ECLAMP2410P [SEMTECH]
ESD Protecton Device for T-Flash/MicroSD Interfaces; ESD Protecton设备用于支持T-Flash /的MicroSD接口
| 型号： | ECLAMP2410P |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | ESD Protecton Device for T-Flash/MicroSD Interfaces |
| 文件： | 总9页 (文件大小：322K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EClamp2410P
ESD Protection Device
for T-Flash/MicroSD Interfaces
PROTECTION PRODUCTS - EMIClampTM
Features
Description
The EClampTM2410P is a combination EMI filter and line
termination device with integrated TVS diodes for use on
Multimedia Card interfaces. This state-of-the-art de-
vice utilizes solid-state silicon-avalanche technology for
superior clamping performance and DC electrical char-
acteristics. They have been optimized for protection of
T-Flash/MicroSD interfaces in cellular phones and other
portable electronics.
ꢀBidirectional EMI/RFI filtering and line termination
with integrated ESD protection
ꢀESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
ꢀTVS working voltage: 5V
ꢀTermination Resistors: 45Ω
ꢀPull Up Resistors: 15kΩ (3 each) and 50kΩ
ꢀTypical Capacitance per Line: 12pF (VR = 2.5V)
ꢀProtection and termination for six lines + Vdd
ꢀSolid-state technology
The device consists of six circuits that include series im-
pedance matching resistors and pull up resistors as re-
quired by the SD specification. TVS diodes are included
on each line for ESD protection. An additional TVS diode
connection is included for protection of the voltage (Vdd)
bus. Termination resistor value of 45 Ohms is included
on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines.
Pull up resistors of 15k Ohms are included on DAT0,
DAT1, DAT2, and CMD lines while a 50k Ohm pull up is
inlcuded on the DAT3 line. These may be configured for
devices operating in SD or SPI mode . The TVS diodes
provide effective suppression of ESD voltages in excess
of ±15kV (air discharge) and ±8kV (contact discharge)
per IEC 61000-4-2, level 4.
Mechanical Characteristics
ꢀSLP4016P16 16-pin package
ꢀRoHS/WEEE Compliant
ꢀNominal Dimensions: 4.0 x 1.6 x 0.58 mm
ꢀLead Pitch: 0.5mm
ꢀLead finish: NiPd
ꢀMarking: Marking Code
ꢀPackaging: Tape and Reel per EIA 481
Applications
The EClamp2410P is in a 16-pin, RoHS/WEEE compliant,
SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are fin-
ished with lead-free NiPd.
ꢀT-Flash / MicroSD Interfaces
ꢀMMC Interfaces
ꢀCDMA, GSM, 3G Cell Phones
Pin Configuration
Package Configuration
4.00
1
2
1
16
D AT1 In
D AT1 O ut
D AT0 O ut
C LK O ut
1.60
D AT0 In
C LK In
R up1
R up3
Vdd
R up2
0.50 BSC
C MD In
C MD Out
D AT3 O ut
D AT2 O ut
D AT3 In
D AT2 In
0.58
Pin Designation (Top View)
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
www.semtech.com
Revision 07/20/2006
1
EClamp2410P
PROTECTION PRODUCTS
Pin Identification and Configuration
Pin
1, 16
2, 15
3, 14
4
Symbol
DAT1
DAT0
Clock
Rup1
Vdd
Identification
Data line #1 input/output with pull-up resistor
Data line #0 input/output with pull-up resistor
Clock line Input/Output
16 15 14 13 12 1110 9
15k Pull-up resistor from DAT1 & DAT2
Power Supply ESD Protection
1 2 3 4 5 6 7 8
5
6, 11
7, 10
8, 9
12
CMD
Command Line Input/Output
Pin Configuration (Top View)
DAT3
DAT2
Rup2
Rup3
Data line #3 input/output with pull-up resistor
Data line #2 input/output with pull-up resistor
50k Pull-Up Resistor from DAT3
13
15k Pull-up resistor from DAT0 & CMD
Center
tab
GND
Ground connection
Schematics & Component Values
Pin 12
Pin 4
Rup
50K
Rup
15K
45 Ohms
Pin 1, 8
45 Ohms
Pin 7
Pin 9, 16
Pin 10
DAT1, DAT2
DAT3
Pin 13
DAT0, CMD Line
Pin 5
Pin 3
45 Ohms
Pin 14
Rup
15K
45 Ohms
Pin 2, 6
Pin 11, 15
Vdd
CLK
DAT0, CMD
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2006 Semtech Corp.
