TFA107(I) [SANKEN]

Silicon Controlled Rectifier, 15.7A I(T)RMS, 700V V(DRM), 1 Element, TO-220AB, ROHS COMPLIANT, PLASTIC, TO-220F, FM20, SIP-3;
TFA107(I)
型号: TFA107(I)
厂家: SANKEN ELECTRIC    SANKEN ELECTRIC
描述:

Silicon Controlled Rectifier, 15.7A I(T)RMS, 700V V(DRM), 1 Element, TO-220AB, ROHS COMPLIANT, PLASTIC, TO-220F, FM20, SIP-3

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TFA10x Series  
Reverse Blocking Triode Thyristor  
Features and Benefits  
Description  
Exceptional reliability  
This Sanken reverse blocking triode thyristor is designed for  
AC power control, providing reliable, uniform switching for  
half-cycle AC applications.  
Small fully-molded SIP package with heatsink mounting  
for high thermal dissipation and long life  
Operating junction temperature to 150°C  
VDRM of 700 or 800 V  
15.7 ARMS on-state current  
7 mA typical gate trigger current  
Uniform switching  
In comparison with other products on the market, the TFA10x  
series provides increased isolation voltage (1800 VACRMS),  
guaranteed for up to 1 minute. In addition, commutation  
dv/dt is improved.  
UL Recognized Component (File No.: E118037) (suffix I)  
Applications  
Package: 3-pin SIP (TO-220F)  
Motor control for small tools  
Temperature control, light dimmers, electric blankets  
General use switching mode power supplies (SMPS)  
Not to scale  
Typical Applications  
M
Single-phase motor control (for example, electric tool)  
In-rush current control (for example, SMPS)  
28105.04  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
Selection Guide  
Part Number  
VDRM  
(V)  
UL-Recognized  
Component  
Package  
Packing  
TFA107(I)  
TFA107S  
TFA108(I)  
TFA108S  
700  
700  
800  
800  
Yes  
Yes  
3-pin fully molded SIP with  
heatsink mount  
50 pieces per tube  
Absolute Maximum Ratings  
Characteristic  
Symbol  
Notes  
Rating  
700  
Units  
V
V
V
TFA107x  
Peak Repetitive Off-State Voltage  
VDRM  
TJ = –40°C to 150°C, RGREF = 1 kΩ  
800  
TFA108x  
Isolation Voltage  
VISO  
IT(AV)  
AC RMS applied for 1 minute between lead and case  
1800  
50 Hz half cycle sine wave, Conduction angle (α) = 180°,  
continuous operation, TC = 86°C  
Average On-State Current  
RMS On-State Current  
10.0  
A
IT(RMS)  
15.7  
176  
A
A
f = 60 Hz  
Surge On-State Current  
I2t Value for Fusing  
ITSM  
Half cycle sine wave, single, non-repetitive  
f = 50 Hz  
160  
128  
A
I2t  
Value for 50 Hz half cycle sine wave, 1 cycle, ITSM = 160 A  
A2s  
IT = IT(RMS) × π, VD = VDRM × 0.5, f 60 Hz, tgw 10 μs, tgr 250  
ns, igp 30 mA (refer to Gate Trigger Circuit diagram)  
Critical Rising Rate of On-State Current  
di/dt  
50  
A/μs  
Peak Forward Gate Current  
Peak Forward Gate Voltage  
Peak Reverse Gate Current  
Peak Gate Power Dissipation  
Average Gate Power Dissipation  
Junction Temperature  
IFGM  
VFGM  
VRGM  
PGM  
f 50 Hz, duty cycle 10%  
f 50 Hz, duty cycle 10%  
f 50 Hz  
2.0  
10  
A
V
5.0  
V
f 50 Hz, duty cycle 10%  
TJ < TJ(max)  
5.0  
W
W
ºC  
ºC  
PGM(AV)  
TJ  
0.5  
–40 to 150  
–40 to 150  
Storage Temperature  
T
stg  
Thermal Characteristics May require derating at maximum conditions  
Characteristic  
Symbol  
Test Conditions  
Value  
Units  
Package Thermal Resistance  
(Junction to Case)  
RθJC  
For AC  
3.4  
ºC/W  
Pin-out Diagram  
A
K
Terminal List Table  
Number  
Name  
Function  
1
2
3
A
K
G
Anode terminal  
Cathode terminal  
Gate control  
G
All performance characteristics given are typical values for circuit or  
system baseline design only and are at the nominal operating voltage and  
an ambient temperature, TA, of 25°C, unless otherwise stated.  
