X1G004241004813 [SEIKO]

LVDS Output Clock Oscillator,;


型号：	X1G004241004813
厂家：	SEIKO EPSON CORPORATION
描述：	LVDS Output Clock Oscillator, 机械输出元件振荡器
文件：	总7页 (文件大小：437K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Clock OSC

SG3225VAN

SG3225VAN 148.500000MHz KJBA

Product name

X1G0042410048xx

Product Number / Ordering code

Please refer to the 9.Packing information about xx (last 2 digits)

Output waveform

Pb free / Complies with EU RoHS directive

LVDS

Reference weight Typ. 25 mg

1.Absolute maximum ratings

Parameter

Symbol

Vcc-GND

T_stg

Min.

-0.3

-40

Typ.

Max.

+125

Unit

ºC

Conditions / Remarks

Storage as single product

ST or OE Terminal

Maximum supply voltage

Storage temperature

Input voltage

Vin

-0.3

Vcc+0.3

2.Specifications(characteristics)

Parameter

Output frequency

Symbol

Min.

Typ.

148.5000

Max.

Unit

MHz

Conditions / Remarks

Vcc

T_use

f_tol

Icc

Supply voltage

2.25

3.63

Operating temperature

Frequency tolerance

Current consumption

Stand-by current

Disable current

-20

+70

ºC

x10^-6

-50

OE=Vcc L_LVDS=100 ohm

I_std

I_dis

SYM

VOD

dVOD

Vos

dVos

L_LVDS

V_IH

0.0

OE=GND

20.0

Symmetry

Output voltage(LVDS)

250

450

1.15

1.35

100

150

Ω

Output load condition(LVDS)

Input voltage

0.7Vcc

V_IL

0.3Vcc

Rise time

Fall time

Start-up time

Jitter

t_r

300

t_str

t_DJ

Deterministic Jitter Vcc=2.5V

Random Jitter Vcc=2.5V

δ(RMS of total distribution) Vcc=2.5V

Peak to Peak Vcc=2.5V

18.2

2.1

7.1

24.8

T_RJ

t_RMS

t_p-p

t_acc

Off set Frequency: 12kHz to 20MHz Vcc=2.5V

Phase jitter

t_PJ

TBD

Phase noise

L(f)

dBc/Hz

x10^-6/Year

Off set 10Hz Vcc=2.5V

Off set 100Hz Vcc=2.5V

Off set 1kHz Vcc=2.5V

Off set 10kHz Vcc=2.5V

Off set 100kHz Vcc=2.5V

Off set 1MHz Vcc=2.5V

25℃,1stYear

TBD

Frequency aging

f_age

-5

1 Page

3.Test circuit

1) To observe waveform and current (case 1)

+3.3 V

Vcc

OUT

GND

By-pass

capacitor 2

Differentila probe

Oscillo-

scope

100 Ω

Power

supply 1

OE pin*

By-pass

capacitor 1

* The lines from OUT and OUT pin are same length.

* To measure the disable current, OE pin is connected to GND

2) To observe waveform and current (case 2)

V_OD

+3.3 V

Vcc

OUT

GND

By-pass

capacitor 2

50 Ω

V_OS

OE pin

Power

supply 1

By-pass

capacitor 1

* The lines from OUT and OUT pin are same length.

3) Measurement condition

A) Oscilloscope

•Bandwidth should be 5 times higher than DUT’s output frequency (4 GHz).

•Probe ground should be placed closely from test point and lead length should be as short as possible.

B) By-pass capacitor 1 (approx. 0.01 μF to 0.1 μF) places closely between Vcc and GND.

C) By-pass capacitor 2 (approx. 10 μF) places closely between power supply terminals on the board.

D) Use the current meter whose internal impedance value is small.

E) Power supply

• Start up time (0 Vg90 %Vcc) of power source should be more than 150 μs and

slew rate should be less than 19.8 mV/μs.

• Impedance of power supply should be as low as possible.

