SCM1241M [SANKEN]

High Voltage, High Current 3-Phase Motor Drivers;
SCM1241M
型号: SCM1241M
厂家: SANKEN ELECTRIC    SANKEN ELECTRIC
描述:

High Voltage, High Current 3-Phase Motor Drivers

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SCM1240M  
High Voltage, High Current 3-Phase Motor Drivers  
Features and Benefits  
Description  
Each half-bridge circuit consists of a pre-driver circuit that  
is completely independent from the others  
10 to 30 A continuous output IPM in a small-footprint  
package  
Protection against simultaneous high- and low-side turning on  
Bootstrap diodes with series resistors for suppressing  
inrush current are incorporated  
TheSCM1240Minverterpowermodule(IPM)devicesprovide  
a robust, highly-integrated solution for optimally controlling  
3-phase motor power inverter systems and variable speed  
control systems used in energy-conserving designs to drive  
motors of residential and commercial appliances. These ICs  
take 85 to 253 VAC input voltage, and 10 to 30A(continuous)  
output current. They can withstand voltages of up to 600 V  
(IGBT breakdown voltage).  
CMOS compatible input (3.3 to 5 V)  
Designed to minimize simultaneous current through both  
high- and low-side IGBTs by optimizing gate drive resistors  
Integrated Fast Recovery Diode (FRD) as freewheeling  
diode for each IGBT  
UVLO protection with auto restart  
Thermal shutdown (TSD) with auto restart  
The high current SCM1240M employs a new, small-footprint  
proprietary DIP package. The IC itself consists of all of the  
necessary power elements (six IGBTs), pre-drive ICs (three),  
and freewheeling diodes (six), needed to configure the main  
circuit of an inverter, as well as a bootstrap circuit (three  
bootstrap diodes and three boot resistors) as a high-side drive  
power supply. This enables the main circuit of the inverter to  
be configured with fewer external components than traditional  
designs.  
¯¯¯  
Fault (FO indicator) signal output at protection activation:  
UVLO (low side only), OCP, STP, and TSD  
Proprietary power DIP package  
UL Recognized Component (File No.: E118037)  
Applicationsincluderesidentialwhitegoods(homeappliances)  
and commercial appliance motor control, such as:  
Air conditioner compressor motor  
Air conditioner fan motor  
Packages: Power DIP  
Not to scale  
Refrigerator compressor motor  
Washing machine main motor  
Fully molded  
LF 2551  
Heatsink pad  
LF2552  
Functional Block Diagram  
One of three phases  
VB  
HS  
SCM1240M  
VBB  
RB  
BootDi  
MIC  
VCC  
HIN  
FRD  
FRD  
STP  
U,V,W  
LS  
LIN  
COM  
FO  
OCP  
Figure 1. Diagram of one of three phases in the device.  
SCM1240MDS-Rev. 5  
SANKEN ELECTRIC CO., LTD.  