1
2 3  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
2
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
ELECTRICAL CHARACTERISTICS  
Characteristics  
Off-State Leakage Current  
Reverse Leakage Current  
On-State Voltage  
Symbol  
IDRM  
IRRM  
VTM  
VGT  
IGT  
Test Conditions  
VD = VDRM, TJ = 150°C, RGREF = 1 kꢀ  
VD = VDRM, TJ = 150°C, RGREF = 1 kꢀ  
ITM = 20 A, TC = 25°C  
Min.  
Typ.  
Max.  
2.0  
2.0  
1.35  
1.0  
15  
Unit  
mA  
mA  
V
Gate Trigger Voltage  
Gate Trigger Current  
Gate Non-trigger Voltage  
Holding Current  
VD = 6 V, RL = 10 , TC = 25°C  
VD = 6 V, RL = 10 , TC = 25°C  
VD = VDRM ×0.5, RGREF = 1 k, TJ = 125°C  
RGREF = 1 k, TJ = 25°C  
V
7
mA  
V
VGD  
IH  
0.2  
20  
mA  
Critical Rising Rate of  
Off-State Voltage  
VD = VDRM ×0.5, TJ = 125°C, RGREF = 1 k,  
CGREF = 0.033 μF  
dv/dt  
300  
V/μs  
Test Circuit 1  
Voltage-Current Characteristic  
IF  
ITM  
A
K
VTM  
(On state)  
RGREF  
VRRM  
G
IH  
VR  
IDRM  
VF  
CGREF  
IRRM  
(Off state)  
VTM  
VDRM  
Gate Trigger Current  
IR  
tgr  
igp  
tgw  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
3
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
Commutation Timing Diagrams  
Q4  
Supply VAC  
Q
A
A = Conduction angle  
VGT  
VGATE  
Q
ITSM  
On-State  
Currrent  
Q
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
4
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
Performance Characteristics at TA = 25°C  
200  
180  
160  
140  
120  
100  
80  
100  
10  
1
TJ = 150°C  
Surge On-State  
Current versus  
Quantity of  
Cycles  
Maximum On-State  
Current versus  
Maximum On-State  
Voltage  
TJ = 25°C  
60  
40  
20  
0
0
1
10  
100  
0.6  
1.0  
1.4  
1.8  
V
2.2  
T (max) (V)  
2.6  
3.0  
3.4  
Quantity of Cycles  
16  
14  
12  
10  
8
200  
180  
160  
140  
120  
100  
80  
Half cycle sine wave  
Half cycle sine wave  
A = 180°  
A = 120°  
Maximum Allowable  
Case Temperature  
versus Average  
A = 90°  
A = 60°  
Maximum Average  
Power Dissipation  
versus Average  
On-State Current  
A = 30°  
On-State Current  
6
A = 30°  
A = 60°  
A = 90°  
60  
A = 120°  
A = 180°  
4
40  
2
20  
0
0
0
2
4
6
8
10  
12  
14  
0
2
4
6
8
10  
12  
14  
IT(AV) (A)  
IT(AV) (A)  
2
100  
10  
IGM = 2 A  
VGM = 10 V  
PGM  
= 5 W  
Typical Gate  
Trigger Voltage  
versus  
Junction Temperature  
at VD = 6 V  
Gate Voltage  
versus  
Gate Current  
VGT (–40°C)  
= 1.5 V  
1
PG(AV)  
= 0.5 W  
VGT (25°C)  
= 1 V  
1
and RL = 10 Ω  
IGT (–40°C)  
= 30 mA  
IGT (25°C) = 15 mA  
VGD (125°C)= 0.2 V  
0.1  
0
10  
100  
1000  
10 000  
–60  
–20  
20  
60  
100  
140  
IG (mA)  
TJ (°C)  
100  
10  
1
100  
R
= 10 kΩ  
GREF  
10  
1
Typical Gate  
Trigger Current  
versus  
Junction Temperature  
at VD = 6 V  
Typical  
Holding Current  
versus  
Junction Temperature  
at RGREF = 10 kΩ  
and RL = 10 Ω  
0.1  
–60  
0.1  
–60  
–20  
20  
60  
100  
140  
–20  
20  
60  
100  
140  
TJ (°C)  
TJ (°C)  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
5
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
Transient Thermal Impedence versus Voltage Pulse Duration  
For AC  
10  
1
0.1  
1
10  
100  
1000  
10 000  
100 000  
QT (ms)  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
6
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
TO-220F Package Outline Drawing  
4.2 ±0.2  
2.8 ±0.2  
10.0 ±0.2  
0.5 ±0.1 × 45°  
Ø3.3 ±0.2  
Branding  
Area  
XXXXXXXX  
XXXXX  
2.6 ±0.1  
2.2 ±0.2  
1.35 ±0.15  
1.35 ±0.15  
+0.2  
–0.1  
0.45  
+0.2  
–0.1  
0.85  
View A  
View B  
