SKIIP802GAB061-259CTVF [SEMIKRON]
Half Bridge Based Peripheral Driver, 826A;
| 型号： | SKIIP802GAB061-259CTVF |
| 厂家： | 
SEMIKRON INTERNATIONAL |
| 描述： | Half Bridge Based Peripheral Driver, 826A 驱动 接口集成电路 |
| 文件： | 总3页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SKiiP 802 GB 061 - 259 CTV
Absolute Maximum Ratings
SKiiPPACK
SK integrated intelligent
Power PACK
halfbridge
Symbol Conditions 1)
Values
2500
Units
V
4)
Visol
AC, 1min
Top ,Tstg
Operating / stor. temperature
-25...+85
°C
SKiiP
802 GB 061 - 259 CTV 7,9)
IGBT and Inverse Diode
VCES
600
400
800
V
V
A
°C
A
Preliminary Data
Case S2
5)
VCC
IC
Tj
Operating DC link voltage
IGBT
IGBT + Diode
Diode
3)
-40...+150
800
IF
IFM
IFSM
Diode, tp < 1 ms
Diode, Tj = 150 °C, 10ms; sin
1600
8000
320
A
A
I2t (Diode) Diode, Tj = 150 °C, 10ms
Driver
kAs2
VS1
VS2
fsmax
dV/dt
Stabilized Power Supply
Non-stabilized Power Supply
Switching frequency
18
30
20
75
V
V
kHz
kV/µs
Primary to secondary side
Characteristics
Symbol Conditions 1)
min.
typ.
max.
Units
Features
IGBT11)
V(BR)CES
• Short circuit protection, due to
evaluation of current sensor
signals
Driver without supply
V
mA
mA
≥VCES
−
−
12
−
0,8
−
0,94
2,1
2,6
ICES
VGE = 0,
CE = VCES
Tj = 25 °C
Tj = 125 °C
−
−
−
−
−
−
−
V
• Isolated power supply
• Low thermal impedance
• Optimal thermal management
with integrated heatsink
• Pressure contact technology
with increased power cycling
capability, compact design
• Low stray inductance
• High power, small losses
• Over-temperature protection
VTO
rT
VCesat
VCesat
Tj = 125 °C
Tj = 125 °C
IC = 800A,
IC = 800A,
V
−
−
−
−
−
mΩ
V
V
Tj = 125 °C
Tj = 25 °C
2,60
72/102
Eon + Eoff VCC=300/400V,IC=800A
Tj = 125 °C
mJ
CCHC
LCE
per Phase, AC side
Top, Bottom
1,6
7,5
nF
nH
−
−
−
−
Inverse Diode 2)
1)
Theatsink = 25 °C, unless
VF = VEC IF= 800A;
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
1,72
1,75
24
0,78
1,2
V
V
mJ
V
−
−
−
−
−
−
−
−
−
−
otherwise specified
CAL = Controlled Axial Lifetime
VF= VEC
IF= 800A
2)
Eon + Eoff IF= 800A;
Technology (soft and fast)
without driver
Driver input to DC link /
3)
VTO
rT
Tj = 125 °C
Tj = 125 °C
4)
mΩ
AC output to DC link / AC
output to heatsink
with Semikron-DC link (low
inductance)
other heatsinks on request
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
AC connection busbars must be
Thermal Characteristics
10)
Rthjs
Rthjs
Rthsa
per IGBT
per Diode
P16 heatsink; see case S2
0,050
0,094
44
K/W
K/W
K/KW
−
−
−
−
−
−
5)
10)
6,10)
6)
Driver
IS1
IS2
7)
Supply current 15V-supply
Supply current 24V-supply
Interlock-time
210+390*fs /fsmax+1,3*IAC/A
160+290*fs /fsmax+1,0*IAC/A
2,3
mA
mA
µs
8)
tinterlock-driver
SKiiPPACK protection
connected by the user; copper
busbars available on request
options available for driver:
U - DC link voltage sense
F – Fiber optic connector
“s” referenced to temperature
ITRIPSC
ITRIPLG
TTRIP
Short circuit protection
826
A
A
°C
V
9)
Ground fault protection
Over-temp. protection
UDC-protection
115
410
9)
UDCTRIP
10)
Mechanical Data
sensor
M1
DC terminals, SI Units
4
8
6
10
Nm
Nm
−
−
11)
NPT-technology with homo-
M2
AC terminals, SI Units
genous current-distribution
by SEMIKRON
B 7 − 24
0898
PIN-array - halfbridge driver SKiiPPACK 2-fold type “GB”
X1:
Pin
1
signal
remark
shield
connected to GND, when shielded cable is used
2
BOT IN4)
positive 15V CMOS logic; 10 kΩ impedance,
don´t connect when using fiber optic
3
ERROR OUT1)
LOW = NO ERROR; open Collector Output;
max. 30 V / 15 mA
don´t connect when using fiber optic,
propagation delay 1 µs
min. pulsewidth error-memory-reset 8 µs
4
5
TOP IN4)
positive 15V CMOS logic; 10 kΩ impedance
don´t connect when using fiber optic
Overtemp. OUT1)
LOW = NO ERROR = ϑDCB < 115 + 5°C
open collector Output; max. 30 V / 15 mA
„low“ output voltage < 0,6 V
„high“ output voltage max. 30 V
6
7
+ 24 VDC IN
+ 24 VDC IN
24 VDC (20 - 30 V)
don´t supply with 24 V, when using + 15 VDCIN
supply voltage monitoring threshold 19,5 V
8
9
+ 15 VDC IN
+ 15 VDC IN
15 VDC + 4 %
don´t supply with 15 V, when using + 24 VDCIN
supply voltage monitoring threshold 13 V
10
11
12
GND
GND
GND for power supply and
GND for digital signals
Temp. analog OUT or UDC when using option “U”
U
DC analog OUT2)
actual DC-link voltage, 9 V refer to UDCmax
max. output current 5 mA; overvoltage trip level 9 V
13
14
GND aux3)
GND for analog signals
I analog OUT
current actual value, 8,0 V refer to IC @ 25 °C
overcurrent trip level 10 V
125 % IC @ 25 °C
SKiiP is source
SKiiP is sink
current value > 0
current value < 0
X10: halfbridge 1 (HB1) OUT X11: halfbridge 2 (HB2) OUT
Pin Signal
Pin Signal
1
2
1
2
Temp.-Sensor (HB2)1
Temp.-Sensor (HB2)2
8
Collector TOP (HB1)
8
Collector TOP (HB2)
11 Gate TOP (HB1)
12 Emitter TOP (HB1)
13 Collector BOT (HB1)
11 Gate TOP (HB2)
12 Emitter TOP (HB2)
13 Collector BOT (HB2)
16 Gate BOT (HB1)
16 Gate BOT (HB2)
17 Emitter BOT (HB1)
17 Emitter BOT (HB2)
1) Open collector output, external pull
up resistor necessary
type “GAL”
as type “GB” except
- PIN X1-4: connect this pin to GND
- TOP switch does not exist
type “GAR”
as type “GB” except
- PIN X1-2: connect this pin to GND
- BOTTOM switch does not exist
2) When using option “U” the analog
temperature signal is not available
3) GND aux = reference for analog
output signals
4) „high“ (min) 11,2 V
„low“ (max) 5,4 V
© by SEMIKRON
0898
B 7 – 10
Case S2
SKiiPPACK 2 - GB; GH
Weight without heatsink: 1,85 kg
P16: 4,7 kg
SKiiPPACK 2 - GB with F-option
© by SEMIKRON
0898
B 7 – 2
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