LV47022P [SANYO]
Monolithic Linear IC For Car Audio Systems 4-Channel BTL Power Amplifier; 单片线性集成电路为汽车音响系统4通道BTL功率放大器
| 型号： | LV47022P |
| 厂家： | 
SANYO SEMICON DEVICE |
| 描述： | Monolithic Linear IC For Car Audio Systems 4-Channel BTL Power Amplifier |
| 文件： | 总12页 (文件大小：404K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ordering number : ENA2047
Monolithic Linear IC
For Car Audio Systems
LV47022P
4-Channel BTL Power Amplifier
Overview
The LV47022P is the IC for 4-channel BTL power amplifier that is developed for car audio system.
Pch DMOS in the upper side of the output stage and Nch DMOS in the lower side of the output stage are complimentary.
High power and high quality sound are realized by that.
This IC incorporate various functions (standby switch, muting function, and various protection circuit) necessary for car
audio system. Also, it has a self-diagnosis function.
Functions
• High output : P max = 48W (typical) (V
= 15.2V, f = 1kHz, R = 4Ω, Max Power)
L
O
CC
CC
CC
: P max = 28W (typical) (V
= 14.4V, f = 1kHz, THD = 10%, R = 4Ω)
O
L
: P max = 21W (typical) (V
= 14.4V, f = 1kHz, THD = 1%, R = 4Ω)
L
O
• Built-in muting function (pin 22)
• Built-in Standby switch (pin 4)
• Built-in Self-diagnosis function (pin 25) :
Signal output in case of output offset detection, shorting to V , shorting to ground, load shorting and over voltage.
CC
• Circuit that decrease of Electric mirror noise and GSM noise.
• Built-in various protection circuit (shorting to ground, shorting to V , load shorting, over voltage and thermal shut
CC
down)
Note 1 : Please do not mistake connection.
A wrong connection may produce destruction, deterioration and damage for the IC or equipment.
Note 2 : The protective circuit function is provided to temporarily avoid abnormal state such as incorrect output connection.
But, there is no guarantee that the IC is not destroyed by the accident.
The protective function do not operate of the operation guarantee range. If the outputs are connected incorrectly, IC
destruction may occur when used outside of the operation guarantee range.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment. The products mentioned herein
shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life,
aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system,
safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives
in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any
guarantee thereof. If you should intend to use our products for new introduction or other application different
from current conditions on the usage of automotive device, communication device, office equipment, industrial
equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the
intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely
responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer
's products or
equipment.
40412 SY 20120328-S00001 No.A2047-1/12
LV47022P
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Symbol
Conditions
No signal, t = 1 minute
During operations
Ratings
Unit
V
Maximum supply voltage
V
V
I
max1
26
CC
max2
18
4.5/ch
50
V
CC
peak
Maximum output current
Allowable power dissipation
Operating temperature
Storage temperature
Per channel
A
O
Pd max
Topr
Tstg
Tj
With an infinity heat sink
W
-40 to +85
-40 to +150
150
°C
°C
°C
°C/W
Junction temperature
Thermal resistance between the junction
and case
θj-c
1
Recommended Operating Ranges at Ta = 25°C
Parameter
Symbol
Conditions
Ratings
Unit
Ω
Recommended load resistance
Operating supply voltage range
R
V
op
4
L
op
A range not exceeding Pdmax
8 to 16
V
CC
Electrical Characteristics at Ta = 25°C, V
CC
= 14.4V, R = 4Ω, f = 1kHz, Rg = 600Ω
L
Ratings
Typ.
Parameter
Symbol
Conditions
Min.
Unit
Max.