2 Page

4.Timing chart

Each output waveform (OUT, and OUT)

Vcc

OUT

50 % of OUT

amplitude

50 % of OUT

amplitude

V_OS1

V_OS2

GND

SYM = tw / t

dV_OS=｜V_OS1-V_OS2

｜

Differential output waveform (OUT – OUT)

OUT

80 % of amplitude

V_OD1

Differential 0 V

V_OD2

20 % of amplitude

OUT

dV_OD=｜V_OD1-V_OD2

｜

5.External dimensions

(Unit: mm)

6.Footprint(Recommended)

(Unit: mm)

0.82

0.86

2.58

To maintain stable operation, provide a 0.01uF to 0.1uF

by-pass capacitor at a location as near as possible to the

power source terminal of the crystal product (between Vcc

- GND).

3 Page

7.Reflow profile

Reflow condition (Follow of JEDEC STD-020D.01)

Temperature[C]

300

TP ;+260C

+255C



tp;20sto40s

250

200

150

100

Avg. Ramp-up



3 C/sMax.

60sto150s

(+217Cover)

TL ;+217C

Tsmax;+200C

Ramp-down

6C/sMax.

60sto180s

(+150Cto+200C)

Tsmin;+150C

Time +25CtoPeak

60 120 180 240 300 360 420 480 540 600 660 720 780

Time[s]

8.Example of schematic layout

This figure shows an example of this product’s application schematic.

As with any high speed analog circuitry, the power supply pins for this device are vulnerable to

noise. In order to achieve optimum jitter performance, power isolation with filter device is required

for power supply pins.

In order to achieve best performance of the power isolation filter, it is recommended that the filter

composing devices is placed on the device side of the PCB as close to the power pins as possible.

The component value of this filter is just an example, it may have to be adjusted.

4 Page

* By-pass capacitor (approx. 0.01 μF to 0.1 μF) places closely between Vcc and GND.

* By-pass capacitor (approx. 10 μF) places closely between power supply terminals on the board.

* Please design the two output lines by characteristic impedance 100 Ω and same length, and try

to make the output lines as short as possible.

9.Packing information

[ 1 ]Product number last 2 digits code(xx) description

X1G0042410048xx

The recommended code is "00"

Condition

500pcs / Reel

1000pcs / Reel

2000pcs / Reel

Code

Any Q'ty vinyl bag(Tape cut)

Any Q'ty / Reel

250pcs / Reel

5 Page

[ 2 ] Taping specification

Subject to EIA-481 & IEC-60286

(1) Tape dimensions

ꢀꢀꢀMaterial of the Carrier Tape : PS

ꢀꢀꢀMaterial of the Top Tape : PET+PE

Unit: mm

10 P: 400.1

4.00.1

2.00.1

1.40.1

+0.1

-0

φ1.55

0.250.05

4.00.1

2.80.1

φ1.00.1

(2) Reel dimensions

Center material

11.41.0

9.00.3

: PS

Material of the Reel : PS

+0.3

-0

2.0

6 Page

10.Notice

 This material is subject to change without notice.

 Any part of this material may not be reproduced or duplicated in any form or any means without the written permission

of Seiko Epson.

 The information about applied circuitry, software, usage, etc. written in this material is intended for reference only.

Seiko Epson does not assume any liability for the occurrence of infringing on any patent or copyright of a third party.

This material does not authorize the licensing for any patent or intellectual copyrights.

 When exporting the products or technology described in this material, you should comply with the applicable

export control laws and regulations and follow the procedures required by such laws and regulations.

 You are requested not to use the products (and any technical information furnished, if any) for the development

and/or manufacture of weapon of mass destruction or for other military purposes. You are also requested that you

would not make the products available to any third party who may use the products for such prohibited purposes.

 These products are intended for general use in electronic equipment. When using them in specific applications that require

extremely high reliability, such as the applications stated below, you must obtain permission from Seiko Epson in advance.

/ Space equipment (artificial satellites, rockets, etc.)

/ Transportation vehicles and related (automobiles, aircraft, trains, vessels, etc.)

/ Medical instruments to sustain life

/ Submarine transmitters

/ Power stations and related

/ Fire work equipment and security equipment

/ Traffic control equipment

/ And others requiring equivalent reliability.

 All brands or product names mentioned herein are trademarks and/or registered trademarks of their respective.

11.Contact us

http://www5.epsondevice.com/en/contact/

7 Page

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