SKHI22B [SEMIKRON]

Half Bridge Based Peripheral Driver, Hybrid,;
SKHI22B
型号: SKHI22B
厂家: SEMIKRON INTERNATIONAL    SEMIKRON INTERNATIONAL
描述:

Half Bridge Based Peripheral Driver, Hybrid,

驱动 接口集成电路
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SKHI 21 A, SKHI 22 A / B  
SEMIDRIVER®  
Hybrid Dual IGBT Driver  
SKHI 22 A / B  
Double driver for halfbridge  
IGBT modules  
SKHI 22 A/B H4 is for 1700  
V-IGBT  
SKHI 22 A is compatible to  
old SKHI 22  
SKHI 22 B has additional  
functionality  
Absolute Maximum Ratings  
Symbol Term  
Values  
Units  
V
V
V
A
mA  
kHz  
V
VS  
Supply voltage prim.  
18  
VS + 0,3  
5 + 0,3  
8
40  
50  
1700  
ViH  
Input signal volt. (High)  
SKHIxxA  
SKHI22B  
IoutPEAK Output peak current  
IoutAVmax Output average current  
fmax  
VCE  
max. switching frequency  
Collector emitter voltage sense across the  
IGBT  
dv/dt  
VisolIO  
Visol12  
Rate of rise and fall of voltage secondary  
to primary side  
50  
kV/µs  
Isolation test voltage  
Standard  
2500  
4000  
1500  
Vac  
Vac  
V
Hybrid Dual MOSFET  
Driver  
SKHI 21 A  
drives MOSFETs with  
VDS(on) < 10 V  
input-output (2 sec.AC)  
Version „H4"  
Isolation test voltage ouput 1 - output 2  
(2 sec.AC)  
RGonmin  
RGoffmin  
Minimum rating for RGon  
Minimum rating for RGoff  
3
3
µC  
°C  
°C  
Qout/pulse Max. rating for output charge per pulse  
4 1)  
is compatible to old SKHI 21  
Top  
Tstg  
Operating temperature  
Storage temperature  
- 40... + 85  
- 40... + 85  
Preliminary Data  
Electrical Characteristics (Ta = 25 °C)  
Symbol Term  
Values  
typ. max. Units  
min.  
VS  
ISO  
Supply voltage primary side  
Supply current primary side (no load)  
Supply current primary side (max.)  
14,4  
10,9  
3,5  
4,7  
1,5  
15  
80  
15 / 0  
5 / 0  
11,7  
3,7  
15,6  
290  
V
mA  
mA  
V
V
V
V
V
V
Vi  
Input signal voltage  
SKHIxxA on/off  
SKHI22B on/off  
ViT+  
ViT-  
Input threshold voltage (High) SKHIxxA  
SKHI22B  
Input threshold voltage (Low) SKHIxxA  
SKHI22B  
12,5  
3,9  
6,5  
2,0  
Features  
5,5  
1,75  
CMOS compatible inputs  
Short circuit protection by VCE  
monitoring and switch off  
Drive interlock top/bottom  
Isolation by transformers  
Supply undervoltage protection  
(13 V)  
Rin  
Input resistance  
SKHIxxA  
SKHI22B  
10  
3,3  
kΩ  
kΩ  
VG(on)  
VG(off)  
Turn on gate voltage output  
Turn off gate voltage output SKHI22x  
SKHI21A  
+15  
-7  
0
V
V
V
RGE  
fASIC  
td(on)IO  
td(off)IO  
td(err)  
Internal gate-emitter resistance  
0,85  
0,85  
3,3  
0
22  
8
1
1
0,6  
9
1,15  
1,15  
kΩ  
MHz  
µs  
µs  
µs  
µs  
µs  
µs  
V
Error latch/output  
Asic system switching frequency  
Input-output turn-on propagation time  
Input-output turn-off propagation time  
Error input-output propagation time  
Typical Applications  
Driver for IGBT and MOSFET  
modules in bridge circuits in  
choppers, inverter drives, UPS  
and welding inverters  
tpERRRESET Error reset time  
tTD  
Top-Bot Interlock Dead Time SKHIxxA  
SKHI22B  
Reference voltage for VCE-monitoring  
4,3  
4,3  
10  
10  
VCEstat  
5 2)  
6 3)  
DC bus voltage up to 1200V  
V
1) see fig. 6  