http://www.sanken-ele.co.jp/en/  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
Selection Guide  
Output Current  
IGBT Breakdown  
Voltage, VCES(min)  
(V)  
IGBT Saturation  
Voltage, VCE(sat)(typ)  
(V)  
Continuous,  
IO(max)  
(A)  
Pulsed,  
OP (max)  
(A)  
Part Number  
Package  
Packing  
I
SCM1241M  
SCM1243MF  
SCM1245MF  
SCM1246MF  
Fully Molded  
Heatsink Pad  
Heatsink Pad  
Heatsink Pad  
10 pieces per tube  
10 pieces per tube  
10 pieces per tube  
10 pieces per tube  
600  
600  
600  
600  
1.7  
1.7  
1.7  
1.7  
10  
15  
20  
30  
20  
30  
30  
45  
Absolute Maximum Ratings, valid at TA = 25°C  
Characteristic  
Symbol  
Remarks  
Rating  
450  
500  
600  
20  
Units  
V
Supply Voltage  
VDC  
Between VBB and LS1, LS2, and LS3  
Supply Voltage (Surge)  
IGBT Breakdown Voltage  
Logic Supply Voltage  
Boot-strap Voltage  
VDC(surge) Between VBB and LS1, LS2, and LS3  
V
VCES  
VCC  
VBS  
VCC = 15 V, IC = 1 mA, VIN = 0 V  
Between VCC and COM  
V
V
Between VB and HS (U,V,W)  
20  
V
SCM1241M  
TCase = 25°C  
TCase = 25°C  
10  
Adc  
Adc  
Adc  
Adc  
A
SCM1243MF  
SCM1245MF  
SCM1246MF  
SCM1241M  
15  
Output Current, Continuous  
IO  
T
Case = 25°C  
20  
TCase = 25°C  
30  
Pulse Width 1 ms  
Pulse Width 1 ms  
Pulse Width 1 ms  
Pulse Width 1 ms  
20  
SCM1243MF  
SCM1245MF  
SCM1246MF  
HIN, LIN, and OCP  
30  
A
Output Current, Pulsed  
Input Voltage  
IOP  
30  
A
45  
A
VIN  
–0.5 to 7  
7
V
¯¯¯¯  
¯¯¯¯  
FO Terminal Voltage  
VFO  
Between FO and COM  
SCM1241M  
V
6.0  
°C/W  
SCM1243MF  
SCM1245MF  
SCM1246MF  
R(j-c)Q  
1 element operation (IGBT)  
3.0  
6.5  
4.0  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction-to-Case  
SCM1241M  
SCM1243MF  
SCM1245MF  
SCM1246M  
R(j-c)F  
1 element operation (FRD)  
Case Operating Temperature  
Junction Temperature (IGBT)  
Storage Temperature  
TOPC  
TJ  
–20 to 100  
150  
°C  
°C  
T
stg  
–40 to 150  
2000  
°C  
Isolation Voltage  
Viso  
Between exposed thermal pad and each pin; 1 minute, ac  
Vrms  
All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an  
ambient temperature, TA, of 25°C, unless otherwise stated.  
SCM1240MDS-Rev. 5  
2
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
Recommended Operating Conditions  
Characteristic  
Main Supply Voltage  
Logic Supply Voltage  
Logic Supply Voltage  
Symbol  
Remarks  
Min.  
Typ.  
300  
Max.  
400  
16.5  
16.5  
Units  
V
VDC  
Between VBB and LS  
VCC  
Between VCC and COM  
Between VB and HS  
On pulse  
13.5  
13.5  
0.5  
0.5  
1.0  
V
VBS  
V
tINmin(on)  
tINmin(off)  
tdead  
μs  
μs  
μs  
Minimum Input Pulse Width  
Dead Time*  
Off pulse  
¯¯¯¯  
FO Pull-up Resistor  
RFO  
VFO  
1
22  
5.5  
220  
kΩ  
V
¯¯¯¯  
FO Pull-up Voltage  
3.0  
10  
27  
Bootstrap Capacitor  
Shunt Resistor  
CBOOT  
μF  
mΩ  
SCM1241M  
For IP 20 A  
SCM1243MF  
SCM1245MF For IP 30 A  
SCM1246MF  
RS  
15  
mΩ  
RC Filter Resistor  
RO  
CO  
fC  
100  
2200  
20  
pF  
RC Filter Capacitor  
PWM Carrier Frequency  
Junction Temperature  
kHz  
°C  
TJ  
125  
*Dead Time must be controlled from an external source.  
