SI-3000ZD_11 [SANKEN]
Surface-Mount, Low Dropout Voltage; 表面贴装，低压差
| 型号： | SI-3000ZD_11 |
| 厂家： | 
SANKEN ELECTRIC |
| 描述： | Surface-Mount, Low Dropout Voltage |
| 文件： | 总2页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1-1-4 Linear Regulator ICs
SI-3000ZD Series Surface-Mount, Low Dropout Voltage
■Features
■Absolute Maximum Ratings
(Ta=25°C)
• Compact surface-mount package (TO263-5)
Parameter
Symbol
Ratings
Unit
V
*1
DC Input Voltage
VIN
10
• Output current: 3.0A
Output Control Terminal Voltage
DC Output Current
VC
6
V
• Low dropout voltage: VDIF ≤ 0.6V (at IO = 3.0A)
*1
IO
3.0
3
A
*3
•
Low circuit current at output OFF: Iq (OFF) ≤ 1µA
Power Dissipation
PD
W
Junction Temperature
Tj
–30 to +125
–30 to +85
–40 to +125
33.3
°C
• Built-in overcurrent and thermal protection
circuits
Operating Ambient Temperature
Storage Temperature
Top
Tstg
θj-a
θj-c
°C
°C
Thermal Resistance (Junction to Ambient Air)
Thermal Resistance (Junction to Case)
°C/W
°C/W
■Applications
3
• Secondary stabilized power supply (local
power supply)
■Recommended Operating Conditions
Parameter
Symbol
Ratings
*2 to 6*1
Unit
Remarks
Input Voltage
VIN
V
A
Output Current
IO
0 to 3
Operating Ambient Temperature
Operating Junction Temperature
Output Voltage Variable Range
Top (a)
Top (j)
VOADJ
–20 to +85
–20 to +100
1.2 to 5
°C
°C
V
Only for SI-3011ZD. Refer to the block diagram.
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO.
*2: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower (SI-3011ZD).
*3: When mounted on glass-epoxy board of 40 × 40mm (copper laminate area 100%).
■Electrical Characteristics
(Ta=25°C, VC=2V, unless otherwise specified)
Ratings
Parameter
Symbol
SI-3011ZD (Variable type)
SI-3033ZD
typ.
Unit
min.
typ.
1.100
max.
min.
max.
Output Voltage
VO (VADJ)
Conditions
∆VOLINE
Conditions
∆VOLOAD
Conditions
VDIF
1.078
1.122
3.234
3.300
3.366
V
mV
mV
V
(Reference Voltage VADJ for SI-3011ZD)
Line Regulation
VIN=VO+1V, IO=10mA
VIN=5V, IO=10mA
10
40
0.6
1.5
1
10
40
0.6
1.5
1
V
IN=3.3 to 5V, I
O
=10mA (V
O
=2.5V)
VIN=4.5 to 5.5V, IO=10mA
VIN=5V, IO=0 to 3A
Load Regulation
VIN=3.3V, IO=0 to 3A (VO=2.5V)
Dropout Voltage
Conditions
Iq
IO=3A (VO=2.5V)
IO=3A
1
1
Quiescent Circuit Current
Circuit Current at Output OFF
mA
µA
mV/°C
dB
Conditions
Iq (OFF)
Conditions
∆VO/∆Ta
Conditions
RREJ
VIN=VO+1V, IO=0A, VC=2V
VIN=5V, IO=0A, VC=2V
VIN=VO+1V, VC=0V
VIN=5V, VC=0V
Temperature Coefficient
of Output Voltage
±0.3
±0.3
Tj=0 to 100°C
Tj=0 to 100°C
60
60
Ripple Rejection
Conditions
IS1
VIN=VO+1V, f=100 to 120HZ, IO=0.1A
VIN=5V, f=100 to 120HZ, IO=0.1A
*2
3.2
2
3.2
2
Overcurrent Protection Starting Current
A
*4
Conditions
VC, IH
VIN=VO+1V
VIN=5V
*3
Control Voltage (Output ON)
V
*3
Control Voltage (Output OFF)
VC, IL
0.8
0.8
V
C
Control Current(Output ON)
IC, IH
100
100
µA
µA
Terminal
Conditions
IC, IL
VC=2.7V
0
VC=2.7V
0
Control Current(Output OFF)
–5
–5
Conditions
VC=0V
VC=0V
*1: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower.
*2: IS1 is specified at the –5% drop point of output voltage VO under the condition of Output Voltage parameter.
*3: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
*4: These products cannot be used for the following applications because the built-in foldback-type overcurrent protection may cause errors during start-up stage.
(1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) VO adjustment by raising ground voltage
ICs
78
SI-3000ZD Series
■External Dimensions (TO263-5)
(Unit : mm)
Case temperature
measurement point
0.2
10.0
(8.0)
(4.4)
(15°)
0.2
4.5
+0.10
–0.05
1.3
3-R0.3
0.2
(2×R0.45)
(3°)
φ1.5 Dp:
Pin Assignment
q VC
0.15
0.10
(3°)
(3°)
0.2
2.4
(R0.3)
w VIN
e GND (Common to the rear side of product)
0.10
0.25
0.88
(1.7
(R0.3)
0~6°
r VO
(0.5)
0.1
0.1
0.8
(1.7
t Sense
0.8
(1.7
0.25
0.25
0.25
)
(1.7
)
)
)
(ADJ for SI-3011ZD)
1
2
3
4
5
0.2
9.9
(3°)
(3°)
Plastic Mold Package Type
Flammability: UL94V-0
2-R0.3
0.1
0.02
10.0
Product Mass: Approx. 1.48g
■Block Diagram
SI-3011ZD
V
IN
V
O
CIN: Input capacitor (Approx. 10µF)
2
4
5
+
CO: Output capacitor (47µF or larger)
*
R3
R1
C
IN
The output voltage may oscillate if a low ESR type capacitor
(such as a ceramic capacitor) is used for the output capacitor in
the SI-3000ZD Series.
+
+
-
Drive
OCP
REF
ADJ
TSD
CO
AMP1
+
ON/
OFF
-
R2
V
C
1
-
+
3
GND
SI-3033ZD
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2 as shown
at left.
V
IN
V
4
O
2
+
5
CIN
SENSE
The recommended value for R2 is 10kΩ or 11kΩ.
+
+
Drive
OCP
REF
R1= (VO–VADJ) / (VADJ/R2)
-
CO
TSD
AMP1
+
*:Insert R3 in case of setting VO to VO ≤ 1.8V. The recommended
value for R3 is 10kΩ.
ON/
OFF
-
VC
1
-
+
3
GND
■Reference Data
Copper Laminate Area (on Glass-Epoxy Board) vs.
Thermal Resistance (from Junction to Ambient Temperature) (Typical Value)
55
• A higher heat radiation effect can be achieved by enlarging the copper laminate
area connected to the inner frame to which a monolithic IC is mounted.
• Obtaining the junction temperature
50
45
40
35
30
When Using Glass-Epoxy Board of 40 × 40 mm
θ
Measure GND terminal temperature TC with a thermocouple, etc. Then substitute
this value in the following formula to obtain the junction temperature.
Tj=PD×θj–C+TC
PD= (VIN–VO)•IOUT
0
200
400
600
800
1000 1200 1400 1600 1800
Copper Laminate Area (mm2)
ICs
79
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