YFS-20-L3-E-05-MSB-K [SAMTEC]
IC Socket, BGA100, 100 Contact(s),;
| 型号： | YFS-20-L3-E-05-MSB-K |
| 厂家： | 
SAMTEC |
| 描述： | IC Socket, BGA100, 100 Contact(s), |
| 文件： | 总2页 (文件大小：801K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISION H
YFS-XX-X3-X-XX-XSB-XX
(No OF POS x .0500[1.270]) + .120[3.05] REF
(No OF POS x .0500[1.270]) + .020[.51] REF
OPTION
-K: KAPTON PAD
(SEE FIG. 2, SHT. 2)
-TR: TAPE & REEL
No OF POSITIONS
-20, -30, -40, -50
DO NOT
SCALE FROM
THIS PRINT
C1
(PER ROW)
((No OF POS -1) x .0500[1.270]))
.035 0.89 REF
SOLDER BALLS
-SB: SOLDER BALL
.0020[.051]
"B"
LEAD STYLE
(USE SDB-030-6337)
-MSB: MODIFIED SOLDER BALL
(USE SDB-030-9653, Pb
-03: PIN / SOLDERBALLS
(USE C-140-03-X, SEE FIG. 1)
-L3: PIN / SOLDERBALLS
(LOW INSERTION FORCE)
(USE C-226-03-X)
*
H
FREE,SEE NOTE 14)
"A" EQ SPACES
@ .0500[1.270]
ROW SPECIFICATION
"B"
REF
.145 3.68
REF
-05: FIVE (USE YFSP-XX-01-F)
-08: EIGHT (USE YFSP-XX-01-E)
-10: TEN (USE YFSP-XX-01-T)
-06: SIX (USE YFSP-XX-01-6)
(AVAILABLE IN 20 POS. ONLY)
-03: THREE (USE YFSP-XX-01-3)
(AVAILABLE IN 20 POS. ONLY)
PLATING SPECIFICATION
-G: GOLD (USE C-XXX-03-G)
(SEE NOTE 7)
-H: HEAVY GOLD (USE C-XXX-03-H)
-E: EXTRA GOLD (USE C-XXX-03-E)
(SEE NOTE 7)
"A"
"A"
02
"B"
01
* = NOT ENGINEERING APPROVED
09 (PIN # = NO. OF ROWS +1)
C-XXX-03-X
YFSP-XX-01-X
SEE NOTE 6
NOTES:
C
1.
REPRESENTS A CRITICAL DIMENSION.
.134±.003 3.41±0.08
2. NOTE DELETED.
3. BURR ALLOWANCE: .0005[0.013] MAX.
4. MINIMUM PUSHOUT FORCE: .5 LB.
5. NOTE DELETED.
.104 2.64
REF
6. CONTACT TO BE FLUSH .002[0.05] RECESSED.
7. ONE REEL MINIMUM PLATING REQUIREMENT
(85,000 CONTACTS PER REEL)
8. ALL DIMS TO BE SYMMETRICAL ABOUT THE
CENTERLINE WITHIN .001[0.03].
9. .0025[0.064] MAX VARIATION BETWEEN
SOLDERBALLS.
'A'
.012 0.31
(SEE NOTE 9)
SECTION "B"-"B"
SECTION "A"-"A"
SDB-030-XXXX
10. REFER TO VISUAL INSPECTION BOARD FOR
SOLDERBALL APPEARANCE CHECKS.
11. THE DISTANCE FROM THE CENTER OF ANY
SOLDERBALL TO THE CENTER OF ANY
ADJACENT INNER PEG SHALL BE
.025 .005[0.64 0.13].
12. SOLDER JOINTS TO BE INSPECTED PER IPC
SPECIFICATION 12.2.12 (IPC-A-610C).
13. NOTE DELETED
14. CONTACT SAMTEC CES DEPARTMENT FOR
PROCESSING INFORMATION.
.095 2.41
REF
H
PROPRIETARY NOTE
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
IN-PROCESS WITHOUT SOLDERBALLS
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
.XX: .01[.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
.XXX: .005[.13]
PHONE: 812-944-6733
FAX: 812-948-5047
.XXXX: .0020[.051]
e-Mail info@SAMTEC.com
code 55322
SHEET SCALE: 2.5:1
DO NOT SCALE DRAWING
DESCRIPTION:
MATERIAL:
.050[1.27] MULTI-ROW SOCKET ASM.
YFS-XX-X3-X-XX-XSB-XX
INSULATOR: LCP, COLOR: BLACK
CONTACT: PHOS BRONZE
DWG. NO.
DETAIL 'A'
SCALE 5 : 1
KEVIN B
4/22/99
SHEET 1 OF 2
BY:
F:\dwg\misc\mktg\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW
PACKAGING VIEWS
REVISION H
-03
FIG. 2
-K: KAPTON PAD OPTION
"R"
"S"
.139 3.541
H
-06
-05
"D" .010[0.25]
"C"
-08
-10
R = (No OF POS x .0500[1.270]) + .020[.51]
S = ("R" - "C" / 2) .020[.51]
F:\dwg\misc\mktg\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
PHONE: 812-944-6733
FAX: 812-948-5047
code 55322
e-Mail info@SAMTEC.com
DESCRIPTION:
DO NOT SCALE DRAWING
SHEET SCALE: 2.5:1
.050[1.27] MULTI-ROW SOCKET ASM.
DWG. NO.
YFS-XX-X3-X-XX-XSB-XX
SHEET 2 OF 2
BY:
KEVIN B
4/22/99
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