SCM1240MDS-Rev. 5  
3
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
Typical Application Diagram  
Typical application utilizing one shunt resistor, RS  
(7)  
(8)  
VB1  
HS1  
(31)  
CP  
CBOOT  
CBOOT  
CBOOT  
VCC  
ZD  
RB  
BootDi  
(6)  
CP  
VCC1  
FRD  
FRD  
(5)  
(3)  
(4)  
(1)  
(32)  
(33)  
COM1  
FO1  
U
STP  
LS1  
(2)  
OCP1  
VB2  
MIC  
(15)  
(28)  
(16)  
HS2  
RB  
BootDi  
(14)  
VCC2  
FRD  
FRD  
(13)  
(11)  
Input Logic  
STP  
(29)  
V
M
(12) COM2  
(9)  
FO2  
(30)  
LS2  
(10)  
OCP2  
VB3  
MIC2  
(23)  
(24)  
(25)  
VBB  
HS3  
RB  
BootDi  
(22)  
VCC3  
FRD  
(21)  
(19)  
(20)  
Input Logic  
(26)  
W
COM3  
STP  
(17)  
FO3  
INT  
CS  
VFO  
RFO  
(27)  
LS3  
(18)  
OCP3  
MIC3  
A/D  
RO  
DRS  
RS  
CFO  
CO  
COM  
See application notes on next page.  
SCM1240MDS-Rev. 5  
4
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
Notes for Typical Application Diagram  
To use the OCP circuit shown in the Typical Application drawing,  
an external shunt resistor, RS, is needed. The RS value depends on  
how many low-side IGBTs turn on simultaneously.  
However, the low pass filter causes an additional delay to detecting  
an overcurrent condition of the SCM1240M, and if the total delay  
exceeds 1.7 μs, permanent damage to the SCM1240M may result.  
To suppress noise, connect a resistor, RF, and capacitor, CF, to the  
¯¯¯  
FOx pins. Also, when an overcurrent condition is detected, the  
To avoid malfunction, the wiring between the LS and COM pins  
should be as short as possible.  
¯¯¯  
FOx pin goes low for 25 μs (typ) as an active low fault flag, and  
To prevent surge destruction, put a 0.01 to 1 μF snubber capacitor,  
CS, in parallel with the electrolytic capacitor.  
then returns up to its normal state. It is recommended to connect  
¯¯¯  
the FOx pin directly to an interrupt pin of the external controller, to  
To prevent surge destruction, put a 18 to 20 V Zener diode between  
the VCC and COM pins.  
ensure the 25 μs interval is detected.  
To prevent surge malfunction, put a 0.01 to 0.1 μF ceramic  
capacitor between the VCC and COM pins and the VB and HS  
pins.  
To provide the best thermal shutdown protection (TSD), it is  
¯¯¯  
strongly recommended that the three FOx pins be tied together. In  
this way an overtemperature event (internal temperature rise above  
150°C) in any of the three phases will cause all three phases to shut  
To add an external low pass filter, place RO and CO between the  
A to D pin of the application controller and shunt resistor RS,  
ensuring that the time constant of this low pass filter is less than  
0.2 μs. The internal OCP circuit has a 1.5 μs (min) filtering delay.  
¯¯¯  
down. If the FOx pins are not tied together, but are independently  
pulled up to +5 V, the TSD function for each phase shuts down  
only that phase.  
SCM1240MDS-Rev. 5  
5
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted  
Characteristics  
Logic Supply Voltage  
Symbol  
VCC  
ICC  
Conditions  
Min  
13.5  
Typ  
Max  
16.5  
Units  
V
Between VCC and COM  
Logic Supply Current  
VCC = 15 V, 3 phases operating  
VB – HS = 15 V, one phase operating  
VCC = 15 V, output on  
VCC = 15 V, output off  
VCC = 15 V  
3
mA  
μA  
V
Bootstrap Supply Current  
IBS  
140  
2.0  
1.5  
0.5  
230  
VIH  
2.5  
Input Voltage  
VIL  
1.0  
V
Input Voltage Hysteresis  
Input Current  
VIhys  
IIHH  
V