400
3
Quiescent current
I
R
= ∞, Rg = 0Ω
200
mA
μA
dB
dB
W
CCO
Ist
L
Standby current
Voltage gain
Vst = 0V
= 0dBm
VG
V
25
-1
26
27
O
Voltage gain difference
Output power
ΔVG
+1
P
THD = 10%
Max Power
23
28
43
48
O
P
P
max1
W
O
max2
V
= 15.2, Max Power
W
O
CC
Rg = 0Ω
Output offset voltage
Total harmonic distortion
Channel separation
Ripple rejection ratio
Output noise voltage
Input resistance
Vn offset
THD
-100
+100
0.10
mV
%
P
= 4W
0.02
65
O
O
CHsep
SVRR
V
= 0dBm, Rg = 10kΩ
55
50
dB
dB
μVrms
kΩ
dB
V
Rg = 0Ω, fr = 100Hz, V R = 0dBm
65
CC
V
Rg = 0Ω, B.P.F. = 20Hz to 20kHz
60
120
120
NO
Ri
80
80
100
90
Mute attenuation
Matt
V
= 20dBm, mute : on
O
Standby pin control voltage
Vstby H
Vstby L
Vmute H
Vmute L
Amp : on
Amp : off
Mute : off
Mute : on
2.5
0.0
2.9
0.0
V
CC
0.5
6.0
1.0
V
Mute pin control voltage
V
V
Output offset detection
Detection threshold voltage
Vosdet
±1.2
±1.8
±2.4
V
* 0dBm = 0.775Vrms
No.A2047-2/12
LV47022P
Block Diagram
V
CC
+
C7
C8
Tab
V
1/2
V
3/4
CC
CC
1
6
20
IN 1
C1
11
+
OUT 1
9
8
7
PWR GND1
R
L
-
OUT 1
Protective
circuit
IN 2
C2
12
+
OUT 2
5
2
PWR GND2
DC
R
L
Ripple
Filter
10
C6
+
-
OUT 2
3
AC GND
C5
16
OFFSETDIAG
R2
25
5V
R1
PRE GND
13
15
Mute
Mute
circuit
22
C9
High:Mute OFF
Low:Mute ON
IN 3
C3
+
OUT 3
17
18
19
PWR GND3
R
L
-
IN 4
14
OUT 3
C4
Protective
circuit
+
OUT 4
21
24
23
PWR GND4
R
L
Stand by
Switch
STBY
4
High:Amp ON
Low:Amp OFF
-
OUT 4
Important points
Please connect Pin1 line near C7 and C8. Because Pin1 is substrate of IC.
No.A2047-3/12
LV47022P
Package Dimensions
unit : mm (typ)
3236A
Pd max -- Ta
70
60
50
40
30
20
10
0
29.2
25.6
(22.8)
(8.5)
(
2.5)
4.5
Infinite heat sink θj-c=1°C/W
(R1.7)
heat sink(θf=3.5°C/W)
θj-c+θf=4.5°C/W
0.4
4.0
1
25
4.2
(2.6)
(1.0)
0.52
No heat sink θj-a=39°C/W
2.0
2.0
-40
-20
0
20
40
60
80
100 120 140 160
Ambient temperature, Ta -- °C
SANYO : HZIP25
External Components
Part Name
Recommended Value
Purpose
Remarks
C1 to C4
0.22μF
Cuts DC voltage
The larger the constant value, the lower the cut-off frequency.
When AMP ON, bigger value worse pop noise.
The values of C1 to C4 must be the same.
C1 to C4 must use capacitor of low leak current.
The ratio of the input capacitance (C1 to C4) to the ACGND capacitance
(C5) should be 1:4.
C5
C6
1μF
Cuts DC voltage
If the ratio deviates, pop noise and SVRR are worse.
Use capacitor same as C1 to C4.
22μF
Reduces pop noise
(AMP ON/OFF)
Reduces ripples
The larger the constant value, the longer the amplifier ON/OFF time.
The larger the constant value, SVRR is good.
On the other hand, the smaller constant value. AMP ON/OFF will be
shoeter.
C7
C8
2200μF
0.1μF
Ripple filter
Eliminating power supply ripples.
Please put near IC.
Improves oscillation stability
Reducing high-frequency noise.
Please put near IC.
C9
R1
1μF
Reduces pop noise
The larger the constant value, pop noise is small.
The large the constant value, the longer the mute ON/OFF time.
On the other hand, the smaller constant value.
Mute ON/OFF will be shorter.
(Mute ON↔OFF)
47kΩ
And, Mute ON↔OFF pop noise will be worse.
Because of transistor ability in IC, Please use 2.2kΩ or more.
R2
4.7kΩ
Pull-up resistor
* The components and constant values within the test circuit are used for confirmation of characteristics and are not guarantees that incorrect or trouble will not
occur in application equipment.
No.A2047-4/12
LV47022P
Explanation for the function
1. Standby switch function (pin 4)
Threshold voltage of the Pin 4 is set by about 2VBE.
The amplifier is turned on by the applied voltage of 2.5V or more. Also, the amplifier is turned off by the applied
voltage of 0.5V or less.
