SID1G10CXM [SANKEN]
Infrared LED,;
| 型号： | SID1G10CXM |
| 厂家： | 
SANKEN ELECTRIC |
| 描述： | Infrared LED, |
| 文件： | 总16页 (文件大小：1175K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LED Data Sheet - SID1G10CXM
SID1G10CXM
● Extenal Shape Type: φ5 Round Type infrared LED
● Lens color : Clear
● Material of a chip : GaAlAs
● Application : Home Appliance, Office Appliance(Factory Automation)
● Feature ：RoHS compliant, Compatible with heat-resistance of lead-free solder.
● Absolute Maximum Ratingsꢀꢀ(Ta=25℃)
Parameter
Forward current
Symbol
IF
Ratings
100
Unit
mA
Remarks
Foward current derating
Pulse forward current
Reverse voltage
⊿IF
IFP
-1.33
mA/℃
mA
25℃ or more
1000
f=1kHz , tw≦100μs
VR
3
V
Operating temperature
Storage temperature
Topr
Tstg
－30～ 85
－30～100
℃
℃
● Electro - optical characteristicsꢀꢀ(Ta=25℃)
Parameter
Forward voltage
Reverse current
Radiant intensity
Peak wavelength
Spectral bandwidth
Directional angle
Symbol
VF
Condition
IF = 50mA
VR=3V
MIN
26
TYP
1.5
MAX
1.8
Unit
V
IR
10
μA
mW/Sr
nm
Ie
IF = 50mA
IF = 50mA
IF = 50mA
IF = 50mA
45
850
40
λp
⊿λ
2θ1/2
nm
36
deg.
Radiant intensity rangeꢀ(Ta=25℃)
Rank
B
Radiant intensity range (mW/Sr)
26
35
47
63
～
～
～
～
54
70
94
C
D
E
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LED Data Sheet - SID1G10CXM
● Characteristic data
IF-VF
Ie-ＩF
10
1
100
10
0.1
0.01
1
1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
1
10
100
ＶＦ ［Ｖ］
ＩＦ ［ｍＡ］
Spectrum
IFmax-Ta
1.2
110
100
90
80
70
60
50
40
30
20
10
0
1.0
0.8
0.6
0.4
0.2
0.0
0
10 20 30 40 50 60 70 80 90
600
700
800
900 1000 1100 1200
Ta ［℃］
λ [nm]
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LED Data Sheet - SID1G10CXM
Ie-Ta
VF-Ta
2.0
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.5
1.0
0.5
0.0
-30 -10
10
30
50
70
90
-30 -10
10
30
50
70
90
Ambient Temperature Ta[℃]
Ambient Temperature Ta[℃]
Directional angle
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LED Data Sheet - SID1G10CXM
● SID1G10CXM Series
Outline dimensions
(Unit:mm)
Material & Finish of leads
Terminal:
①Anode
②Cathode
Material Fe + Under Plating
Finish
Splder(Sn-3.0Ag-0.5Cu)
Tolerance: ±0.3
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LED Data Sheet - SID1G10CXM
● Note
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature.
The glass transition temperature of epoxy resin used for the LED is approximately 120 ~ 130℃.
At a temperature exceeding this limit, the coefficient of linear expansion of the resin doubles or
more comparedto that at normal temperature and the resin is softened.
If external force or stress is applied at that time, the terminal will move and it may cause a
wire rupture.
Please be careful about the following when soldering.
After soldering, avoid applying external force, stress, and excessive vibration during cooling process
until the LEDs cool down to normal temperature.(Same for products with terminal leads)
ꢀꢀ①Soldering measurements:
ꢀꢀ Distance between melted solder side to bottom of resin shall be 4.0 mm or longer .
ꢀꢀ②Solder dip: Preheat: 90℃ max. (Backside of PCB), Within 120 seconds
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ Solder bath: 250℃ max. (Solder temperature), Within 5 seconds
ꢀꢀ③Soldering iron: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds
When SMD components are used on the same PCB, mount the LED after adhesive baking process
since theresin used for the LED has a low heat resistance.
In case the adhesive baking is operated after the LED is mounted for a manufacturing process
reason, make surenot to apply external force, stress, and excessive vibration to the LED and follow
the conditions below.
ꢀꢀꢀBaking temperature: 120℃ max. Baking time: Within 60 seconds
When operating sequential soldering after the adhesive baking, perform the soldering after
the LED cools down to normal temperature.
Pitch of the LED leads and pitch of mounting holes need to be the same.
Recommend following PCB for contact mount LEDs.
Recommended PCB : Single-faced PCBs with thickness 1.6mm & holes diameter φ1.0 to 1.1mm
φ1，1
Do not use through holes type when using double-faced PCBs.
When doing the automatic insertion,maximize the clinch angle on the anode side
of the LED so excessive remain force won'thappen.
(2.54)
(Unit:mm)
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LED Data Sheet - SID1G10CXM
● Reliability test
Test Items
EIAJ ED-4701
Test Conditions
Ta=RT , Ifmax
Life
Steady state operating life
Hight temperature storage
-
Tests
t=1000h
201
Ta=Tstgmax
t=1000h
202
103
Low temperature storage
Moisture Resistance
Temperature cycle
Soldering heat
Ta=Tstgmin
t=1000h
Environ
-mental
Tests
Ta=60±5℃ , RH=90±5%
t=1000h
105
Tstgmin(30min)～Tstgmax(30min)
100cycles
301/302
303
T=260±5℃ , t=10s , 1time
Solderraibirity
T=245±5℃ , t=5±1s,1time
Using flux for Pb free solder
Loading weight 10N
ｔ=10s
401
Terminal strength(pull)
Terminal strength(bend)
Drop
401
Loading weight 5N
0 →ꢀ90°→ꢀ0
-
H=1m ,
Drop on maple board.