VCC = 15 V, VIN = 5 V  
500  
2
μA  
μA  
V
IILH  
VCC = 15 V, VIN = 0 V  
UVHL  
UVHH  
UVLL  
UVLH  
VFOL  
VFOH  
VTRIP  
tP  
10.0  
10.5  
10.0  
10.5  
11.0  
11.5  
11.0  
11.5  
12.0  
12.5  
12.0  
12.5  
0.5  
Undervoltage Lock Out (High Side)  
Undervoltage Lock Out (Low Side)  
VCC = 15 V  
V
V
VCC = 15 V  
V
V
¯¯¯¯  
FO Terminal Output Voltage  
VCC = 15 V, VFO = 5 V, RFO = 10 kΩ  
4.8  
0.46  
20  
135  
105  
V
Overcurrent Protection Trip Voltage  
Overcurrent Protection Hold Time  
VCC = 15 V  
VCC = 15 V  
0.50  
25  
0.54  
V
μs  
°C  
°C  
μs  
V
TDH  
150  
120  
1.65  
165  
135  
Overtemperature Protection Activation  
and Releasing Temperature  
VCC = 15 V  
TDL  
Blanking Time  
tblank  
VCES  
ICES  
VCC = 15 V  
IGBT Breakdown Voltage  
IGBT Leakage Current  
VCC = 15 V, IC = 1 mA, VIN = 0 V  
VCC = 15 V, VCE = 600 V, VIN = 0 V  
600  
1
mA  
V
SCM1241M  
VCC = 15 V, IC = 10 A, VIN = 5 V  
1.7  
1.7  
1.7  
1.7  
1.9  
1.75  
1.9  
1.5  
70  
2.2  
2.2  
2.2  
2.2  
2.4  
2.2  
2.4  
2.0  
SCM1243MF VCC = 15 V, IC = 15 A, VIN = 5 V  
V
IGBT Saturation Voltage  
Diode Forward Voltage  
VCE(sat)  
SCM1245MF  
SCM1246MF VCC = 15 V, IC = 30 A, VIN = 5 V  
SCM1241M VCC = 15 V, IF = 10 A, VIN = 0 V  
SCM1243MF VCC = 15 V, IF = 15 A, VIN = 0 V  
SCM1245MF CC = 15 V, IF = 20 A, VIN = 0 V  
V
CC = 15 V, IC = 20 A, VIN = 5 V  
V
V
V
V
VF  
V
V
SCM1246MF VCC = 15 V, IF = 30 A, VIN = 0 V  
IF = IRECOVERY(PEAK) = 100 mA  
VR = 600 V  
V
Diode Recovery Time (Bootstrap)  
Diode Leakage Current (Boot Strap)  
Diode Forward Voltage (Boot Strap)  
Diode Series Resistor (Boot Strap)  
trr  
IIB  
ns  
μA  
V
10  
VFB  
RB  
IF = 0.15 A  
1.1  
22.0  
1.3  
26.4  
17.6  
Ω
Continued on the next page…  
SCM1240MDS-Rev. 5  
6
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted  
Characteristics  
Symbol  
tdH(on)  
trH  
Conditions  
Min  
Typ  
590  
80  
Max  
Units  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
VDC = 300 V, VCC = 15 V, IC = 10 A, inductive  
load; HIN = 05 V or 50 V  
trrH  
SCM1241M  
SCM1243MF  
SCM1245MF  
SCM1246MF  
60  
tdH(off)  
tfH  
tdH(on)  
trH  
550  
90  
600  
70  
VDC = 300 V, VCC = 15 V, IC = 15 A, inductive  
load; HIN = 05 V or 50 V  
trrH  
70  
tdH(off)  
tfH  
tdH(on)  
trH  
620  
60  
High Side Switching Time  
695  
95  
VDC = 300 V, VCC = 15 V, IC = 20 A, inductive  
load; HIN = 05 V or 50 V  
trrH  
75  
tdH(off)  
tfH  
tdH(on)  
trH  
675  
55  
660  
110  
60  
VDC = 300 V, VCC = 15 V, IC = 30 A, inductive  
load; HIN = 05 V or 50 V  
trrH  
tdH(off)  
tfH  
700  
50  
Continued on the next page…  
SCM1240MDS-Rev. 5  
7
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted  
Characteristics  
Symbol  
tdL(on)  
trL  
Conditions  
Min  
Typ  
570  
100  
70  
Max  
Units  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
VDC = 300 V, VCC = 15 V, IC = 10 A, inductive  
load; LIN = 05 V or 50 V  
trrL  
SCM1241M  
SCM1243MF  
SCM1245MF  
SCM1246MF  
tdL(off)  
tfL  
tdL(on)  
trL  
560  
100  
600  
100  
80  
VDC = 300 V, VCC = 15 V, IC = 15 A, inductive  
load; LIN = 05 V or 50 V  
trrL  
tdL(off)  
tfL  
tdL(on)  
trL  
600  
70  
Low Side Switching Time  
715  
135  
115  
670  
50  
VDC = 300 V, VCC = 15 V, IC = 20 A, inductive  
load; LIN = 05 V or 50 V  
trrL  
tdL(off)  
tfL  
tdL(on)  
trL  
660  
150  
70  
VDC = 300 V, VCC = 15 V, IC = 30 A, inductive  
load; LIN = 05 V or 50 V  
trrL  
tdL(off)  
