SKCD61C060I3_10 [SEMIKRON]

CAL-DIODE; CAL二极管
SKCD61C060I3_10
型号: SKCD61C060I3_10
厂家: SEMIKRON INTERNATIONAL    SEMIKRON INTERNATIONAL
描述:

CAL-DIODE
CAL二极管

二极管
文件: 总2页 (文件大小:222K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SKCD 61 C 060 I3  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
Tj = 25 °C, IR = 0.2 mA  
Ts = 80 °C, Tj = 150 °C  
VRRM  
IF(AV)  
IFSM  
600  
75  
V
A
Tj = 25 °C  
Tj = 150 °C  
A
10 ms  
sin 180°  
1000  
150  
A
Tjmax  
°C  
Electrical Characteristics  
Symbol Conditions  
CAL-DIODE  
min.  
typ.  
max.  
Unit  
IF = 100 A  
i2t  
IR  
5000  
0.20  
6.00  
1.60  
1.60  
A2s  
mA  
mA  
V
Tj = 150 °C, 10 ms, sin 180°  
Tj = 25 °C, VRRM = 600 V  
VRRM = 600 V  
Tj = 125 °C, VRRM = 600 V  
Tj = 25 °C, IF = 110 A  
Tj = 125 °C, IF = 110 A  
Tj = 125 °C  
Size: 7,8 mm x 7,8 mm  
VF  
1.35  
1.35  
0.90  
3.8  
V
V(TO)  
rT  
V
SKCD 61 C 060 I3  
Tj = 125 °C  
m  
Dynamic Characteristics  
Symbol Conditions  
Features  
• low forward voltage drop combined  
with a low temperature dependence  
• easy paralleling due to a small forward  
voltage spread  
• very soft recovery behavior  
• small switching losses  
min.  
typ.  
max.  
Unit  
Tj = 25 °C, 100 A, 300 V, 800 A/µs  
trr  
µs  
ns  
µC  
µC  
A
Tj = 125 °C, 100 A, 300 V, 800 A/µs  
Tj = 25 °C, 100 A, 300 V, 800 A/µs  
Tj = 125 °C, 100 A, 300 V, 800 A/µs  
Tj = 25 °C, 100 A, 300 V, 800 A/µs  
Tj = 125 °C, 100 A, 300 V, 800 A/µs  
trr  
Qrr  
Qrr  
Irrm  
Irrm  
3
7
• high ruggedness  
• compatible to thick wire bonding  
• compatible to all standard solder  
processes  
60  
A
Typical Applications*  
• freewheeling diode for IGBT  
Thermal Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
Tj  
-40  
-40  
150  
150  
250  
320  
°C  
°C  
°C  
°C  
Tstg  
Tsolder  
Tsolder  
10 min.  
5 min.  
sold. on 0,38 mm DCB, reference point  
on copper heatsink close to the chip  
Rth(j-s)  
0.54  
K/W  
Mechanical Characteristics  
Symbol Conditions  
Values  
Unit  
Raster  
size  
7.8 x 7.8  
mm2  
mm2  
Area total  
Anode  
60.84  
bondable (Al)  
Cathode  
Wire bond  
Package  
solderable (Ag/Ni)  
Al, diameter 500 µm  
wafer frame  
Chips /  
Package  
156 (5" Wafer)  
pcs  
SKCD  
© by SEMIKRON  
Rev. 0 – 18.02.2010  
1
SKCD 61 C 060 I3  
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX  
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested  
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is  
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.  
2
Rev. 0 – 18.02.2010  
© by SEMIKRON  

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