Cps  
Coupling capacitance primary secondary  
12  
pF  
106 h  
g
2) At RCE = 18 k, CCE = 330pF  
3) At RCE = 36 k, CCE = 470pF,  
RVCE = 1kΩ  
MTBF  
m
Mean Time Between Failure Ta = 40° C  
weight  
2,0  
45  
© by SEMIKRON  
031127  
1
SKHI 21 A, SKHI 22 A / B  
External Components  
Component  
RCE  
Function  
Reference voltage for VCE-monitoring  
Recommended Value  
10k< RCE < 100kΩ  
10 RCE(kΩ)  
VCEstat(V) = ------------------------------------ 1,4  
10 + RCE(kΩ)  
(1)  
18kfor SKM XX 123 (1200V)  
36kfor SKM XX 173 (1700V)  
with RVCE = 1k(1700V IGBT):  
10 RCE(kΩ)  
VCEstat(V) = ------------------------------------ 1,8  
10 + RCE(kΩ)  
(1.1)  
CCE  
CCE < 2,7nF  
Inhibit time for VCE - monitoring  
15 VCEstat(V)  
10 VCEstat(V)  
0,33nF for SKM XX 123 (1200V)  
0,47nF for SKM XX 173 (1700V)  
----------------------------------------  
tmin = τCE ln  
(2)  
(3)  
0,5µs < tmin < 10µs  
10 RCE(kΩ)  
10 + RCE(kΩ)  
------------------------------------  
τCEs) = CCE(nF) ⋅  
RVCE  
Collector series resistance for 1700V IGBT- 1k/ 0,4W  
operation  
RERROR  
Pull-up resistance at error output  
UPull Up  
1k< RERROR < 10kΩ  
-----------------------  
< 15mA  
RERROR  
RGON  
Turn-on speed of the IGBT 4)  
Turn-off speed of the IGBT 5)  
RGON > 3Ω  
RGOFF > 3Ω  
RGOFF  
4) Higher resistance reduces free-wheeling diode peak recovery current, increases IGBT turn-on time.  
5) Higher resistance reduces turn-off peak voltage, increases turn-off time and turn-off power dissipation  
2
031127  
© by SEMIKRON  
SKHI 21 A, SKHI 22 A / B  
PIN array  
Fig. 2 shows the pin arrays. The input side (primary side) comprises 10 inputs (SKHI 22A / 21A 8 inputs), forming the  
interface to the control circuit (see fig.1).  
The output side (secondary side) of the hybrid driver shows two symmetrical groups of pins with 4 outputs, each forming  
the interface to the power module. All pins are designed for a grid of 2,54 mm.  
Primary side PIN array  
PIN No. Designation Explanation  
P14  
P13  
P12  
GND / 0V  
VS  
related earth connection for input signals  
+ 15V 4% voltage supply  
switching signal input 1 (TOP switch)  
VIN1  
positive 5V logic (for SKHI22A /21A, 15V logic)  
P11  
P10  
free  
not wired  
/ERROR  
error output, low = error; open collector output; max 30V / 15mA  
(for SKHI22A /21A, internal 10kpull-up resistor versus VS)  
P9  
P8  
TDT2  
VIN2  
signal input for digital adjustment of interlocking time;  
SKHI22B: to be switched by bridge to GND (see fig. 3)  
SKHI22A /21A: to be switched by bridge to VS  
switching signal input 2 (BOTTOM switch);  
positive 5V logic (for SKHI22A /21A, 15V logic)  
P7  
P6  
GND / 0V  
SELECT  
related earth connection for input signals  
signal input for neutralizing locking function;  
to be switched by bridge to GND  
P5  
TDT1  
signal input for digital adjustment of locking time;  
to be switched by bridge to GND  
ATTENTION: Inputs P6 and P5 are not existing for SKHI 22A/ 21A. The contactor tracks of the digital input signals P5/  
P6/ P9 must not be longer than 20 mm to avoid interferences, if no bridges are connected.  