tfL  
690  
50  
VIN  
trr  
t(off)  
t(on)  
td(off)  
tf  
Switching Timing Definitions  
td(on) tr  
90%  
90%  
VCE  
IC  
10%  
10%  
SCM1240MDS-Rev. 5  
8
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
Input-Output Truth Table  
High-side  
MOSFET  
Low-side  
MOSFET  
Mode  
HINx  
LINx  
L
H
L
L
L
Off  
On  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
On  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
Off  
On  
Off  
Off  
Off  
Off  
Off  
Normal1  
H
H
L
H
L
H
L
L
TSD  
OCP  
H
H
L
H
L
H
L
L
H
H
L
H
L
H
L
L
VCCx UVLO2  
VBx UVLO3  
H
H
L
H
L
H
L
L
H
H
L
H
L
H
L
L
¯¯¯¯  
FOx Low  
H
H
H
1In the case where a pair of HINx and LINx signals are asserted at the same time, the shoot-through  
prevention feature sets both the high-side and the low-side IGBTs off.  
2After the VCCx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the high-  
side IGBT (edge trigger). On the other hand, after the UVLO condition is released, the input level of the  
LINx pins reflects the state of the low-side IGBTs (level trigger).  
3After the VBx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the high-  
side IGBT (edge trigger).  
SCM1240MDS-Rev. 5  
9
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
Pin-out Diagram  
25  
24  
33  
Branded Side  
1
(Bottom View)  
Terminal List Table  
Name  
Number  
Function  
¯¯¯¯  
1
U phase fault output for overcurrent and UVLO detected  
Input for U phase overcurrent protection  
Signal input for low-side U phase (active high)  
Supply ground for U phase IC  
FO1  
2
OCP1  
LIN1  
3
4
COM1  
HIN1  
VCC1  
VB1  
5
Signal input for high-side U phase (active high)  
Supply voltage for U phase IC  
6
7
High-side floating supply voltage for U phase  
High-side floating supply ground for U phase  
V phase fault output for overcurrent and UVLO detected  
Input for V phase overcurrent protection  
Signal input for low-side V phase (active high)  
Supply ground for V phase IC  
8
HS1  
¯¯¯¯  
FO2  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
OCP2  
LIN2  
COM2  
HIN2  
VCC2  
VB2  
Signal input for high-side V phase (active high)  
Supply voltage for V phase IC  
High-side floating supply voltage for V phase  
High-side floating supply ground for V phase  
W phase fault output for overcurrent and UVLO detected  
Input for W phase overcurrent protection  
Signal input for low-side W phase (active high)  
Supply ground for W phase IC  
HS2  
¯¯¯¯  
FO3  
OCP3  
LIN3  
COM3  
HIN3  
VCC3  
VB3  
HS3  
VBB  
W
Signal input for high-side W phase (active high)  
Supply voltage for W phase IC  
High-side floating supply voltage for W phase  
High-side floating supply ground for W phase  
Positive DC bus supply voltage  
Output for W phase  
Negative DC bus supply ground for W phase  
(Pin trimmed) positive DC bus supply voltage  
Output for V phase  
LS3  
VBB  
V
Negative DC bus supply ground for V phase  
(Pin trimmed) positive DC bus supply voltage  
Output for U phase  
LS2  
VBB  
U
32  
33  
LS1  
Negative DC bus supply ground for U phase  
SCM1240MDS-Rev. 5  
10  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
Timing Diagrams  
(one phase of three phases)  
High-Side Driver Input/Output and UVLO Protection  
VCC = 15 V  
Low-Side Driver Input/Output and UVLO Protection  
VB – HS = 15 V  
HIN  
LIN  
HIN  
LIN  
UVLH  
UVLL  
UVHH  
UVHL  
VB-HS  
HO  
VCC  
HO  
LO  
LO  
*No FO output at H-side UVLO.  