STBY
4
Fig1 Standby equivalent circuit
2. Muting function (Pin 22)
The muting function is turned on by the applied voltage of 1.0V or less to 22pin. And the muting function is turn off by
the applied voltage 2.9V or more.
Also, the time constant of the muting function is determined by external capacitor and resistor constants.
It is concerned with mute ON/OFF. After enough examination, please set it.
Switching time
Mute ON: C9 × R1
Mute OFF: (C9 × V) / I (V= When Mute ON Pin 22 voltage, I=about 5μA)
MUTE
OFF
ON
MUTE
22
R1
+
C9
about
2.1V
Fig2 Mute equivalent circuit
3. Input pin (Pin 11/ Pin 12/ Pin 14/ Pin 15), ACGND pin (Pin 16)
The ratio of the input capacitance (C1 to C4) to the ACGND capacitance (C5) should be 1:4.
Please use same kind of capacitor.
Please connect the ACGND capacitor to PREGND.
It is all five pin 100kΩ of input resistance.
Do not input below 0V to Pin-IN (Pin 11/ Pin12/ Pin 14/ Pin15).
If you input below 0V to Pin-IN, LV47022P can not function well.
No.A2047-5/12
LV47022P
4. Self-diagnostics function (Pin 25)
In four modes to write below, the signal is output to the Pin 25.
Also, by controlling the standby switch after the signal of the Pin 25 is detected by the microcomputer, the burnout of
the speaker can be prevented.
(1) Shorting to V /Shorting to ground : The Pin 25 becomes the low level.
CC
(2) Load shorting
: The Pin 25 is alternated between the low level and the high level
according to the output signal.
(3) Over voltage
: When the voltage of V
exceeds voltage 21V (typical), the Pin 25
CC
becomes the low level.
(4) Output offset detection
: When the output offset voltage exceeds the detection threshold voltage,
the Pin 25 becomes the low level.
In addition, the Pin 25 has become the NPN open collector output (active low).
The Pin 25 must be left open when this function is not used.
Output voltage
Speaker pin
output voltage
+1.8V (typical)
0V
-1.8V (typical)
time
25 pin voltage
time
Fig3 Offset detection
5V
OFFSET
DIAG
25
IN
+
OUT
+
+
RT
AC GND
-
OUT
-
-
16
Fig4 Operating Pin 25
No.A2047-6/12
LV47022P
5. Sound quality (low frequencies)
By varying the value of input capacitor, low-frequency characteristic can be improved.
However, it is concerned the pop noise. Please confirm in each set when the capacitance value varies.
6. Pop noise
For pop noise prevention, it is recommended to use the muting function at the same time.
At AMP ON
Set MUTE ON first, then set STBY pin High ( AMP ON).
About 1.5sec later, set to be MUTE OFF.
At AMP OFF
After 10msec later MUTE ON, please do STBY pin Low ( AMP OFF).
STBY
(Pin4)
STBY
(Pin4)
DC
(Pin10)
DC
(Pin10)
Mute
(Pin22)
Mute
(Pin22)
OUT
OUT
more than 1.5sec
more than 10msec
7. Oscillation stability
Pay due attention on the following points because parasitic oscillation may occur due to effects of the board layout,
etc.
Board layout
• Provide the V
capacitor of 0.1μF in the position nearest to IC.
CC
• PREGND must be independently wired and connected to the GND point that is as stable as possible, such as the
minus pin of the 2200μF V capacitor.
CC
In case of occurrence of parasitic oscillation, any one of following parts may be added as a countermeasure.
Please check your capacitor of optimal value at set
• Series connection of CR (0.1μF and 2.2Ω) between each output pin and GND.
8. EMC countermeasure
LV47022P has function that decrease of Electric mirror noise and GSM noise.
When you connect capacitor of more than 1000pF between out and GND because of EMC countermeasure, please add
oscillation cut parts. Value of oscillation prevention parts recommends 2.2Ω + 0.1μF.