Secondary side PIN array  
PIN No. Designation Explanation  
S20  
S15  
S14  
S13  
S12  
S1  
VCE1  
CCE1  
GON1  
GOFF1  
E1  
collector output IGBT 1 (TOP switch)  
reference voltage adjustment with RCE and CCE  
gate 1 RON output  
gate 1 ROFF output  
emitter output IGBT 1 (TOP switch)  
collector output IGBT 2 (BOTTOM switch)  
reference voltage adjustment with RCE and CCE  
gate 2 RON output  
VCE2  
CCE2  
GON2  
GOFF2  
E2  
S6  
S7  
S8  
gate 2 ROFF output  
S9  
emitter output IGBT 2 (BOTTOM switch)  
ATTENTION: The connector leads to the power module should be as short as possible.  
© by SEMIKRON  
031127  
3
SKHI 21 A, SKHI 22 A / B  
Fig. 1 Block diagram of SKHI 22 A / B / 21 A  
4
031127  
© by SEMIKRON  
SKHI 21 A, SKHI 22 A / B  
VCE  
OUT1  
CCE  
GON  
GND/0V  
VS  
IN1  
GOFF  
V
E
ERROR  
TDT2  
E
V
GOFF  
IN2  
GON  
CCE  
GND/0V  
SELECT  
TDT1  
OUT2  
VCE  
55  
±0.2  
detail "A" on scale 10 : 1  
0.25x0.5  
50.8  
±0.3  
measured from pin-centre to pin-centre  
A
18.25  
15.75  
S1  
P5  
P6  
S6  
S9  
S12  
S15  
P13  
P14  
A
A
S20  
Fig. 2 Dimension drawing and PIN array (P5 and P6 are not existing for SKHI22A/21A)  
© by SEMIKRON  
031127  
5
SKHI 21 A, SKHI 22 A / B  
SEMIDRIVER®  
The driver is connected to a controlled + 15 V-supply  
voltage. The input signal level is 0/15 V for the SKHI 22A/  
21A and 0/5 V for the SKHI 22B.  
SKHI 22A / 22B und SKHI 21A  
In the following explanations the whole driver family will  
be designated as SKHI 22B. If a special type is referred  
to, the concerned driver version will explicitly be named.  
Hybrid dual drivers  
The driver generation SKHI 22A/B and SKHI 21A will  
replace the hybrid drivers SKHI 21/22 and is suitable for  
all available low and medium power range IGBT and  
MOSFETs.  
Technical explanations1  
Description of the circuit block diagram and the  
functions of the driver  
The SKHI 22A (SKHI 21A) is a form-, fit- and mostly  
function-compatible replacement to its predecessor, the  
SKHI 22 (SKHI 21).  
The block diagram (fig.1) shows the inputs of the driver  
(primary side) on the left side and the outputs (secondary  
side) on the right.  
The SKHI 22B is recommended for any new  
development. It has two additional signal pins on the  
primary side with which further functions may be utilized.  
The following functions are allocated to the primary  
side:  
The SKHI 22A and SKHI 22B are available with standard  
isolation (isolation testing voltage 2500 VAC, 1min) as  
well as with an increased isolation voltage (type "H4")  
(isolation testing voltage 4000 VAC, 1min). The SKHI 21A  
is only offered with standard isolation features.  
Input-Schmitt-trigger, CMOS compatible, positive logic  
(input high = IGBT on)  
Interlock circuit and deadtime generation of the IGBT  
If one IGBT is turned on, the other IGBT of a halfbridge  
cannot be switched. Additionally, a digitally adjustable  
interlocking time is generated by the driver (see fig. 3),  
which has to be longer than the turn-off delay time of the  
IGBT. This is to avoid that one IGBT is turned on before  
the other one is not completely discharged. This protec-  
tion-function may be neutralized by switching the select  
input (pin6) (see fig. 3). fig. 3 documents possible  
interlock-times. "High" value can be achieved with no  
connection and connection to 5 V as well.  