*HO starts from positive edge after UVLO release.  
FO  
FO  
*LO starts after UVLO release  
Shoot-Through Prevention  
Thermal Shutdown  
V
CC, VB – HS = 15 V  
HIN  
LIN  
HIN  
LIN  
TDH  
TDL  
Tmic  
VCC,  
VB  
HO  
LO  
HO  
LO  
FO  
FO  
Tmic is the temperature of the predriver IC (MIC)  
HO and LO start after TSD release  
*
*
While both HIN and LIN are in high state  
HO and LO turn off and FO signals out.  
*
Overcurrent Protection  
HIN  
LIN  
HO  
LO  
Vtrip  
(0.5 V TYP)  
OCP  
BlankingTime  
(1.65 μs TYP)  
20 μs(min)  
FO  
HO and LO start after OCP release  
*
SCM1240MDS-Rev. 5  
11  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
PACKAGE OUTLINE DRAWING  
0.5  
0.5  
C
C
8 x P5.1 = 40.8  
47 ±0.3  
4.4 ±0.3  
1.2 ±0.2  
+0.5  
2
0
A
A
(5°)  
(Bottom View)  
Branding Area  
A
B
JAPAN  
Two different types of marks  
to be used:  
Mark 1:  
Mark 2:  
(5°)  
B
B
43.3 ±0.3  
2.08 ±0.2  
11.2 ±0.5  
5 x P1.27 = 6.35  
5 x P1.27 = 6.35  
5 x P1.27 = 6.35  
2.57  
1.27  
3.7  
3.24  
1.27  
3.7  
3.7  
1.27  
+0.2  
–0.1  
D
0.6  
+0.2  
–0.1  
2
D
C–C  
B–B  
Pin pitch measured at root  
+0.2  
–0.1  
+0.2  
1.2  
–0.1  
0.7  
(Top View)  
Cu Thermal Pad  
A–A  
D–D  
Branding codes  
(exact appearance at manufacturer discretion):  
Section A, type: SCM124xMF or SCM1241M  
Leadform: 2551 (SCM1241M: Fully molded) or  
2552 (SCM1243MF, SCM1245MF, SCM1246MF:  
Exposed copper thermal pad)  
Dimensions in millimeters  
Section B,  
lot: YMDDT  
Where: Y is the last digit of the year of manufacture  
M is the month (1 to 9, O, N, D)  
DD is the date  
The body shall be clean and shall not bear any stain, rust or flaw.  
The type number and lot number shall be clearly stamped by  
laser on the body so that cannot be erased easily.  
T is the tracking letter (A to Z)  
Device composition complies with the RoHS directive.  
