TLE-127-01-G-DV [SAMTEC]
CONN RCPT 2MM 54POS DUAL SMD;
| 型号： | TLE-127-01-G-DV |
| 厂家： | 
SAMTEC |
| 描述： | CONN RCPT 2MM 54POS DUAL SMD |
| 文件： | 总1页 (文件大小：222K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
COST-EFFECTIVE
DUALWIPESOCK
(2.00 mm) .0787" PITCH • TLE/CLT S
8
G
b p s
TLE
NO. PINS
PLATING
OPTION
OPTION
Mates:
TLE
1
01
DV
-
- -
- -
PER ROW
TMMH, TMM, MTMM,
MMT, TW, LTMM, ZLTMM,
TCMD, TSH
02 thru 50
–G
–A
= 10 µ" (0.25 µm)
Gold
= Alignment Pin
(3 positions minimum)
CLT
Mates:
–K
TMM, TMMH, MTMM,
MMT, TW, TSH
= (5.00 mm) .197" DIA
Polyimide Film Pick & Place Pad
(3 positions minimum)
No. of positions x
(2.00) .0787
SPECIFICATIONS
–P
= Metal Pick & Place Pad
(4 positions minimum)
(4.00)
.157
TLE
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
–TR
= Tape & Reel Packaging
(2-37 positions only)
—A Option
—P Option
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating (TLE/TMMH):
3.2 A per pin
-FR
= Full Reel Tape & Reel
(must order maximum
quantity per reel; contact
Samtec for quantity breaks)
(2-37 positions only)
(4.32)
.170
(4.50)
.177
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(2.08 mm) .082" to
(4.37 mm) .172" with
(0.38 mm) .015" wipe,
pass-through, or
(5.51)
.217
(3.35 mm) .132" min
for bottom entry
NO. PINS
LEAD
PLATING
OPTION
OTHER
CLT
1
D
-
- -
- -
PER ROW
STYLE
OPTIONS
CLT
Same as TLE except:
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Current Rating (TMMH/CLT):
4.1 A per pin
All options require
Style –02
02 thru 50
–01
= Through-
hole
–F
= Gold flash
on contact,
(2 pins powered)
–BE
Matte Tin on tail
Insertion Depth:
Top Entry=
= Bottom Entry
–02
= Surface
Mount
(Required for bottom
entry applications)
(1.40 mm) .055" minimum
Bottom Entry=
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
(2.57 mm) .101" minimum
(add board thickness for
correct post OAL)
Max Cycles:
ALSO AVAILABLE
–A
–03
= Through-
hole
= Alignment Pin
(3 positions minimum)
Metal or plastic at
Samtec’s discretion
Other Platings
(MOQ Required)
–G
100 with 10 µ" (0.25 µm) Au
= 10 µ" (0.25 µm)
Gold on contact,
Gold flash on tail
No. of positions x
(2.00) .0787
PROCESSING
–K
= (5.00 mm) .197" DIA
Polyimide Film
(4.00)
.157
TLE
Pick & Place Pad
(04 thru 50 only)
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-26)
(0.15 mm) .006" max (27-50)*
*(.004" stencil solution
may be available; contact
ipg@samtec.com)
(2.13)
.084
–P
= Pick & Place Pad
(4 positions minimum)
(Not always necessary
for auto placement.)
(2.27)
.090
(5.16)
.203
A
CLT
—A Option
—P Option
(3.02)
.119
–TR
Same as TLE except:
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-34)*
(0.20 mm) .008" max (35-50)*
*(.004" stencil solution
may be available; contact
ipg@samtec.com)
–02
= Tape & Reel
(36 positions max)
—01 or —03
–FR
= Full Reel Tape & Reel
(must order maximum
quantity per reel;
contact Samtec for
quantity breaks)
LEAD STYLE
A
–01
–03
(2.16) .085
(2.95) .116
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(36 positions max)
F-221
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.
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