SKYPER42R_技术文档

SKYPER 42 R

Absolute Maximum Ratings

Symbol Conditions

Values

Unit

V_s

Supply voltage primary

Input signal voltage (HIGH)

Input signal voltage (LOW)

Output peak current

16

Vs + 0.3

GND - 0.3

30

V

V_iH

V_iL

V

Iout_PEAK

A

Iout_AVmaxOutput average current

150

mA

kHz

f_max

Max. switching frequency

100

SKYPER^®

Collector emitter voltage sense across

the IGBT

V_CE

1700

100

V

Rate of rise and fall of voltage

secondary to primary side

dv/dt

kV/µs

IGBT Driver Core

Isolation test voltage input - output (AC,

rms, 2s)

V_{isol IO}

V_isolPD

V_isol12

4000

1500

V

Partial discharge extinction voltage,

rms, Q_PDb 10pC

SKYPER 42 R

Preliminary Data

Isolation test voltage output 1 - output 2

(AC, rms, 2s)

Features

Minimum rating for external R_Gon

Minimum rating for external R_Goff

Max. rating for output charge per pulse

Operating temperature

R_{Gon min}

R_{Goff min}

Q_out/pulse

T_op

0.8

!

• Two output channels

• Integrated potential free power supply

• Under voltage protection

• Drive interlock top / bottom

• Dynamic short cirucit protection

• Shut down input

50

µC

°C

-40 ... 85

T_stg

Storage temperature

• Failure management

Characteristics

• IEC 60068-1 (climate) 40/085/56, no

condensation and no dripping water

permitted, non-corrosive, climate class

3K3 acc. EN60721

Symbol Conditions

min.

typ.

max.

15.6

800

Unit

V_s

Supply voltage primary side

14.4

15

V

mA

V

I_SO

Supply current primary (no load)

Supply current primary side (max.)

Input signal voltage on / off

125

Typical Applications*

• Driver for IGBT modules in bridge

circuits in industrial application

• DC bus voltage up to 1200V

V_i

15 / 0

V_IT+

V_IT-

Input treshold voltage HIGH

Input threshold voltage (LOW)

12.3

V

4.6

V

Footnotes

Input resistance (switching/HALT

signal)

R_IN

10

k!

Isolation test voltage with external high

voltage diode

V_G(on)

V_G(off)

f_ASIC

Turn on output voltage

15

-8

8

V

The isolation test is not performed as a

series test at SEMIKRON

Turn off output voltage

Asic system switching frequency

Input-output turn-on propagation time

Input-output turn-off propagation time

Error input-output propagation time

MHz

µs

The driver power can be expanded to 50µC

with external boost capacitors

t_d(on)IO

t_d(off)IO

t_d(err)

1.1

2.3

9

µs

Isolation coordination in compliance with

EN50178 PD2

µs

t_pERRRESETError reset time

µs

Operating temperature is real ambient

temperature around the driver core

Degree of protection: IP00

t_TD

Top-Bot interlock dead time

2

µs

C_ps

w

Coupling capacitance prim sec

weight

3

pF

g

MTBF

2.1

10⁶h

This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1,

Chapter IX

* The specifications of our components may not be considered as an assurance of component

characteristics. Components have to be tested for the respective application. Adjustments may

be necessary. The use of SEMIKRON products in life support appliances and systems is

subject to prior specification and written approval by SEMIKRON. We therefore strongly

recommend prior consultation of our staff.

Driver Core

Rev. 5 – 05.04.2011

1

SKYPER^®42 R

Technical Explanations

Revision

Status:

Prepared by:

05

preliminary

Johannes Krapp

This Technical Explanation is valid for the following parts:

Related Documents:

title:

part number:

date code (YYWW):

L5054301

>CW16

Data Sheet SKYPER 42 R

SKYPER^®42 R

Content

1.

Introduction.............................................................................................................................................. 2

2.

Application and Handling Instructions.................................................................................................. 3

General Instructions................................................................................................................................... 3

Mechanical Instructions ............................................................................................................................. 3

2.1.

