TMA254B-L [SANKEN]
Triac (Bidirectional Triode Thyristor); 三端双向可控硅(双向晶闸管)型号: | TMA254B-L |
厂家: | SANKEN ELECTRIC |
描述: | Triac (Bidirectional Triode Thyristor) |
文件: | 总12页 (文件大小:281K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TMA25x Series
Triac (Bidirectional Triode Thyristor)
Features and Benefits
Description
▪ Exceptional reliability
This Sanken triac (bidirectional triode thyristor) is designed
▪ Small fully-molded SIP package with heatsink mounting
for high thermal dissipation and long life
▪ VDRM of 400 or 600 V
for AC power control, providing reliable, uniform switching
for full-cycle AC applications.
▪ 25 ARMS on-state current
▪ Uniform switching
▪ UL Recognized Component (File No.: E118037) (suffix I)
In comparison with other products on the market, theTMA25x
series provides increased isolation voltage (2000 VACRMS),
guaranteed for up to 1 minute, and greater peak nonrepetitive
off-state voltage, VDSM (700 V). In addition, commutation
dv/dt and (dv/dt)c are improved.
Applications
Package: 3-pin SIP (TO-3PF)
▪ Residential and commercial appliances: vacuum cleaners,
rice cookers, TVs, home entertainment
▪ White goods: washing machines
▪ Office automation power control, photocopiers
▪ Motor control for small tools
▪ Temperature control, light dimmers, electric blankets
▪ General use switching mode power supplies (SMPS)
Not to scale
Typical Applications
Halogen
Lamp
Gate
Controller
Heater control
(for example, LBP. PPC, MFP)
Two-phase motor control
(for example, washing machine)
In-rush current control
(for example, SMPS)
28105.09
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
Selection Guide
Part Number
VDRM
(V)
UL-Recognized
Component
Package
Packing
TMA254B(I)
TMA254B-L
TMA256B(I)
TMA256B-L
400
400
600
600
Yes
–
Yes
–
3-pin fully molded SIP with
heatsink mount
30 pieces per tube
Absolute Maximum Ratings
Characteristic
Symbol
Notes
Rating
400
Units
V
V
V
V
V
TMA254Bx
Peak Repetitive Off-State Voltage
VDRM
RGREF
=
=
∞
∞
600
TMA256Bx
TMA254Bx
TMA256Bx
500
Peak Non-Repetitive Off-State Voltage
Isolation Voltage
VDSM
VISO
IT(RMS)
RGREF
700
AC RMS applied for 1 minute between lead and case
2000
50/60 Hz full cycle sine wave,
total Conduction angle (α+) + (α–) = 360°,
TC = 83°C
RMS On-State Current
Surge On-State Current
25
A
A
f = 60 Hz
263
Full cycle sine wave, peak value, non-repetitive,
initial TJ = 125°C
ITSM
f = 50 Hz
250
312
A
I2t Value for Fusing
I2t
Value for 50 Hz half cycle sine wave, 1 cycle, ITSM = 250 A
A2•s
IT = IT(RMS) × √2, VD = VDRM × 0.5, f ≤ 60 Hz, tgw ≥ 100 μs,
tgr ≤ 250 ns, Igp ≥ 60 mA
Critical Rising Rate of On-State Current
di/dt
25
A/μs
Peak Gate Current
IGM
PGM
f ≥ 50 Hz, duty cycle ≤ 10%
f ≥ 50 Hz, duty cycle ≤ 10%
TJ < TJ(max)
2
5
A
W
W
Peak Gate Power Dissipation
Average Gate Power Dissipation
Junction Temperature
0.5
PGM(AV)
TJ
–40 to 125
–40 to 125
ºC
ºC
Storage Temperature
T
stg
Thermal Characteristics May require derating at maximum conditions
Characteristic
Symbol
Test Conditions
Value
Units
Package Thermal Resistance
(Junction to Case)
RθJC
For AC
1.5
ºC/W
Pin-out Diagram
T2
T1
Terminal List Table
Number
Name
T1
Function
1
2
3
Main terminal, gate referenced
Main terminal connect to signal side
Gate control
G
T2
G
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
1
2
3
Allegro MicroSystems, Inc.
115 Northeast Cutoff
2
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
ELECTRICAL CHARACTERISTICS
Characteristics
Off-State Leakage Current
On-State Voltage
Symbol
Test Conditions
Min.
–
Typ.
–
Max.