2
EClamp2410P
PROTECTION PRODUCTS
Maximum Ratings
Rating
Symbol
VESD
Value
Units
kV
ESD per IEC61000-4-2 (Air)
ESD per IEC61000-4-2 (Contact)
+/- 17
+/- 12kV
Operating Temperature
Storage Temperature
TJ
-40 to +85
o C
o C
TSTG
-55 to +150
Electrical Characteristics (T = 25oC)
Parameter
TVS Reverse Stand-Off Voltage
TVS Reverse Breakdown Voltage
TVS Reverse Leakage Current
Series Resistors
S ymbol
VRWM
VBR
Conditions
Minimum
Typical
Maximum
Units
5
V
V
It = 1mA
VRWM = 3.0V
Each Line
6
8
10
0.5
52
17
58
15
IR
µA
R
38
12
42
10
45
15
50
12
Ohms
k Ohms
k Ohms
pF
DAT Pull Up Resistor 1
DAT Pull Up Resistor 2
Total Capacitance
Rup1
Rup2
Cin
Input to Gnd,
Each Line
VR = 2.5V, f = 1MHz
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2006 Semtech Corp.
3
EClamp2410P
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
ESD Clamping (+8kV Contact)
CH1S21 LOG 6 dB /REF 0 dB
1: -6.145 dB
300 MHz
2: -14.437 dB
900 MHz
0 dB
-6 dB
1
3: -23.847 dB
1.8 GHz
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
2
4: -32.024 dB
2.5 GHz
3
4
1
10
100
1
3
MHz
MHz
MHz
GHz GHz
3
.
STOP 000000000MHz
.
START030MHz
Normalized Capacitance vs. Reverse Voltage
Series Resistance vs. Temperature
1.2
50
49
48
47
46
45
44
43
42
41
40
f = 1 MHz
1
0.8
0.6
0.4
0.2
0
0
1
2
3
4
5
-40
-25
-10
5
20
35
50
65
80
Temperature (0C)
Reverse Voltage - VR (V)
Pull Up Resistance (Rup1) vs. Temperature
Pull Up Resistance (Rup2) vs. Temperature
58000
57000
56000
55000
54000
53000
52000
51000
50000
49000
48000
16200
16100
16000
15900
15800
15700
15600
15500
15400
15300
15200
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80
Temperature (oC)
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80
Temperature (oC)
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2006 Semtech Corp.
4
EClamp2410P
PROTECTION PRODUCTS
Applications Information
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2410P is a microSD/T-Flash interface device
designed for use in cell phones and other portable
electronic devices. The EClamp2410P is comprised of
series and pull up resistors required on the microSD
interface. Each line also includes TVS diodes for ESD
protection. The device may be configured for SD or SPI
mode operation. In SD mode for example, the 15k Ohm
pull up resistors (Rup 1 and Rup 3) are connected to
VDD. In SPI mode pin 4 is not connected (Rup 1) since
these are reserved lines. The 50k Ohm pull up resistor
is used for card detection or SPI mode selection during
power up and is disconnected by the user during regular
data transfer.
The EClamp2410P is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the bottom
of the device. The device has a flow through design for
easy layout. Pin connections are noted in Figure 1. A
center tab serves as the ground connection. Recom-
mendations for the ground connection are given below.
1
16
D AT1 In
D AT1 O ut
D AT0 O ut
C LK O ut
D AT0 In
C LK In
R up1
R up3
Vdd
R up2
C MD In
C MD Out
D AT3 O ut
D AT2 O ut
D AT3 In
D AT2 In
Figure 2 - Recommended Layout using Ground Vias
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering and ESD performance of the device.
Ground loop inductance can be reduced by using mul-
tiple vias to make the connection to the ground plane.
Figure 2 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller di-
ameter (such as 0.005 inches or 0.125mm) since chang-
ing the diameter of the via will result in little change in
inductance.
Layout Guidelines for Optimum ESD Protection
Good circuit board layout is critical not only for signal
integrity, but also for effective suppression of ESD
induced transients. For optimum ESD protection, the
following guidelines are recommended:
ꢁ
Place the device as close to the connector as
possible. This practice restricts ESD coupling into
adjacent traces and reduces parasitic inductance.