Differences SKHI 22-22A (SKHI 21-21A)  
Compared to the old SKHI 22/21 the new driver  
SKHI 22A / 21A is absolutely compatible with regards to  
pins and mostly with regards to functions. It may be  
equivalently used in existing PCBs.  
The following points have to be considered when  
exchanging the drivers:  
Leave out the two resistors RTD for interlocking  
dead time adjustment at pin 11 and pin 9.  
P6 ;  
SELECT  
P5 ;  
TDT1  
P9 ;  
TDT2  
interlock time  
tTD /µs  
The interlocking time of the driver stages in  
halfbridge applications is adjusted to 3,25 µs. It may  
be increased up to 4,25 µs by applying a 15 V (VS)  
supply voltage at Pin 9 (TDT2) (wire bridge)  
open / 5V  
open / 5V  
open / 5V  
open / 5V  
GND  
GND  
GND  
GND  
open / 5V  
GND  
1,3  
2,3  
open / 5V  
open / 5V  
X
3,3  
The error reset time is typically 9µs.  
The input resistance is 10 k.  
open / 5V  
X
4,3  
no interlock  
Fig. 3 SKHI 22B - Selection of interlock-times: „High“-  
level can be achieved by no connection or  
connecting to 5 V  
As far as the SKHI 22A is concerned, the negative gate  
voltage required for turn-off of the IGBT is no longer -15V,  
but -7V.  
Short pulse suppression  
General description  
The integrated short pulse suppression avoids very short  
The new driver generation SKHI 22A/B, SKHI 21A switching pulses at the power semiconductor caused by  
consists of a hybrid component which may directly be high-frequency interference pulses at the driver input  
mounted to the PCB.  
signals. Switching pulses shorter than 500 ns are  
suppressed and not transmitted to the IGBT.  
All devices necessary for driving, voltage supply, error  
monitoring and potential separation are integrated in the Power supply monitoring (VS)  
driver. In order to adapt the driver to the used power  
module, only very few additional wiring may be  
necessary.  
A controlled 15 V-supply voltage is applied to the driver. If  
it falls below 13 V, an error is monitored and the error  
output signal switches to low level.  
The forward voltage of the IGBT is detected by an  
integrated short-circuit protection, which will turn off the  
module when a certain threshold is exceeded.  
1. The following descriptions apply to the use of the hybrid  
driver for IGBTs as well as for power MOSFETs. For the  
reason of shortness, only IGBTs will be mentioned in the  
following. The designations "collector" and "emitter" will refer  
to IGBTs, whereas for the MOSFETs "drain" and "source" are  
to be read instead.  
In case of short-circuit or too low supply voltage the  
integrated error memory is set and an error signal is  
generated.  
6
031127  
© by SEMIKRON  
SKHI 21 A, SKHI 22 A / B  
Error monitoring and error memory  
IGBT is turned off. VCEstat is the steady-state value of  
VCEref and is adjusted to the required maximum value for  
each IGBT by an external resistor RCE to be connected  
between the terminals CCE (S6/S15) and E (S9/S12). It  
may not exceed 10 V. The time constant for the delay of  
The error memory is set in case of under-voltage or short-  
circuit of the IGBTs. In case of short-circuit, an error signal  
is transmitted by the VCE-input via the pulse transformers  
to the error memory. The error memory will lock all  
switching pulses to the IGBTs and trigger the error output  
(P10) of the driver. The error output consists of an open  
collector transistor, which directs the signal to earth in  
case of error. SEMIKRON recommends the user to  
provide for a pull-up resistor directly connected to the  
error evaluation board and to adapt the error level to the  
desired signal voltage this way. The open collector  
transistor may be connected to max. 30 V / 15 mA. If  
several SKHI 22Bs are used in one device, the error  
terminals may also be paralleled.  