2.0
100
1.4
1.5
1.5
1.5
30
Unit
mA
μA
V
VD = VDRM, TJ = 125°C, RGREF using test circuit 1
=
∞
IDRM
–
–
VD = VDRM, TJ = 25°C, RGREF
IT = 20 A, TJ = 25°C
=
using test circuit 1
∞
VTM
–
–
Quadrant I: T2+, G+
–
–
V
Gate Trigger Voltage
VGT
Quadrant II: T2+, G– VD = 12 V, RL = 20 Ω, TJ = 25°C
Quadrant III: T2–, G–
–
–
V
–
–
V
Quadrant I: T2+, G+
–
–
mA
mA
mA
V
Gate Trigger Current
IGT
Quadrant II: T2+, G– VD = 12 V, RL = 20 Ω, TJ = 25°C
Quadrant III: T2–, G–
–
–
30
–
–
30
Gate Non-trigger Voltage
VGD
VD = VDRM ×0.5, RL = 4 kΩ, TJ = 125°C
0.2
–
–
Critical Rising Rate of
Off-State Voltage during
Commutation*
(dv/dt)c TJ = 125°C, VD = 400 V, (di/dt)c = –12 A/ms, ITP = 2 A
15
–
–
–
–
V/μs
V/μs
Critical Rising Rate of
Off-StateVoltage
dv/dt
100
VD = VDRM ×0.66, TJ = 125°C, RGREF
=
using test circuit 1
∞
*Where ITP is the peak current through T2 to T1.
Test Circuit 1
Gate Trigger Characteristics
+T2
Quadrant II
Quadrant I
T2 [ + ]
T2 [ + ]
T2
T1
RGREF
=
∞
G [ – ]
G [ + ]
G
T1 [ – ]
T1 [ – ]
–I
+I
GT
T2 [ – ]
T2 [ – ]
GT
G [ – ]
G [ + ]
T1 [ + ]
T1 [ + ]
Quadrant III
Quadrant IV
–T2
Gate Trigger Current
Polarities referenced to T1
tgr
igp
tgw
Allegro MicroSystems, Inc.
115 Northeast Cutoff
3
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
Commutation Timing Diagrams
Q4
Supply VAC
Q
A
A = Conduction angle
VGT
VGATE
Q
ITSM
On-State
Currrent
Q
Allegro MicroSystems, Inc.
115 Northeast Cutoff
4
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
Performance Characteristics at TA = 25°C
300
250
200
150
100
50
100
10
1
f = 50 Hz
full cycle sine wave
total Conduction angle
(A+) + (A–) = 360°
initial TJ = 125°C
TJ = 125°C
Surge On-State
Current versus
Quantity of
Cycles
Maximum On-State
Current versus
Maximum On-State
Voltage
TJ = 25°C
0
0
0.6
1
10
Quantity of Cycles
100
1.4
T (max) (V)
1.0
1.8
2.2
V
30
25
20
15
10
5
150
125
100
75
full cycle sine wave
total Conduction angle
full cycle sine wave
total Conduction angle
(A+) + (A–) = 360°
(A+) + (A–) = 360°
On-State Average
Power Dissipation
versus Maximum
On-State
Case Temperature
versus On-State
RMS Current
83°C
RMS Current
50
25
0
0
0
10
20
30
0
10
20
30
IT(RMS)(max) (A)
IT(RMS) (A)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
100
10
IGM = 2 A
VGM = 10 V
PGM
= 5 W
Proportional Change
of Typical
Trigger Voltage
versus
Gate Voltage
versus
Gate Current
VGT (–40°C)
= 2 V
VGT (25°C)
= 1.5 V
Junction Temperature
1
PG(AV)
= 0.5 W
IGT (–40°C)
= 100 mA
IGT (25°C) = 30 mA
VGD = 0.2 V
0.1
10
100
1000
10 000
–60 –40 –20
0
20 40 60 80 100 120 140
TJ (°C)
IG (mA)
10
10
R
= 1 kΩ
GREF
Proportional Change
of Typical
Proportional Change
of Typical
Quadrant III (T2–, G–)
Trigger Current
versus
Holding Current
versus
1
1
Junction Temperature
Junction Temperature
Quadrant I (T2+, G+)
0.1
0.1
–60 –40 –20
0
20 40 60 80 100 120 140
TJ (°C)
–60 –40 –20
0
20 40 60 80 100 120 140
TJ (°C)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
5
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
Transient Thermal Impedence versus Triac Voltage Pulse Duration
For AC
10
1
0.1
0.001
0.01
0.1
1
10
100
QT (s)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
6
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
TO-3PF Package Outline Drawing
5.5 ±0.2
15.6 ±0.2
3.45 ±0.2
Gate protrusion
Ø3.2 ±0.2
Branding
Area
XXXXXXXX
3.35 ±0.2
XXXXX
XXXXX
1.5
4.4
+0.2
–0.1
1.75
1.05
+0.2
–0.1
+0.2
–0.1
0.65
2.15
+0.2
–0.1
View A
View B
5.45 ±0.1
Terminal dimension at case surface
1
2
3
0.7 MAX
0.7 MAX
View A
View B
Gate burr: 0.3 mm (max.), mold flash may appear at opposite side
Terminal core material: Cu
Branding codes (exact appearance at manufacturer discretion):
1st line, type: MA25xB
Terminal treatment: Ni plating and Pb-free solder dip
Leadform: 700
2nd line left, lot:
YM
Where: Y is the last digit of the year of manufacture
Package: TO-3PF (FM100)
M is the month (1 to 9, O, N, D)
2nd line right, lot:
DD
Dimensions in millimeters
Where: DD is the date
Leadframe plating Pb-free. Device
meets RoHS requirements.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
7
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
Packing Specification
Tube Packing
504
18
47
519
144
244
Allegro MicroSystems, Inc.