2.2.

3.

Driver Interface ........................................................................................................................................ 5

Controller Interface – Primary Side Pinning .............................................................................................. 5

Controller Interface – Primary Side Connection ........................................................................................ 6

Module interface – Secondary Side........................................................................................................... 7

Module interface – Secondary Side Connection ....................................................................................... 8

Power supply - Primary.............................................................................................................................. 9

Gate driver signals – Primary .................................................................................................................... 9

Shut Down Input (SDI) - Primary............................................................................................................. 10

Gate resistors - Secondary...................................................................................................................... 10

External Boost Capacitors (BC) -Secondary........................................................................................... 11

3.1.

3.2.

3.3.

3.4.

3.5.

3.6.

3.7.

3.8.

3.9.

4.

Protection features................................................................................................................................ 11

Failure Management................................................................................................................................ 11

Under Voltage Protection of driver power supply (UVP) ......................................................................... 12

Short Pulse Suppression (SPS) .............................................................................................................. 12

Dead Time generation (Interlock TOP / BOT) (DT)................................................................................. 12

Dynamic Short Circuit Protection by VCEsat monitoring (DSCP) ........................................................... 13

4.1.

4.2.

4.3.

4.4.

4.5.

5.

Electrical Characteristic........................................................................................................................ 15

Driver Performance.................................................................................................................................. 15

Insulation ................................................................................................................................................. 15

5.1.

5.2.

6.

7.

Environmental Conditions.................................................................................................................... 16

Marking................................................................................................................................................... 17

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2011-04-04 – Rev05

SKYPER^®42 R

Please note:

Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in

large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating

parameters should be validated by user’s technical experts for each application.

1. Introduction

The SKYPER 42 core constitutes an interface between IGBT modules and the controller. This core is a half

bridge driver. Basic functions for driving, potential separation and protection are integrated in the driver. Thus it

can be used to build up a driver solution for IGBT modules. SKYPER 42 R is developed for systems in the

power range of 1 MVA – 8 MVA.

ꢀ

Two output channels

SKYPER 42 R

Up to 50 µC gate charge

Integrated potential free power supply for the secondary side

Short Pulse Suppression (SPS)

Under Voltage Protection (UVP)

Drive interlock (dead time) top / bottom (DT)

Dynamic Short Circuit Protection (DSCP) by V_CEmonitoring and

direct switch off

ꢀ

Shut Down Input (SDI)

Failure Management

Expandable by External Boost Capacitors (BC)

DC bus voltage up to 1200V

Block diagram of SKYPER 42 R

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2011-04-04 – Rev05

SKYPER^®42 R

2. Application and Handling Instructions

2.1. General Instructions

ꢀ

Please provide for static discharge protection during handling. As long as the driver is not completely

assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a

grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during

transportation the input terminals have to be short-circuited using, for example, conductive rubber.

Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.

ꢀ

When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and

load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the

free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will

be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works

correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector

voltage.

2.2. Mechanical Instructions

Dimensions – 69 x 80 x 19 + Holes – bottom view

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2011-04-04 – Rev05

SKYPER^®42 R

ꢀ

For integrating the SKYPER 42 R driver core in to an inverter system an adaptor board has to be built.

SEMIKRON offers a wide range of adaptor boards, e.g. for SEMiX, Semitrans or SKiM modules.

SEMIKRON offers in addition a customer specific adaptor board on demand. Please contact your

responsible sales for further information.

Adaptor boards for SKYPER 42 R

ꢀ

SKYPER 42 R can be plugged or soldered on the adaptor board.

Soldering Hints

ꢀ

The temperature of the solder must not exceed 260°C, and solder time must not exceed 10 seconds.

The ambient temperature must not exceed the specified maximum storage temperature of the driver.

The solder joints should be in accordance to IPC A 610 Revision D (or later) - Class 3 (Acceptability of Electronic Assemblies) to

ensure an optimal connection between driver core and printed circuit board.

ꢀ

The driver is not suited for hot air reflow or infrared reflow processes.