2.54 ±0.1  
Terminal dimension at lead tips  
1
2
3
0.7 MAX  
0.7 MAX  
View A  
View B  
Gate burr: 0.3 mm (max.), mold flash may appear at opposite side  
Terminal core material: Cu  
Branding codes (exact appearance at manufacturer discretion):  
1st line, type: FA10xx  
Terminal treatment: Ni plating and Pb-free solder dip  
Leadform: 600  
2nd line, lot:  
YM  
Where: Y is the last digit of the year of manufacture  
Package: TO-220F (FM20)  
M is the month (1 to 9, O, N, D)  
Dimensions in millimeters  
Leadframe plating Pb-free. Device  
meets RoHS requirements.  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
7
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
Packing Specification  
Tube Packing  
530  
7
35  
540  
110  
172  
50 pieces per tube  
25 tubes per layer  
3 layers per carton  
3750 pieces per outer carton  
Dimensions in mm  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
8
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
Bulk Packing  
165  
430  
175  
36  
405  
123  
200 pieces per tray  
5 trays per inner carton  
4 inner cartons per outer carton  
4000 pieces maximum per outer carton  
Dimensions in millimeters  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
9
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
WARNING These devices are designed to be operated at lethal voltages and energy levels. Circuit designs  
thatembodythesecomponentsmustconformwithapplicablesafetyrequirements. Precautionsmustbe  
takentopreventaccidentalcontactwithpower-linepotentials. Donotconnectgroundedtestequipment.  
The use of an isolation transformer is recommended during circuit development and breadboarding.  
Because reliability can be affected adversely by improper storage  
Heatsink Mounting Method  
environments and handling methods, please observe the following  
cautions.  
Cautions for Storage  
Torque When Tightening Mounting Screws. Thermal resistance  
increases when tightening torque is low, and radiation effects are  
decreased. When the torque is too high, the screw can strip, the  
heatsink can be deformed, and distortion can arise in the product frame.  
To avoid these problems, observe the recommended tightening torques  
for this product package type 0.490 to 0.686 N•m (5 to 7 kgf•cm).  
Ensure that storage conditions comply with the standard  
temperature (5°C to 35°C) and the standard relative humidity  
(around 40 to 75%); avoid storage locations that experience  
extreme changes in temperature or humidity.  
Avoid locations where dust or harmful gases are present and  
avoid direct sunlight.  
Reinspect for rust on leads and solderability of products that have  
been stored for a long time.  
Diameter of Heatsink Hole: < 4 mm. The deection of the press mold  
when making the hole may cause the case material to crack at the joint  
with the heatsink. Please pay special attention for this effect.  
Soldering  
Cautions for Testing and Handling  
When tests are carried out during inspection testing and other  
standard test periods, protect the products from power surges  
from the testing device, shorts between adjacent products, and  
shorts to the heatsink.  
When soldering the products, please be sure to minimize the  
working time, within the following limits:  
260±5°C 10 s  
Remarks About Using Silicone Grease with a Heatsink  
350±5°C 3 s  
When silicone grease is used in mounting this product on a  
heatsink, it shall be applied evenly and thinly. If more silicone  
grease than required is applied, it may produce stress.  