No.A2047-7/12
LV47022P
I
-- V
CC
V
-- V
CCO
N
CC
250
200
150
100
14
12
10
8
6
4
50
0
2
0
6
8
10
12
14
16
18
6
8
10
12
14
16
18
Supply voltage, V
-- V
Supply voltage, V
-- V
CC
CC
P
-- V
P
-- f
O
CC
O
50
40
30
20
25
20
15
10
all channel is similar
all channel is similar
10
0
5
0
8
10
12
14
16
18
2
3
5 7
2
3
5 7
2
3
5 7
2
3
5 7
100k
10
100
1k
10k
Supply voltage, V
-- V
Frequency, f -- Hz
CC
THD -- P
THD -- P
O
O
10
7
5
10
7
5
3
2
3
2
1
1
7
5
7
5
3
2
3
2
0.1
0.1
7
5
7
5
CH2
CH4
3
2
3
2
CH2
CH4
CH1
CH3
2
CH3
CH1
3
0.01
0.01
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
5
7
3
5 7
100
0.1
1
10
100
0.1
1
10
Output power, P -- W
Output power, P -- W
O
O
THD -- f
THD -- P
O
10
7
10
7
5
5
3
2
3
2
1
7
5
1
7
5
3
2
3
2
0.1
7
0.1
7
CH3
5
5
CH1
CH2
CH2
CH3
CH4
3
2
3
2
CH4
10
0.01
0.01
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5 7
100k
0.1
1
10
100
10
100
1k
10k
Output power, P -- W
Frequency, f -- Hz
O
No.A2047-8/12
LV47022P
Respomse -- f
V
-- Rg
NO
28
27
26
200
150
100
all channel is similar
all channel is similar
25
24
50
0
2
2
2
3
5 7
5 7
5 7
10
2
3
5 7
2
3
5 7
5 7
5 7
2
2
2
3
3
3
5 7
100k
10
2
2
2
2
3
3
3
3
5 7
5 7
5 7
5 7
2
3
5 7
2
3
5 7
5 7
5 7
5 7
2
2
2
2
3
3
3
3
5 7
100k
10
100
100
100
1k
10k
10k
10k
100
100
100
100
1k
10k
10k
10k
10k
Frequency, f -- Hz
CH.Sep -- f
CH.Sep -- f
80
60
40
80
60
40
20
0
20
0
1
3
2
3
5 7
2
3
5 7
100k
2
3
5 7
1k
2
3
5 7
100k
10
1k
10
Frequency, f -- Hz
Frequency, f -- Hz
CH.Sep -- f
CH.Sep -- f
80
80
60
60
40
40
20
0
20
0
3
2
3
5 7
2
3
5 7
100k
2
3
5 7
1k
2
3
5 7
100k
10
1k
10
Frequency, f -- Hz
Frequency, f -- Hz
SVRR -- V
SVRR -- f
R
CC
80
80
60
40
all channel is similar
60
40
all channel is similar
20
0
20
0
8
12
14
16
18
10
2
3
5 7
2
3
5 7
100k
1k
Supply voltage, V
-- V
Ripple frequency, f -- Hz
CC
R
No.A2047-9/12
LV47022P
Offset DIAG -- V
CC
Pd -- P
O
4
3
2
60
50
40
30
20
R
R
= 0
= 4
V
=14.4V
CC
g
L
Detection Level
all channel is similar
1
0
10
0
8
10
12
14
16
18
2
3
5
7
2
3
5
7
2
3
5 7
100
0.1
1
10
Output power, P -- W
Power supply, V
CC
- V
O
I
-- Vst
Mute ATT -- V Mute
CCO
250
200
150
100
100
80
60
all channel is similar
40
20
0
50
0
0
1.0
2.0
3.0
4.0
5.0
0
1.0
2.0
3.0
4.0
5.0
Standby control voltage, Vst -- V
Mute control voltage, V Mute -- V
PS No.A2047-10/12
LV47022P
HZIP25 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b. Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
Binding head
machine screw
Countersunk head
mashine screw
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
Heat sink
· Take care a position of via hole .
gap
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
Via hole
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
c. Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC)
d. Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e. When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f. Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
PS No.A2047-11/12
LV47022P
SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.
products described or contained herein.
SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all
semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or
malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise
to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt
safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not
limited to protective circuits and error prevention circuits for safe design, redundant design, and structural
design.
In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are
controlled under any of applicable local export control laws and regulations, such products may require the
export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written consent of SANYO Semiconductor Co.,Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
SANYO Semiconductor Co.,Ltd. product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed
for volume production.
Upon using the technical information or products described herein, neither warranty nor license shall be granted
with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third
party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's
intellctual property rights which has resulted from the use of the technical information and products mentioned
above.
This catalog provides information as of April, 2012. Specifications and information herein are subject
to change without notice.
PS No.A2047-12/12
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