Use of Support Posts

The connection between driver core and printed circuit

board should be mechanical reinforced by using support

posts.

The driver board has got three holes for supports posts.

Using support posts with external screw thread improves

mechanical assembly.

Product information of suitable support posts and

distributor contact information is available at e.g.

http://www.richco-inc.com or http://www.ettinger.de.

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2011-04-04 – Rev05

SKYPER^®42 R

3. Driver Interface

3.1.

Controller Interface – Primary Side Pinning

Connectors

Connector X10, X11 (RM2,54, 10pin)

0,25mm unless otherwise noted

Signal

Function

Specification

X10:01

Reserved

X10:02

X10:03

Reserved

LOW = NO ERROR; open

collector output; max. 30V / 15mA

(external pull up resistor

necessary)

PRIM_nERROR_OUT ERROR output

5V logic; LOW active;

High Max = 3,8V;

Low Min = 1,5V;

X10:04

PRIM_nERROR_IN

ERROR input

X10:05

X10:06

PRIM_PWR_GND

GND for power supply and GND for digital signals

Digital 15 V; 10 kOhm impedance;

LOW = TOP switch off;

HIGH = TOP switch on

X10:07

X10:08

PRIM_TOP_IN

PRIM_BOT_IN

Switching signal input (TOP switch)

Digital 15 V; 10 kOhm impedance;

LOW = BOT switch off;

HIGH = BOT switch on

Switching signal input (BOTTOM switch)

Stabilised +15V 4%

X10:09

X10:10

PRIM_PWR_15P

Reserved

Drive core power supply

X11:01,

02, 05-08

X11:03,

PRIM_PWR_GND

GND for power supply and GND for digital signals

04,09,10

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2011-04-04 – Rev05

SKYPER^®42 R

3.2.

Controller Interface – Primary Side Connection

Application example

Pins X10:01-02 and X11:01-02; X11:05-08 are reserved. Do not connect. Non binding recommendation for: R_ERROR=4,75kꢀ; C_FILTER=1nF.

ꢀ A capacitor is connected to the input of the gate driver to obtain high noise immunity. With current limited line

drivers, this capacitor can cause a small delay of a few ns. The capacitors have to be placed as close to the

gate driver interface as possible.

ꢀ Signal cable should be placed as far away as possible from power terminals, power cables, ground cables,

DC-link capacitors and all other noise sources.

ꢀ Control signal cable should not run parallel to power cable. The minimum distance between control signal

cable and power cable should be 30cm and the cables should cross vertically only.

ꢀ It is recommended that all cables be kept close to ground (e.g. heat sink or the likes).

ꢀ In noise intensive applications, it is recommended that shielded cables or fibre optic interfaces be used to

improve noise immunity.

ꢀ Use a low value capacitor (1nF) between signal and power supply ground of the gate driver for differential-

mode noise suppression.

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2011-04-04 – Rev05

SKYPER^®42 R

3.3.

Module interface – Secondary Side

Connectors

Connector X100 / X200 (RM2,54, 10pin)