VCEref may be increased by an external capacitor CCE  
,
which is connected in parallel to RCE. It controls the time  
tmin which passes after turn-on of the IGBT before the  
VCE-monitoring is activated. This makes possible any  
adaptation to the switching behavior of any of the IGBTs.  
After tmin has passed, the VCE-monitoring will be triggered  
as soon as VCE > VCEref and will turn off the IGBT.  
External components and possible adjust-  
ments of the hybrid driver  
ATTENTION: Only the SKHI 22A / 21A is equipped with  
an internal pull-up resistor of 10 kversus VS. The  
SKHI 22B does not contain an internal pull-up resistor.  
Fig. 1 shows the required external components for  
adjustment and adaptation to the power module.  
VCE - monitoring adjustment  
The error memory may only be reset, if no error is pending  
and both cycle signal inputs are set to low for > 9 µs at the  
same time.  
The external components RCE and CCE are applied for  
adjusting the steady-state threshold and the short-circuit  
monitoring dynamic. RCE and CCE are connected in  
parallel to the terminals CCE (S15/ S6) and E (S12/ S9) .  
Pulse transformer set  
The transformer set consists of two pulse transformers  
one is used bidirectional for turn-on and turn-off signals of  
the IGBT and the error feedback between primary and  
secondary side, the other one for the DC/DC-converter.  
The DC/DC-converter serves as potential-separation and  
power supply for the two secondary sides of the driver.  
The isolation voltage for the "H4"-type is 4000 VAC and  
2500 VAC for all other types.  
8
7
6
1200V (min)  
1200V (typ)  
1200V (max)  
1700V (min)  
1700V (typ)  
1700V (max)  
5
4
3
2
1
0
The secondary side consists of two symmetrical  
driver switches integrating the following compon-  
ents:  
10  
20  
30  
RCE / kOhm  
40  
50  
Supply voltage  
Fig. 4 VCEstat in dependence of RCE (Tamb = 25°C)  
The voltage supply consists of a rectifier, a capacitor, a  
voltage controller for - 7 V and + 15 V and a + 10 V  
reference voltage.  
Dimensioning of RCE and CCE can be done in three steps:  
Gate driver  
1. Calculate the maximum forward voltage from the  
datasheet of the used IGBT and determine VCEstat  
The output transistors of the power drivers are  
MOSFETs. The sources of the MOSFETs are separately  
connected to external terminals in order to provide setting  
of the turn-on and turn-off speed by the external resistors  
RON and ROFF. Do not connect the terminals S7 with S8  
and S13 with S14, respectively. The IGBT is turned on by  
2. Calculate approximate value of RCE according to  
equation (1) or (1.1) from VCEstat or determine RCE by  
using fig.4.  
3. Determine tmin and calculate CCE according to  
equations (2) and (3).  
the driver at + 15 V by RON and turned off at - 7 V by ROFF  
.
RON and ROFF may not chosen below 3 . In order to  
ensure locking of the IGBT even when the driver supply  
voltage is turned off, a 22 k-resistor versus the emitter  
Typical values are  
for 1200 V IGBT: VCEstat = 5 V; tmin = 1,45 µs,  
output (E) has been integrated at output GOFF  
.
R
CE = 18 k, CCE = 330 pF  
for 1700 V IGBT: VCEstat = 6 V; tmin = 3 µs,  
CE = 36 k, CCE = 470 pF  
Adaptation to 1700 V IGBT  
VCE-monitoring  
The VCE-monitoring controls the collector-emitter voltage  
VCE of the IGBT during its on-state. VCE is internally  
limited to 10 V. If the reference voltage VCEref is exceeded,  
the IGBT will be switched off and an error is indicated.  
R
The reference voltage VCEref may dynamically be adapted When using 1700 V IGBTs it is necessary to connect a  
1
k/ 0,4 W adaptation resistor between the VCE  
-
to the IGBTs switching behaviour. Immediately after turn-  
on of the IGBT, a higher value is effective than in the  
steady state. This value will, however, be reset, when the  
terminal (S20/ S1) and the respective collector.  