115 Northeast Cutoff
8
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
Bulk Packing
362
114
45
336
332
161
100 pieces per tray
5 trays per inner carton
4 inner cartons per outer carton
2000 pieces maximum per outer carton
Dimensions in millimeters
Allegro MicroSystems, Inc.
115 Northeast Cutoff
9
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
WARNING —These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
thatembodythesecomponentsmustconformwithapplicablesafetyrequirements. Precautionsmustbe
takentopreventaccidentalcontactwithpower-linepotentials. Donotconnectgroundedtestequipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage
Heatsink Mounting Method
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Torque When Tightening Mounting Screws. Thermal resistance
increases when tightening torque is low, and radiation effects are
decreased. When the torque is too high, the screw can strip, the
heatsink can be deformed, and distortion can arise in the product frame.
To avoid these problems, observe the recommended tightening torques
for this product package type 0.686 to 0.882 N•m (7 to 9 kgf•cm).
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
Reinspect for rust on leads and solderability of products that have
been stored for a long time.
•
Diameter of Heatsink Hole: < 4 mm. The deflection of the press mold
when making the hole may cause the case material to crack at the joint
with the heatsink. Please pay special attention for this effect.
Soldering
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
Remarks About Using Silicone Grease with a Heatsink
350±5°C 3 s
•
•
•
When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
Coat the back surface of the product and both surfaces of the
insulating plate to improve heat transfer between the product and
the heatsink.
Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
•
Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
•
When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
•
•
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
Type
G746
Suppliers
Shin-Etsu Chemical Co., Ltd.
Momentive Performance Materials
Dow Corning Toray Silicone Co., Ltd.
•
The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
YG6260
SC102
Allegro MicroSystems, Inc.
115 Northeast Cutoff
10
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit im-
provements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this
publication is current before placing any order.
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at
a certain rate is inevitable.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aerospace equipment) is not supported.
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written con-
firmation of your specifications.
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equip-
ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given
for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or
any other rights of Sanken or Allegro or any third party that may result from its use.
Anti radioactive ray design is not considered for the products listed herein.
Copyright © 2008-2009 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSE-24041
Allegro MicroSystems, Inc.
115 Northeast Cutoff
11
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TMA25x
Series
Triac (Bidirectional Triode Thyristor)
Worldwide Contacts
Asia-Pacific
China
Singapore
Sanken Electric Singapore Pte. Ltd.
150 Beach Road, #14-03 The Gateway West
Singapore 189720
Sanken Electric Hong Kong Co., Ltd.
Suite 1026, Ocean Centre
Canton Road, Tsimshatsui
Tel: 65-6291-4755, Fax: 65-6297-1744
Kowloon, Hong Kong
Tel: 852-2735-5262, Fax: 852-2735-5494
Europe
Sanken Power Systems (UK) Limited
Pencoed Technology Park
Pencoed, Bridgend CF35 5HY, United Kingdom
Tel: 44-1656-869-100, Fax: 44-1656-869-162
Sanken Electric (Shanghai) Co., Ltd.
Room 3202, Maxdo Centre
Xingyi Road 8, Changning District
Shanghai, China
Tel: 86-21-5208-1177, Fax: 86-21-5208-1757
North America
United States
Taiwan Sanken Electric Co., Ltd.
Room 1801, 18th Floor
88 Jung Shiau East Road, Sec. 2
Taipei 100, Taiwan R.O.C.
Tel: 886-2-2356-8161, Fax: 886-2-2356-8261
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01606, U.S.A.
Tel: 1-508-853-5000, Fax: 1-508-853-7895
Japan
Sanken Electric Co., Ltd.
Overseas Sales Headquarters
Metropolitan Plaza Building
1-11-1 Nishi-Ikebukuro, Toshima-ku
Tokyo 171-0021, Japan
Allegro MicroSystems, Inc.
14 Hughes Street, Suite B105
Irvine, California 92618, U.S.A.
Tel: 1-949-460-2003, Fax: 1-949-460-7837
Tel: 81-3-3986-6164, Fax: 81-3-3986-8637
Korea
Sanken Electric Korea Co., Ltd.
Samsung Life Yeouido Building 16F
23-10, Yeouido-Dong, Yeongdeungpo-gu
Seoul 150-734, Korea
Tel: 82-2-714-3700, Fax: 82-2-3272-2145
Allegro MicroSystems, Inc.
115 Northeast Cutoff
12
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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