0,25mm unless otherwise noted

Signal

Function

Specification

X100:01

SEC_TOP_VCE_CFG

Input reference voltage adjustment for Vce monitoring TOP

X100:02

X100:03

X100:04

X100:05

X100:06

X100:07

X100:08

X100:09

X100:10

X200:01

X200:02

X200:03

X200:04

X200:05

X200:06

X200:07

X200:08

X200:09

X200:10

SEC_TOP_VCE_IN

SEC_TOP_15P

Input V_CEmonitoring TOP

Output power supply for external buffer capacitors

GND for power supply and GND for digital signals

Switch on signal TOP IGBT

Stabilised +15V

SEC_TOP_15P

SEC_TOP_GND

SEC_TOP_IGBT_ON

SEC_TOP_GND

GND for power supply and GND for digital signals

SEC_TOP_IGBT_OFF Switch off signal TOP IGBT

SEC_TOP_8N

Output power supply for external buffer capacitors

Stabilised -7V

SEC_TOP_8N

Output power supply for external buffer capacitors

Input reference voltage adjustment for Vce monitoring BOT

Input V_CEmonitoring BOT

SEC_BOT_VCE_CFG

SEC_BOT_VCE_IN

SEC_BOT_15P

Output power supply for external buffer capacitors

GND for power supply and GND for digital signals

Switch on signal BOT IGBT

Stabilised +15V

SEC_BOT_15P

SEC_BOT_GND

SEC_BOT_IGBT_ON

SEC_BOT_GND

GND for power supply and GND for digital signals

SEC_BOT_IGBT_OFF Switch off signal BOT IGBT

SEC_BOT_8N

Output power supply for external buffer capacitors

Stabilised -7V

Output power supply for external buffer capacitors

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2011-04-04 – Rev05

SKYPER^®42 R

3.4.

Module interface – Secondary Side Connection

Application example

SKYPERꢁ42ꢁR

USERꢁINTERFACE

X100:01ꢁReferenceꢁforꢁV_CE

X100:02ꢁInputꢁV_CE

ErrorꢁProcessingꢁTOP

X100:03;04ꢁPSꢁforꢁBC,+15V

ꢂ VCEꢁmonitoring

18,2k

337pF

R_GON

X100:05ꢁGND

X

1

0

X100:08ꢁSwitchꢁon

X100:07ꢁGND

PowerꢁDriver

TOP

R_GOFF

X100:09ꢁSwitchꢁoff

10k

Power

Supply

TOP

16ꢃF

X100:09;10ꢁPSꢁforꢁBC,ꢂ7V

Power

Supply

BOT

X200:01ꢁReferenceꢁforꢁV_CE

X200:02ꢁInputꢁV_CE

X200:03;04ꢁPSꢁforꢁBC,+15V

18,2k

337pF

R_GON

X

2

0

X200:05ꢁGND

PowerꢁDriver

BOT

X200:08ꢁSwitchꢁon

X200:07ꢁGND

R_GOFF

X200:09ꢁSwitchꢁoff

10k

ErrorꢁProcessingꢁBOT

16ꢃF

ꢂ VCEꢁmonitoring

16ꢃF

X200:09;10ꢁPSꢁforꢁBC,ꢂ7V

Application example for 1200V IGBT, V_CEref=6,7V, t_BL=2,3µs, Q_out/pulse= 4µC.

ꢀ Any parasitic inductances within the DC-link have to be minimized. Overvoltages may be absorbed by C- or

RCD-snubbers between main terminals (plus and minus) of the power module.

ꢀ Make power patterns short and thick to reduce stray inductance and stray resistance.

ꢀ The connecting leads between gate driver and IGBT module must be kept as short as possible (max. 20cm).

ꢀ Gate wiring for top and bottom IGBT or other phases must not be bundled together.

ꢀ It is recommended that a 10kꢀ resistor (RGE) be placed between the gate and emitter. If wire connection is

used, do not place the RGE between printed circuit board and IGBT module. RGE has to be placed very close

to the IGBT module.

ꢀ Use a suppressor diode (back-to-back Zener diode) between gate and emitter. The diode has to be placed

very close to the IGBT module.

ꢀ The use of a capacitor (CGE) between gate and emitter can be advantageous, even for high-power IGBT

modules and parallel operation. The CGE should be approximately 10% of the CGE of the IGBT used. The

CGE has to be placed very close to the IGBT module.

ꢀ Current loops must be avoided.

ꢀ External boost capacitors must be placed as close to the gate driver as possible in order to minimize parasitic

inductance.

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2011-04-04 – Rev05

SKYPER^®42 R

3.5.

Power supply - Primary

Requirements of the auxiliary power supply

Regulated power supply

Please note:

+15V 4%

150ms

Do not apply switching

signals during power on

reset.