● Mesurement Item and Criterion Judge Failure
No
1
Mesurement Item
Forward Voltage
Mark
VF
Criterion Judge Failure
OK≦V.F.S.×±20%
2
3
IR
Ie
Reverse Current
Radiant Intensity
OK≦U.S.L.×2.0
OK≧I.V.S.×0.5
*Solderability …ꢀThe Lead shall be covered by solder at least 95%.
Mesurement cnditions is based on specifications.
Tstgmax and Tstgmin is abosolute maximum ratings.
IFmax and IFPmax is absolute maximum ratings,
U.S.L. is upper limit of standard.
V.F.S. is Initial data of VF.
I.V.S. is Initial data of Luminous Intensity.
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LED Data Sheet - SID1G10CXM
● Packing specificatins
Smallest packing
Packing material : Individual vinyl bag
Quantity(Minimum Order Quantity)
:500pcs
Label : Label of below in the bag
Label
Means Pb Free
P
PART NUMBER
Lot No
8
4 16 * *
① ② ③ ④
⑤
① Last digit of year
② Month
January～September→Arabic Numeral
October →X、November→Y、December→Z
③ Day
④ Radiant intensity rank
⑤ Quantity(Minimum Order Quantity)
：500pcs
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LED Data Sheet - SID1G10CXM
● Taping specification for taped parts
Perforation and part number identification shall be placed as shown in the below.
As to the direction of feed, cathode shall come first.
Dimensions
A
54.5
B
C
365
335
Thickness
3.0
(Unit:mm)
Quantity(Minimum Order Quantity)
: 2500pcs
Label
① Last digit of year
② Month
January～September→Arabic Numeral
October →X、November→Y、December→Z
③ Day
④ Radiant intensity rank
⑤ Quantity(Minimum Order Quantity)
：2５00pcs
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LED Data Sheet - SID1G10CXM
●
Taping specification
1.Forming type
2. Straight type
(Unit:mm)
Series
Forming type
Taping name
H1 Size
TP1
4.5
○
TP2
7.5
○
TP3
6.0
○
TP6
3.5
○
TP7
5.0
○
TP8
9.0
○
SID1G10CXM
Series
Taping name
H0 Size
Straight type
TP４
17.0
×
TP５
20.5
×
TP15
20.0
×
TP16
19.0
×
TP17
23.5
×
TP18
25.0
×
SID1010XM
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LED Data Sheet - SID1G10CXM
● TP1 Outline dimensions
(Unit:mm)
(Po):Accumulation pitch tolerance shall not exceed ±1.0mm over 20 consecutive pitches.
Terminal:
①Anode
②Cathode
Tolerance: ±0.3
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LED Data Sheet - SID1G10CXM
● TP2 Outline dimensions
(Unit:mm)
(Po):Accumulation pitch tolerance shall not exceed ±1.0mm over 20 consecutive pitches.
Terminal:
①Anode
②Cathode
Tolerance: ±0.3
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LED Data Sheet - SID1G10CXM
● TP3 Outline dimensions
(Unit:mm)
(Po):Accumulation pitch tolerance shall not exceed ±1.0mm over 20 consecutive pitches.
Terminal:
①Anode
②Cathode
Tolerance: ±0.3
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LED Data Sheet - SID1G10CXM
● TP6 Outline dimensions
(Unit:mm)
(Po):Accumulation pitch tolerance shall not exceed ±1.0mm over 20 consecutive pitches.
Terminal:
①Anode
②Cathode
Tolerance: ±0.3
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LED Data Sheet - SID1G10CXM
● TP7 Outline dimensions
(Unit:mm)
(Po):Accumulation pitch tolerance shall not exceed ±1.0mm over 20 consecutive pitches.
Terminal:
①Anode
②Cathode
Tolerance: ±0.3
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LED Data Sheet - SID1G10CXM
● TP8 Outline dimensions
(Unit:mm)
(Po):Accumulation pitch tolerance shall not exceed ±1.0mm over 20 consecutive pitches.
Terminal:
①Anode
②Cathode
Tolerance: ±0.3
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LED Data Sheet - SID1G10CXM
Important Notes
●All data, illustrations, graphs, tables and any other information included in this document as to Sanken’s products listed herein (the
“Sanken Products”) are current as of the date this document is issued. All contents in this document are subject to any change
without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative that
the contents set forth in this document reflect the latest revisions before use.
●The Sanken Products are intended for use as components of electronic equipment or apparatus (transportation equipment and its
control systems, home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the
Sanken Products, please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and
return them to Sanken. If considering use of the Sanken Products for any applications that require higher reliability (traffic signal
control systems or equipment, disaster/crime alarm systems, etc.), you must contact a Sanken sales representative to discuss the
suitability of such use and put your signature, or affix your name and seal, on the specification documents of the Sanken Products and
return them to Sanken, prior to the use of the Sanken Products. The Sanken Products are not intended for use in any applications that
require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems,
whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in Class III or a higher class as defined
by relevant laws of Japan (collectively, the “Specific Applications”). Sanken assumes no liability or responsibility whatsoever for any
and all damages and losses that may be suffered by you, users or any third party, resulting from the use of the Sanken Products in the
Specific Applications or in manner not in compliance with the instructions set forth herein.
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