SCM1240MDS-Rev. 5  
12  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
0.5  
0.5  
C
C
8 x P5.1 = 40.8  
47 ±0.3  
4.4 ±0.3  
1.2 ±0.2  
+0.5  
2
0
A
A
(5°)  
(Bottom View)  
Branding Area  
A
B
JAPAN  
Two different types of marks  
to be used:  
Mark 1:  
Mark 2:  
(5°)  
B
43.3 ±0.3  
B
2.08 ±0.2  
14 to 14.8  
5 x P1.27 = 6.35  
5 x P1.27 = 6.35  
5 x P1.27 = 6.35  
2.57  
1.27  
3.7  
3.24  
1.27  
3.7  
3.7  
1.27  
+0.2  
–0.1  
D
0.6  
+0.2  
–0.1  
2
D
C–C  
B–B  
Pin pitch measured at root  
+0.2  
–0.1  
+0.2  
1.2  
–0.1  
0.7  
(Top View)  
Cu Thermal Pad  
A–A  
D–D  
Branding codes  
(exact appearance at manufacturer discretion):  
Section A, type: SCM124xMF or SCM1241M  
Leadform: 2557 (SCM1241M: Fully molded) or  
(SCM1243MF, SCM1245MF, SCM1246MF:  
Exposed copper thermal pad)  
Dimensions in millimeters  
Section B,  
lot: YMDDT  
Where: Y is the last digit of the year of manufacture  
M is the month (1 to 9, O, N, D)  
DD is the date  
The body shall be clean and shall not bear any stain, rust or flaw.  
The type number and lot number shall be clearly stamped by  
laser on the body so that cannot be erased easily.  
T is the tracking letter (A to Z)  
Device composition complies with the RoHS directive.  
SCM1240MDS-Rev. 5  
13  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
0.5  
0.5  
C
C
8 x P5.1 = 40.8  
47 ±0.3  
4.4 ±0.3  
1.2 ±0.2  
+0.5  
2
0
A
A
(5°)  
(Bottom View)  
Branding Area  
A
B
JAPAN  
Two different types of marks  
to be used:  
Mark 1:  
Mark 2:  
(5°)  
B
B
43.3 ±0.3  
2.08 ±0.2  
11.2 ±0.5  
5 x P1.27 = 6.35  
5 x P1.27 = 6.35  
5 x P1.27 = 6.35  
2.57  
1.27  
3.7  
3.24  
1.27  
3.7  
3.7  
1.27  
+0.2  
–0.1  
D
0.6  
+0.2  
–0.1  
2
D
C–C  
B–B  
Pin pitch measured at root  
+0.2  
–0.1  
+0.2  
1.2  
–0.1  
0.7  
(Top View)  
Cu Thermal Pad  
A–A  
D–D  
Branding codes  
(exact appearance at manufacturer discretion):  
Section A, type: SCM124xMF or SCM1241M  
Leadform: 2558 (SCM1241M: Fully molded) or  
(SCM1243MF, SCM1245MF, SCM1246MF:  
Exposed copper thermal pad)  
Dimensions in millimeters  
Section B,  
lot: YMDDT  
Where: Y is the last digit of the year of manufacture  
M is the month (1 to 9, O, N, D)  
DD is the date  
The body shall be clean and shall not bear any stain, rust or flaw.  
The type number and lot number shall be clearly stamped by  
laser on the body so that cannot be erased easily.  
T is the tracking letter (A to Z)  
Device composition complies with the RoHS directive.  
SCM1240MDS-Rev. 5  
14  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
MECHANICAL CHARACTERISTICS  
Characteristic  
Remarks  
Min.  
58.8  
6.0  
0
Typ.  
Max.  
78.4  
8.0  
200  
Units  
N•cm  
kgf•cm  
μm  
Heatsink Mounting Screw Torque  
Flatness of Heatsink Attachment Area  
Package Weight  
Use one M3 screw each end  
Refer to figure below  
SCM1241M  
10.8  
11.8  
g
SCM124xMF  
g
Flatness Measurement Position  
(Top View)  
+ -  
SCM1240MDS-Rev. 5  
15  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
PACKING SPECIFICATION  
Dimensions in millimeters  
ꢀꢁꢂ  
ꢁꢄ  
Tube type SCM-A  
ꢃꢁ  
:
Maximum 10 pieces per tube  
Pins aligned along X direction  
Rubber plug at each end  
ꢀꢁꢂ  
ꢂꢃꢅ  
ꢃꢀꢄ  
Maximum 5 tubes in Y direction  
Maximum 5 tubes in Z direction  
<
Maximum pieces per carton:  
10 pieces per tube  
;
5 rows of tubes  
x 5 layers of tubes  
250 pieces per carton  
SCM1240MDS-Rev. 5  
16  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
WARNING These devices are designed to be operated at lethal voltages and energy levels. Circuit designs  
thatembodythesecomponentsmustconformwithapplicablesafetyrequirements. Precautionsmustbe  
takentopreventaccidentalcontactwithpower-linepotentials. Donotconnectgroundedtestequipment.  