Coat the back surface of the product and both surfaces of the  
insulating plate to improve heat transfer between the product and  
the heatsink.  
Volatile-type silicone greases may permeate the product and  
produce cracks after long periods of time, resulting in reduced  
heat radiation effect, and possibly shortening the lifetime of the  
product.  
Our recommended silicone greases for heat radiation purposes,  
which will not cause any adverse effect on the product life, are  
indicated below:  
Soldering iron should be at a distance of at least 1.5 mm from the  
body of the products  
Electrostatic Discharge  
When handling the products, operator must be grounded.  
Grounded wrist straps worn should have at least 1 Mof  
resistance to ground to prevent shock hazard.  
Workbenches where the products are handled should be  
grounded and be provided with conductive table and floor mats.  
When using measuring equipment such as a curve tracer, the  
equipment should be grounded.  
When soldering the products, the head of soldering irons or the  
solder bath must be grounded in other to prevent leak voltages  
generated by them from being applied to the products.  
Type  
G746  
Suppliers  
Shin-Etsu Chemical Co., Ltd.  
Momentive Performance Materials  
Dow Corning Toray Silicone Co., Ltd.  
The products should always be stored and transported in our  
shipping containers or conductive containers, or be wrapped in  
aluminum foil.  
YG6260  
SC102  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
10  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.  
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit im-  
provements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this  
publication is current before placing any order.  
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users  
responsibility.  
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at  
a certain rate is inevitable.  
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems  
against any possible injury, death, fires or damages to society due to device failure or malfunction.  
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus  
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation  
hardness assurance (e.g., aerospace equipment) is not supported.  
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems  
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written con-  
firmation of your specifications.  
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equip-  
ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.  
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given  
for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or  
any other rights of Sanken or Allegro or any third party that may result from its use.  
Anti radioactive ray design is not considered for the products listed herein.  
Copyright © 2008-2009 Allegro MicroSystems, Inc.  
This datasheet is based on Sanken datasheet SSE-24051  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
11  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
TFA10x  
Series  
Reverse Blocking Triode Thyristor  
Worldwide Contacts  
Asia-Pacific  
China  
Singapore  
Sanken Electric Singapore Pte. Ltd.  
150 Beach Road, #14-03 The Gateway West  
Singapore 189720  
Sanken Electric Hong Kong Co., Ltd.  
Suite 1026, Ocean Centre  
Canton Road, Tsimshatsui  
Tel: 65-6291-4755, Fax: 65-6297-1744  
Kowloon, Hong Kong  
Tel: 852-2735-5262, Fax: 852-2735-5494  
Europe  
Sanken Power Systems (UK) Limited  
Pencoed Technology Park  
Pencoed, Bridgend CF35 5HY, United Kingdom  
Tel: 44-1656-869-100, Fax: 44-1656-869-162  
Sanken Electric (Shanghai) Co., Ltd.  
Room 3202, Maxdo Centre  
Xingyi Road 8, Changning District  
Shanghai, China  
Tel: 86-21-5208-1177, Fax: 86-21-5208-1757  
North America  
United States  
Taiwan Sanken Electric Co., Ltd.  
Room 1801, 18th Floor  
88 Jung Shiau East Road, Sec. 2  
Taipei 100, Taiwan R.O.C.  
Tel: 886-2-2356-8161, Fax: 886-2-2356-8261  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01606, U.S.A.  
Tel: 1-508-853-5000, Fax: 1-508-853-7895  
Japan  
Sanken Electric Co., Ltd.  
Overseas Sales Headquarters  
Metropolitan Plaza Building  
1-11-1 Nishi-Ikebukuro, Toshima-ku  
Tokyo 171-0021, Japan  
Allegro MicroSystems, Inc.  
14 Hughes Street, Suite B105  
Irvine, California 92618, U.S.A.  
Tel: 1-949-460-2003, Fax: 1-949-460-7837  
Tel: 81-3-3986-6164, Fax: 81-3-3986-8637  
Korea  
Sanken Electric Korea Co., Ltd.  
Samsung Life Yeouido Building 16F  
23-10, Yeouido-Dong, Yeongdeungpo-gu  
Seoul 150-734, Korea  
Tel: 82-2-714-3700, Fax: 82-2-3272-2145  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
12  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  

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