Maximum rise time of auxiliary power supply

Power on reset completed after

56ms

ꢀ

The same power supply used for SKYPER 32 can be taken

The supplying switched mode power supply may not be turned-off for a short time as consequence of

its current limitation. Its output characteristic needs to be considered. Switched mode power supplies

with fold-back characteristic or hiccup-mode can create problems if no sufficient over current margin is

available. The voltage has to rise continuously.

ꢀ

If the power supply is able to provide a higher current, a peak current will flow in the first instant to

charge up the input capacitances on the driver. Its peak current value will be limited by the power

supply and the effective impedances (e.g. distribution lines), only.

ꢀ

The driver error signal PRIM_nERROR_OUT is operational after 56ms. Without any error present, the

error signal will be reset.

To assure a high level of system safety the TOP and BOT signal inputs should stay in a defined state

(OFF state, LOW) during driver turn-on time. Only after the end of the power-on-reset, IGBT switching

operation shall be permitted.

3.6.

Gate driver signals – Primary

The signal transfer to each IGBT is made with pulse transformers, used for switching on and switching off of the

IGBT. The inputs have a Schmitt Trigger characteristic and a positive / active high logic (input HIGH = IGBT on;

input LOW = IGBT off).

It is mandatory to use circuits which switch active to +15V and 0V. Pull up and open collector output stages

must not be used for TOP / BOT control signals. It is recommended choosing the line drivers according to the

demanded length of the signal lines. The duty cycle of the driver can be adjusted between 0 – 100%. It is not

permitted to apply switching pulses shorter than 1µs.

TOP / BOT Input

A capacitor is connected to the input

to obtain high noise immunity. This

capacitor can cause for current

limited line drivers a little delay of few

ns, which can be neglected. The

capacitors have to be placed as

close as possible to the driver

interface.

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2011-04-04 – Rev05

SKYPER^®42 R

3.7.

Shut Down Input (SDI) - Primary

The shut down input / error input signal can gather error signals of other hardware components for switching off

the IGBT (input HIGH = no turn-off; input LOW = turn-off).

Connection SDI

Hints

ꢀ A LOW signal at PRIM_nERROR_IN will set the error latch and

force the output PRIM_nERROR_OUT into HIGH state.

Switching pulses from the controller will be ignored.

ꢀ The SDI function can be disabled by no connection or

connecting to 5V.

3.8.

Gate resistors - Secondary

The output transistors of the driver are MOSFETs. The sources of the MOSFETs are separately connected to

external terminals in order to provide setting of the turn-on and turn-off speed of each IGBT by the external

resistors R_Gonand R_Goff. As an IGBT has input capacitance (varying during switching time) which must be

charged and discharged, both resistors will dictate what time must be taken to do this. The final value of the

resistance is difficult to predict, because it depends on many parameters as DC link voltage, stray inductance of

the circuit, switching frequency and type of IGBT.

Connection R_Gon, R_Goff

Application Hints

ꢀ The gate resistor influences the switching time, switching losses,

dv/dt behaviour, etc. and has to be selected very carefully. The

gate resistor has to be optimized according to the specific

application.

ꢀ By increasing R_Gonthe turn-on speed will decrease. The reverse

peak current of the free-wheeling diode will diminish.

ꢀ By increasing R_Goffthe turn-off speed of the IGBT will decrease.

The inductive peak over voltage during turn-off will diminish.

ꢀ In order to ensure locking of the IGBT even when the driver

supply voltage is turned off, a resistance (R_GE) has to be

integrated.

ꢀ Tpically, IGBT modules with a large current rating will be driven

with smaller gate resistors and vice versa.

ꢀ Te value of gate resistors will be between the value indicated in

the IGBT data sheet and roughly twice this value.

ꢀ In most applications, the turn-on gate resistor RG(on) is

ꢀ smaller than the turn-off gate resistor RG(off).

ꢀ Depending on the individual parameters, RG(off) can be roughly

twice the RG(on) value.

ꢀ

Place the gate resistances for turn-on and turn-off close

together.

Please note:

Do not connect the terminals SEC_TOP_IGBT_ON with SEC_TOP_IGBT_OFF and SEC_BOT_IGBT_ON

with SEC_BOT_IGBT_OFF, respectively.