© by SEMIKRON  
031127  
7
SKHI 21 A, SKHI 22 A / B  
Adaptation to error signal level  
SEMIKRON recommends to start-up operation using the  
values recommended by SEMIKRON and to optimize the  
values gradually according to the IGBT switching  
behaviour and overvoltage peaks within the specific  
circuitry.  
An open collector transistor is used as error terminal,  
which, in case of error, leads the signal to earth. The  
signal has to be adapted to the evaluation circuit's voltage  
level by means of an externally connected pull-up  
resistor. The maximum load applied to the transistor shall  
be 30 V / 15 mA.  
Driver performance and application limits  
The drivers are designed for application with halfbridges  
As for the SKHI 22A / 21A a 10 kpull-up resistor versus and single modules with a maximum gate charge QGE  
VS (P13) has already been integrated in the driver.  
<
4
µC (see fig. 6).  
IGBT switching speed adjustment  
The charge necessary to switch the IGBT is mainly  
depending on the IGBT's chip size, the DC-link voltage  
and the gate voltage.  
The IGBT switching speed may be adjusted by the  
resistors RON and ROFF. By increasing RON the turn-on  
speed will decrease. The reverse peak current of the free-  
wheeling diode will diminish. SEMIKRON recommends to  
adjust RON to a level that will keep the turn-on delay time  
td(on) of the IGBT < 1 µs.  
This correlation is also shown in the corresponding  
module datasheet curves.  
It should, however, be considered that the SKHI 22B is  
turned on at + 15 V and turned off at - 7 V. Therefore, the  
gate voltage will change by 22 V during every switching  
procedure.  
By increasing ROFF the turn-off speed of the IGBT will  
decrease. The inductive peak overvoltage during turn-off  
will diminish.  
Unfortunately, most datasheets do not indicate negative  
gate voltages. In order to determine the required charge,  
the upper leg of the charge curve may be prolonged to  
The minimum gate resistor value for ROFF and RON is 3 .  
Typical values for RON and ROFF recommended by  
SEMIKRON are given in fig. 5  
+
22 V for determination of approximate charge per  
switch.  
RGon RGoff  
CCE  
pF  
RCE  
kΩ  
RVCE  
kΩ  
SK-IGBT-Modul  
The medium output current of the driver is determined by  
the switching frequency and the gate charge. For the  
SKHI 22B the maximum medium output current is  
22  
22  
15  
12  
12  
10  
8,2  
6,8  
22  
22  
15  
12  
12  
10  
8,2  
6,8  
SKM 50GB123D  
SKM 75GB123D  
SKM 100GB123D  
SKM 145GB123D  
SKM 150GB123D  
SKM 200GB123D  
SKM 300GB123D  
SKM 400GA123D  
330  
330  
330  
330  
330  
330  
330  
330  
18  
18  
18  
18  
18  
18  
18  
18  
0
0
0
0
0
0
0
0
IoutAVmax  
<
40 mA.  
The maximum switching frequency fMAX may be  
calculated with the following formula, the maximum value  
however being 50 kHz due to switching reasons:  
4 104  
fMAX(kHz) = ------------------------  
QGE(nC)  
Fig. 6 shows the maximum rating for the output charge  
per pulse for different gate resistors.  
SKM 75GB173D  
SKM 100GB173D  
SKM 150GB173D  
SKM 200GB173D  
15  
12  
10  
8,2  
15  
12  
10  
8,2  
470  
470  
470  
470  
36  
36  
36  
36  
1
1
1
1
SKHI 22 A/B maximum rating for output charge per  
pulse  
4,50  
4,00  
Fig. 5 Typical values for external components  
3,50  
Rg=24 OHM; 3,86µC  
3,00  
Interlocking time adjustment  
Rg=18 OHM; 3,52µC  
2,50  
Rg=12 OHM; 3,07µC  
Rg=6 OHM, 2,50µC  
Rg=3 OHM, 2,18µC  
Fig. 3 shows the possible interlocking times between  
output1 and output2. Interlocking times are adjusted by  
connecting the terminals TDT1 (P5), TDT2 (P9) and  
SELECT (P6) either to earth/ GND (P7 and P14)  
according to the required function or by leaving them  
open.  
