality
SEAMPSEAF LEAD STYLE
LEAD
–05.0 –06.0 –06.5
STYLE
(0,59) .023
(1,23)
7 mm 8 mm 8.5 mm
–02.0
(1,78)
.070
No. of positions x
.048
Note: Compliant pin fixture *Processing conditions will
(1,27) .050 - (1,27) .050
affect mated height.
CAT-SEAMP-XX-XX.
Patent Pending.
Mates with:
NO. PINS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
SEAF
SEAMI
11.0
A
K
TR
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAMI
–1
= Tin/Lead
Alloy
Solder
Charge
–L
(0,25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–A
= 10 µ"
= Alignment Pins
–08
Insulator Material:
–40, –50
SEAMI
=Eight Rows
Black LCP
= 85Ω tuned
Contact Material:
Copper Alloy
–K
= Polyimide film
Pick & Place Pad
–10
Operating Temp Range:
=Ten Rows
Testing Now!
No. of positions x
01 (1,27) .050 + (4,98) .196
–2
= Lead-Free
Solder
Plating:
NO. OF
ROWS
A
B
–TR
Au or Sn over
50 µ" (1,27 µm) Ni
Contact
–S
=Tape & Reel
(13,41) (5,08)
.528 .200
Charge
= 30 µ"
–08
–10
Resistance:
(0,76 µm)
Gold on
contact area,
Matte Tin on
solder tail
(15,95) (7,62)
.628 .300
Testing Now!
A
B
Working Voltage:
Testing Now!
MATED HEIGHTS*
RoHS Compliant: Yes
Lead-Free Solderable: Yes
SEAMI SEAF LEAD STYLE
LEAD
08
–05.0 –06.0 –06.5
STYLE
ALSO AVAILABLE
16 mm 17 mm 17.5 mm
(MOQ Required)
–11.0
*Processing conditions will
affect mated height.
• Other plating options
• 20 & 30 pins per row
• 04 & 06 rows
(14,66)
.577
SEAMI/SEAF
16 mm Stack Height
Rated @ 3dB Insertion Loss*
Contact Samtec.
Single-Ended Signaling
Differential Pair Signaling
14 GHz / 28 Gbps
16.5 GHz / 33 Gbps
*Test board losses de-embedded from performance data.
(1,27) .050
No. of positions x
(1,27) .050 + (3,58) .141
(0,86)
.034
(1,12)
.044
DIA
Note: Patented
Complete test data available at www.samtec.com?SEAMI
or contact sig@samtec.com
Note: Some sizes, styles and
options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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