The use of an isolation transformer is recommended during circuit development and breadboarding.  
Because reliability can be affected adversely by improper storage  
environments and handling methods, please observe the following  
cautions.  
Our recommended silicone greases for heat radiation purposes,  
which will not cause any adverse effect on the product life, are  
indicated below:  
Cautions for Storage  
Type  
G746  
Suppliers  
Ensure that storage conditions comply with the standard  
temperature (5°C to 35°C) and the standard relative humidity  
(around 40 to 75%); avoid storage locations that experience  
extreme changes in temperature or humidity.  
Shin-Etsu Chemical Co., Ltd.  
YG6260  
SC102  
Momentive Performance Materials Holding, Inc.  
Dow Corning Toray Silicone Co., Ltd.  
Avoid locations where dust or harmful gases are present and  
avoid direct sunlight.  
Reinspect for rust on leads and solderability of product that has  
been stored for a long time.  
Soldering  
When soldering the product, please be sure to minimize the  
working time, within the following limits:  
Cautions for Testing and Handling  
260±5°C 10 s  
380±5°C 5 s  
When tests are carried out during inspection testing and other  
standard test periods, protect the product from power surges from  
the testing device, shorts between adjacent product packages,  
and shorts to the heatsink.  
Soldering iron should be at a distance of at least 1.5 mm from the  
body of the product  
Electrostatic Discharge  
The screwing torque for attaching a heatsink shall be 58.8 to  
78.4 N•cm (6.0 to 8.0 Kgf•cm).  
Ensure there are no foreign objects between the heatsink and thermal  
When handling the product, operator must be grounded.  
Grounded wrist straps worn should have at least 1 MΩ of  
resistance to ground to prevent shock hazard.  
pad; only silicone thermal grease is allowed.  
Workbenches where the product is handled should be grounded  
and be provided with conductive table and floor mats.  
Remarks About Using Silicone Grease with a Heatsink  
When silicone grease is used in mounting this product with  
a heatsink, grease shall be applied evenly and thinly. If more  
silicone grease than required is applied, it may produce stress.  
When using measuring equipment such as a curve tracer, the  
equipment should be grounded.  
Volatile-type silicone greases may permeate the product and  
produce cracks after long periods of time, resulting in reduced  
heat radiation effect, and possibly shortening the lifetime of the  
product.  
When soldering the product, the head of soldering irons or the  
solder bath must be grounded in other to prevent leak voltages  
generated by them from being applied to the product.  
The product should always be stored and transported in our  
shipping containers or conductive containers, or be wrapped in  
aluminum foil.  
Hard silicone greases may cause cracks in the product when  
screwing the product to a heatsink.  
SCM1240MDS-Rev. 5  
17  
SANKEN ELECTRIC CO., LTD.  
HighVoltage,HighCurrent3-PhaseMotorDrivers  
SCM1240M  
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document  
before use.  
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume  
no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from  
its use.  
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is  
inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any  
possible injury, death, fires or damages to the society due to device failure or malfunction.  
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances,  
office equipment, telecommunication equipment, measuring equipment, etc.).  
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic  
signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose  
electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein.  
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear  
power control systems, life support systems, etc.) is strictly prohibited.  
• In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of  
derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge  
voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage,  
electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor  
devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration.  
In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature  
(TJ) affects the reliability significantly.  
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or  
treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.  
• Anti radioactive ray design is not considered for the products listed herein.  
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network.  
• The contents in this document must not be transcribed or copied without Sanken’s written consent.  
SCM1240MDS-Rev. 5  
18  
SANKEN ELECTRIC CO., LTD.  

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