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2011-04-04 – Rev05

SKYPER^®42 R

3.9.

External Boost Capacitors (BC) -Secondary

The rated gate charge of the driver may be increased by additional boost capacitors to drive IGBT with large

gate capacitance.

Connection External Boost Capacitors

Dimensioning of C_boost

ꢀ SKYPER 42 R has internal gate capacitors of 2.5 µC

ꢀ Using external capacitors:

4µF = 1µC

ꢀ The boost capacitors on C15 and C-8 should be chosen with the

same values

ꢀ Please consider the maximum rating four output charge per

pulse of the gate driver.

ꢀ The external boost capacitors should be connected as close as

possible to the gate driver and to have low inductance.

4. Protection features

4.1.

Failure Management

Any error detected will set the error latch and force the output PRIM_nERROR_OUT into HIGH state. Switching

pulses from the controller will be ignored. Connected and switched off IGBTs remain turned off. The switched

off IGBTs remain turned off.

The output PRIM_nERROR_OUT is an open collector output. For the error evaluation an external pull-up-

resistor is necessary pulled-up to the positive operation voltage of the control logic (LOW signal = no error

present, wire break safety is assured).

Open collector error transistor

Application hints

ꢀ An external resistor to the controller logic high level is required.

The resistor has to be in the range of V / I_max< R_{pull_up}< 10kꢀ.

ꢀ Rest when TOP/BOT signals set to low for t_pERRRESET> 9µs

ꢀ PRIM_nERROR_OUT can operate to maximum 30V and can

switch a maximum of 15mA.

ꢀ Example:

For V = +15V the needed resistor should be in the range

R_{pull_up}= (15V/15mA) … 10kꢀ ⇒ 1kꢀ… 10kꢀ.

Please note:

The error output PRIM_ERROR_OUT is not short circuit proof.

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2011-04-04 – Rev05

SKYPER^®42 R

4.2.

Under Voltage Protection of driver power supply (UVP)

The internally detected supply voltage of the driver has an under voltage protection.

Supply voltage

UVP level

Regulated +15V 4%

Typ 13,5V

If the internally detected supply voltage of the driver falls below this level, the IGBTs will be switched off (IGBT

driving signals set to LOW). The input side switching signals of the driver will be ignored. The error memory will

be set, and the output PRIM_nERROR_OUT changes to the HIGH state.

4.3.

Short Pulse Suppression (SPS)

This circuit suppresses short turn-on and off-pulses of incoming signals. This way the IGBTs are protected

against spurious noise as they can occur due to bursts on the signal lines. Pulses shorter than 625ns are

suppressed and all pulses longer than 750ns get through for 100% probability. Pulses with a length in-between

625ns and 750ns can be either suppressed or get through.

Pulse pattern – SPS

short pulses

PRIM_TOP/BOT_INꢁ(HIGH)

PRIM_TOP/BOT_INꢁ(LOW)

SEC_TOP/BOT_IGBT_ON

SEC_TOP/BOT_IGBT_OFF

4.4.

Dead Time generation (Interlock TOP / BOT) (DT)

The DT circuit prevents, that TOP and BOT IGBT of one half bridge are switched on at the same time (shoot

through). The dead time is not added to a dead time given by the controller. Thus the total dead time is the

maximum of "built in dead time" and "controller dead time". It is possible to control the driver with one switching

signal and its inverted signal.

Please note:

The generated dead time is fixed at 2 µs and cannot be changed. Please contact your resonsible sales engineer for customization.

Pulse pattern – DT

ꢀ

The total propagation delay of the driver is the sum of

interlock dead time (t_TD) and driver input output signal

propagation delay (t_d(on;off)IO) as shown in the pulse pattern.

Moreover the switching time of the IGBT chip has to be taken

into account (not shown in the pulse pattern).

ꢀ

In case both channel inputs (PRIM_TOP_IN and

PRIM_BOT_IN) are at high level, the IGBTs will be turned off.

If only one channel is switching, there will be no interlock

dead time.