2,00  
1,50  
1,00  
0,50  
0,00  
0
10  
20  
30  
40  
50  
60  
f / kHz  
Fig. 6 Maximum rating for output charge per pulse  
A typical interlocking time value is 3,25 µs (P9 = GND; P5  
and P6 open). For SKHI 22A / 21A the terminals TDT1  
(P5) and SELECT (P6) are not existing. The interlocking  
time has been fixed to 3,25 µs and may only be increased  
to 4,25 µs by connecting TDT2 (P9) to VS (P13).  
Further application notes  
The CMOS-inputs of the hybrid driver are extremely  
sensitive to over-voltage. Voltages higher than VS  
+
0,3 V or below – 0,3 V may destroy these inputs.  
ATTENTION: If the terminals TDT1 (P5), TDT2 (P9) and  
SELECT (P6) are not connected, eventually connected  
track on PC-board may not be longer than 20 mm in order  
to avoid interferences.  
Therefore, control signal over-voltages exceeding the  
above values have to be avoided.  
Please provide for static discharge protection during  
handling. As long as the hybrid driver is not completely  
8
031127  
© by SEMIKRON  
SKHI 21 A, SKHI 22 A / B  
assembled, the input terminals have to be short-circuited.  
Persons working with CMOS-devices have to wear a  
grounded bracelet. Any synthetic floor coverings must not  
be statically chargeable. Even during transportation the  
input terminals have to be short-circuited using, for  
example, conductive rubber. Worktables have to be  
grounded. The same safety requirements apply to  
MOSFET- and IGBT-modules!  
The connecting leads between hybrid driver and the  
power module should be as short as possible, the driver  
leads should be twisted.  
Any parasitic inductances within the DC-link have to be  
minimized. Over-voltages may be absorbed by C- or  
RCD-snubbers between the main terminals for PLUS and  
MINUS of the power module.  
When first operating  
a
newly developed circuit,  
SEMIKRON recommends to apply low collector voltage  
and load current in the beginning and to increase these  
values gradually, observing the turn-off behaviour of the  
free-wheeling diode and the turn-off voltage spikes  
generated accross the IGBT. An oscillographic control will  
be necessary. In addition to that the case temperature of  
the module has to be monitored. When the circuit works  
correctly under rated operation conditions, short-circuit  
testing may be done, starting again with low collector  
voltage.  
It is important to feed any errors back to the control circuit  
and to switch off the device immediately in such events.  
Repeated turn-on of the IGBT into a short circuit with a  
high frequency may destroy the device.  
Mechanical fixing on PCB:  
In applications with mechanical vibrations (vehicles)2 do  
not use a ty-rap for fixing the driver, but - after soldering  
and testing - apply special glue. Recommended types:  
CIBA GEIGY XP 5090 + 5091; PACTAN 5011; WACKER  
A33 (ivory) or N199 (transparent), applied around the  
case edge (forms a concave mould). The housing may  
not be pressed on the PCB; do not twist the PCB with the  
driver soldered on, otherwise the internal ceramics may  
crack. The driver is not suitable for big PCBs.  
SEMIKRON offers a printed circuit board (PCB) type  
SKPC2006 compatible for mounting a SKHI 21A or  
SKHI 22A. This PCB contains the necessary tracks to  
connect the external capacitors CCE and resistors RCE  
Ron, Roff (see fig. 1).  
,
The PCB may directly be plugged to SEMITRANS 3-IGBT  
modules and be fixed to the heatsink by 3 thread bolts.  
Dimensions: L x W x H = 96 x 67 x 1,5 mm.  
For further details please contact SEMIKRON.  
2. tested acceleration (x; y; z-axis):10-100 Hz: 1,5 g;  
shock: 5 g (TÜV according to LES-DB-BN 411002)  
This technical information specifies devices but promises no characteristics. No warranty or guarantee expressed or implied is made  
regarding delivery, performance or suitability.  
© by SEMIKRON  
031127  
9

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