The ESD transient return path to ground should be
kept as short as possible. Whenever possible, use
multiple micro vias connected directly from the
device ground pad to the ground plane.
ꢁ
ꢁ
Avoid running critical signals near board edges.
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2006 Semtech Corp.
5
EClamp2410P
PROTECTION PRODUCTS
Applications Information
DAT 1 IN
DAT 0 IN
CLK IN
DAT 1 OUT
DAT 0 OUT
CLK OUT
Rup 15KΩ
Rup 50KΩ
Rup 15KΩ
Host IC
VDD
CMD OUT
DAT 3 OUT
DAT 2 OUT
CMD IN
DAT 3 IN
DAT 2 IN
EClamp2410P
Figure 3 - MicroSD Protection
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2006 Semtech Corp.
6
EClamp2410P
PROTECTION PRODUCTS
Applications Information - Spice Model
Pin 4, 13
Pin 12
Rup
15K
Rup
50K
Pin 1, 8, 2, 6
Pin 7
Pin 9, 16, 11, 15
R1
Pin 10
R1
45 Ohms
45 Ohms
DAT1, DAT2, DAT0, CMD
DAT3
Pin 5
Pin 3
R1
Pin 14
45 Ohms
CLK
VDD
Spice Model
EClamp2410P Spice Parameters
Parameter
Unit
Amp
Volt
Volt
Ohm
Amp
Farad
sec
--
D1 (TVS)
IS
BV
VJ
2E-15
7.46
0.777
1.00
RS
IBV
CJO
TT
1E-3
10E-12
2.541E-9
0.246
1.1
M
N
--
EG
eV
1.11
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2006 Semtech Corp.
7
EClamp2410P
PROTECTION PRODUCTS
Outline Drawing - SLP4016P16
B
E
A
D
DIMENSIONS
INCHES MILLIMETERS
MIN NOM MAX MIN NOMMAX
DIM
A
.020
0.50
0.58 0.65
.023 .026
PIN 1
INDICATOR
.003
0.05
A1 .000
A2
.002 0.00
.001
(.005)
(0.13)
(LASER MARK)
b
D
D1
E
.007
.012 0.20 0.25 0.30
.010
.153 .157 .161 3.90 4.00 4.10
3.20
.130 3.10
3.30
.122 .126
.059 .063 .067 1.50 1.60 1.70
A
SEATING
PLANE
E1 .010
0.40 0.50
0.50 BSC
.016 .020 0.25
e
.020 BSC
aaa C
A2
L
N
aaa
.011 .013 .015 0.28 0.33 0.38
C
16
16
A1
.003
.004
0.08
0.10
D1
bbb
1
2
LxN
E/2
E1
N
bxN
e
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
2.
Land Pattern - SLP4016P16
P
X
DIMENSIONS
DIM
INCHES
MILLIMETERS
B
C
F
G
P
X
Y
Z
.130
.060
.018
.035
.020
.012
.025
.085
3.30
1.52
0.45
0.89
0.50
0.30
0.63
2.15
(C)
F
G
Z
Y
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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2006 Semtech Corp.
8
EClamp2410P
PROTECTION PRODUCTS
Marking
Ordering Information
Part Number
Qty per Reel
3,000
Reel Size
7 inch
EClamp2410P.TCT
PIN 1
2410P
EMIClamp and EClamp are marks of Semtech Corporation
INDICATOR
YW
(LASER MAR K)
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
B0
K0
1.78 +/-0.10 mm
4.30 +/-0.10 mm
0.74 +/-0.10 mm
E
Tape
K
(MAX)
B, (Max)
Width
D
D1
F
P
P0
P2
T(MAX)
W
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.750±.10
mm
(.069±.004)
4.0±0.1
mm
(.157±.00-
4)
4.0±0.1
mm
(.157±.00-
4)
12.0 mm
+ 0.3 mm
- 0.1 mm
1.0 mm
±0.05
(.039)
5.5±0.05
mm
(.217±.002)
2.0±0.05m-
m
(.079±.002)
8.2 mm
12 mm
4.5 mm
(.177)
0.4 mm
(.016)
(.476)
(.472±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2006 Semtech Corp.
9
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