Please note:

No error message will be generated when overlap of switching signals occurs.

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2011-04-04 – Rev05

SKYPER^®42 R

4.5.

Dynamic Short Circuit Protection by VCEsat monitoring (DSCP)

The DSCP monitors the collector-emitter voltage V_CEof the IGBT during its on-state.

The reference voltage V_CErefmay dynamically be adapted to the IGBTs switching behaviour. Immediately after

turn-on of the IGBT, a higher value is effective than in steady state. V_CEstatis the steady-state value of V_CErefand

is adjusted to the required maximum value for each IGBT by an external resistor R_CE. It may not exceed 10V.

The time constant for the delay (exponential shape) of V_CErefmay be controlled by an external capacitor C_CE.It

controls the blanking time t_blwhich passes after turn-on of the IGBT before the V_CEsatmonitoring is activated.

Reference Voltage (V_CEref) Characteristic

After t_blhas passed, the V_CEmonitoring will be triggered as soon as V_CE> V_CErefand will turn off the IGBT. The

error memory will be set, and the output PRIM_nERROR_OUT changes to the HIGH state. Possible failure

modes are shows in the following pictures.

Short circuit during operation

Turn on of IGBT too slow *

Short circuit during turn on

* or adjusted blanking time too short

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2011-04-04 – Rev05

SKYPER^®42 R

Dimensioning of R_CEand C_CE

R

Conf

10⋅kΩ + R

U

R

:= 10.5⋅V⋅

(

Detect.1200V.Typ Conf

)

Conf

5.62

10.5⋅V

V :=

⋅10.5⋅V

V :=

1

2

6.62

5.62

V = 8.914V

V = 1.868V

1

2

R

Conf

U

R

:= V ⋅

− V

(

Detect.1700V.Typ Conf

1

2

10⋅kΩ + R

Conf

t

:= t

t := 5.62⋅kΩ⋅33⋅pF

D

Durchlauf.Komparator

1

− 9

t

= 185.46× 10

s

1

= 440× 10

s

R

⋅10⋅kΩ

15V − U

R





(

Detect.1200V.Typ Conf

)













Conf





R

, C

:=

⋅C

+ t ⋅ln

+ t

(

Ausblend.1200VTyp Conf Conf

)

Conf

1

D





10.5⋅V − U

R

+ 10⋅kΩ

(

Detect.1200V.Typ Conf

)

Conf







R

⋅10⋅kΩ

15V − U

R





(

Detect.1700V.Typ Conf

)













Conf



t

R

, C

⋅C

+ t ⋅ln

(

Ausblend.1700VTyp Conf Conf

1





10.5⋅V − U

R

+ 10⋅kΩ

(

Detect.1700V.Typ Conf

Conf





(

)

18.2⋅kΩ = 6.777V

U

t

Detect.1200V.Typ

− 6

(

)

18.2⋅kΩ, 337⋅pF = 2.31× 10

s

Ausblend.1200VTyp

If the DSCP function is not used, for example during the experimental phase, SEC_TOP_VCE_IN must be connected with

SEC_TOP_GND for disabling SCP @ TOP side and SEC_BOT_VCE_IN must be connected with SEC_BOT_GND for disabling SCP @

BOT side.

The high voltage during IGBT off state is blocked by a high voltage diode.

Connection High Voltage Diode

Characteristics

ꢀ

Reverse blocking voltage of the diode shall be higher than the

used IGBT.

Reverse recovery time of the fast diode shall be lower than V_CE

rising of the used IGBT.

Forward voltage of the diode: 1,5V @ 2mA forward current

(T_j=25°C).

A collector series resistance R_VCE(1kΩ / 0,4W) must be

connected for 1700V IGBT operation.

14

2011-04-04 – Rev05

SKYPER^®42 R

5. Electrical Characteristic

5.1. Driver Performance

The driver is designed for application with half bridges or single modules and a maximum gate charge per pulse

< 100C (2,5µC on the driver). The charge necessary to switch the IGBT is mainly depending on the IGBT’s chip

size, the DC-link voltage and the gate voltage. This correlation is shown in module datasheets. It should,

however, be considered that the driver is turned on at +15V and turned off at -8V. Therefore, the gate voltage

will change by 22V during each switching procedure. The medium output current of the driver is determined by

the switching frequency and the gate charge.

Calculation Switching Frequency

Maximum Switching Frequency @ different Gate Charges @ Tamb=25°C

100 kHz

Iout_AVmax

f_max

=

80 kHz

60 kHz

40 kHz

20 kHz

0 kHz

Q_GE

f_max

Iout_AVmax

Q_GE

:

Maximum switching frequency *

Maximum output average current

Gate charge of the driven IGBT

:

* @ T_amb=25°C

1 µC

10 µC

gate charge

100 µC

5.2. Insulation

Magnetic transformers are used for insulation between gate driver primary and secondary side. The transformer

set consists of pulse transformers which are used bidirectional for turn-on and turn-off signals of the IGBT and

the error feedback between secondary and primary side, and a DC/DC converter. This converter provides a

potential separation (galvanic separation) and power supply for the two secondary (TOP and BOT) sides of the

driver. Thus, external transformers for external power supply are not required.

Creepage and Clearance Distance

mm

12,2

8

Creepage Distance Primary to Secondary (Reinforced according to EN50178)

Clearance Distance Primary to Secondary (Reinforced according to EN50178)

Creepage Distance Secondary to Secondary (according to EN50178)

Clearance Distance Secondary to Secondary (according to EN50178)

6,1

4,1

Insulation parameters

Rating

Climatic Classification Pollution Degree (PD)

Maximum altitude (above sea level)

Overvoltage category (according to EN50178)

Isolation resistance test, Prim-Sec

Rated insulation voltage (EN60664-1)

PD2

2000 meter above sea

OVC 3

4000 VDC/AC, rms,2s

8 kV Kat. III

15

2011-04-04 – Rev05

SKYPER^®42 R

6. Environmental Conditions

Environmental Condition

Operating temperature

Storage temperature

Norm / Standard

Parameter

-40.. +85 °C

DIN 45930

CECC 50012

VDV 150

DIN 5510

prEN 100

High humidity

Flammability

85 °C, 85%

Heavy flammable materials only

RoHS / WEEE / China RoHS

EMC Condition

Norm / Standard

Parameter

DIN EN 61000-4-2

DIN EN 61800-3

DIN EN 61000-4-4

DIN EN 61800-3

DIN EN 61000-4-3

DIN EN 61800-3

DIN EN 61000-4-3

DIN EN 61800-3

6 kV contact discharge /

8 kV air discharge

ESD

Burst

≥ 2kV on adaptor board for signal lines

≥ 30V/m

30MHz – 1000 MHz

Immunity against external interference

Immunity against conducted interference

≥ 20V

150kHz – 80MHz

Conditions

Values (max.)

Sinusoidal 20Hz … 500Hz, 5g, 2h per axis (x, y, z)

Vibration

Random 20Hz … 2000Hz, 5g, 2 h per axis (x, y, z)

6000 Shocks (6 axis; +-x, +-y, +-z, 1000 shocks per axis), 30g, 18ms

Shock

- Connection between driver core and printed circuit board mechanical reinforced by using

support posts.

16

2011-04-04 – Rev05

SKYPER^®42 R

7. Marking

Every driver core is marked. The marking contains the following items.

DISCLAIMER

SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design.

Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is

given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume

any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical

information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed

or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information

previously supplied and may be superseded by updates without further notice.

SEMIKRON products are not authorized for use in life support appliances and systems without the express written

approval by SEMIKRON.

www.SEMIKRON.com

17

2011-04-04 – Rev05


型号：	SKYPER42R
厂家：	SEMIKRON INTERNATIONAL
描述：	IGBT Driver Core IGBT驱动器的核心驱动器双极性晶体管
文件：	总18页 (文件大小：618K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SKYPER42R [SEMIKRON]

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