RCLAMP3331Y [SEMTECH]
Ultra Small RailClamp® 1-Line, 3.3V ESD Protection;
| 型号： | RCLAMP3331Y |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Ultra Small RailClamp® 1-Line, 3.3V ESD Protection |
| 文件： | 总8页 (文件大小：366K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RClamp3331Y
Ultra Small RailClamp®
1-Line, 3.3V ESD Protection
PROTECTION PRODUCTS - RailClamp®
Features
Description
RailClamp® TVS diodes are ultra low capacitance devices
designed to protect sensitive electronics from damage
or latch-up due to ESD, EFT, and EOS. They are designed
for use on high speed ports in applications such as cell
phones, notebook computers, and other portable elec-
tronics. These devices offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degrada-
tion.
High ESD withstand Voltage: +/-18kV (Contact/Air)
per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per
IEC 61000-4-2 Level 4
Ultra-small 0201 package
Protects one high speed data line
Working voltage: +/- 3.3V
Low capacitance: 0.35pF typical
Extremely low dynamic resistance: 0.27 Ohms (Typ)
Low ESD clamping voltage
RClamp®3331Y features extremely good ESD protection
characteristics including a low typical dynamic resistance
of 0.27 Ohms, low peak ESD clamping voltage, and high
ESD withstand voltage (+/-18kV contact per IEC 61000-
4-2). Low typical capacitance (0.35pF at VR=0V) allows
the RClamp3331Z to be used in applications operating
in excess of 5GHz without appreciable signal attenua-
tion. Each device will protect one high speed data line
operating at 3.3 Volts.
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP0603P2X3E Package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking Code
Packaging: Tape and Reel
RClamp3331Y is in a 2-pin SLP0603P2X3E package
measuring 0.6 x 0.3 mm with a nominal height of
0.25mm. Leads are finished with lead-free NiAu. The
small package gives the designer the flexibility to
protect single lines in applications where arrays are not
practical. The combination of low peak ESD clamping,
low dynamic resistance, and low capacitance makes
this device suitable for applications such as USB 3.0,
MIPI and V-By-One interfaces in portable devices.
Applications
USB 2.0 / USB 3.0
MIPI / MDDI
V-By-One
eDP
MHL
LVDS
Nominal Dimensions
Schematic
0.600
0.220
0.300
1
0.160
0.355 BSC
2
0.250
Nominal Dimensions (in mm)
SLP0603P2X3E (Bottom View)
www.semtech.com
Revision 10/22/2013
1
RClamp3331Y
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
Amps
kV
Peak Pulse Power (tp = 8/20s)
30
4
Maximum Peak Pulse Current (tp = 8/20s)
Ipp
ESD per IEC 61000-4-2 (Air)1
VESD
+/- 18
+/- 18
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
TJ
-40 to +85
°C
°C
TSTG
-55 to +150
Electrical Characteristics (T=25oC)
Parameter
Reverse Stand-Off Voltage
Holding Voltage
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
3.3
Units
Pin 1 to 2 or 2 to 1
V
V
VHOLD
IHOLD = 50mA
Pin 1 to 2 or 2 to 1
1.2
2.8
<1
3.8
5.5
5
4.4
Reverse Leakage Current
Clamping Voltage
IR
VRWM = 3.3V, T=25°C
Pin 1 to 2 or 2 to 1
50
5.5
7.5
nA
V
VC
VC
VC
VC
IPP = 1A, tp = 8/20s
Pin 1 to 2 or 2 to 1
Clamping Voltage
IPP = 4A, tp = 8/20s
Pin 1 to 2 or 2 to 1
V
ESD Clamping Voltage2
ESD Clamping Voltage2
IPP = 4A,
tlp = 0.2/100ns
V
IPP = 16A,
8.3
V
tlp = 0.2/100ns
Trigger Voltage2
Dynamic Resistance2, 3
Junction Capacitance
Notes
VTRIG
RD
tp = 0.2/100ns
tp = 0.2/100ns
VR = 0V, f = 1MHz
8.8
0.27
0.35
V
Ohms
pF
Cj
0.45
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
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© 2013 Semtech Corporation
2
RClamp3331Y
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
6
1000
TA =ꢀ25OC
Waveform:ꢀtpꢀ=ꢀ8x20us
TA = 25OC
5
4
3
2
1
0
100
10
DR040412-30
1
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0.1
1
10
100
Peak Pulse Current - IPP (A)
Pulse Duration - tp (μs)
TLP Characteristic (Positive)
TLP Characteristic (Negative)
30
0
Ͳ5
TransmissionꢀLineꢀPulseꢀTest
(TLP)ꢀSettings:
tpꢀ=ꢀ100ns,ꢀtrꢀ=ꢀ0.2ns,
ITLP andꢀVTLP averagingꢀwindow:
t1ꢀ=ꢀ70nsꢀtoꢀt2ꢀ=ꢀ90ns
TransmissionꢀLineꢀPulseꢀTest
(TLP)ꢀSettings:
tpꢀ=ꢀ100ns,ꢀtrꢀ=ꢀ0.2ns,
ITLP andꢀVTLP averagingꢀwindow:
t1ꢀ=ꢀ70nsꢀtoꢀt2ꢀ=ꢀ90ns
25
20
15
10
5
Ͳ10
Ͳ15
Ͳ20
Ͳ25
Ͳ30
0
0
2
4
6
8
10
12
14
Ͳ14
Ͳ12
Ͳ10
Ͳ8
Ͳ6
Ͳ4
Ͳ2
0
Clamping Voltage (V)
ClampingꢀVoltageꢀ(V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
70
10
Measuredꢀwithꢀ50ꢀOhmꢀscopeꢀinput
impedance,ꢀ2GHzꢀbandwidth.ꢀCorrected
forꢀ50ꢀOhm,ꢀ20dBꢀattenuator.ꢀESDꢀgun
returnꢀpathꢀconnectedꢀtoꢀESDꢀgroundꢀplane.
60
0
Ͳ10
Ͳ20
Ͳ30
Ͳ40
50
40
30
20
10
0
Ͳ50
Measuredꢀwithꢀ50ꢀOhmꢀscopeꢀinput
impedance,ꢀ2GHzꢀbandwidth.ꢀCorrected
forꢀ50ꢀOhm,ꢀ20dBꢀattenuator.ꢀESDꢀgun
returnꢀpathꢀconnectedꢀtoꢀESDꢀgroundꢀplane.
Ͳ60
Ͳ70
Ͳ10
Ͳ10
0
10
20
30
40
Time (ns)
50
60
70
80
90
Ͳ10
0
10
20
30
40
Time (ns)
50
60
70
80
90
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© 2013 Semtech Corporation
3
RClamp3331Y
PROTECTION PRODUCTS
Typical Characteristics
Junction Capacitance vs. Reverse Voltage
Junction Capacitance vs. Temperature
0.5
0.4
0.3
0.2
0.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
fꢀ=ꢀ1MHz
VRꢀ=ꢀ3.3V
VRꢀ=ꢀ0V
fꢀ=ꢀ1MHz
0.0
0
0.5
1
1.5
Voltage (V)
2
2.5
3
3.5
Ͳ75
Ͳ50
Ͳ25
0
25
50
75
100
Temperature (OC)
Typical Insertion Loss S21
0.0
Ͳ0.5
Ͳ1.0
Ͳ1.5
Ͳ2.0
Ͳ2.5
Ͳ3.0
Ͳ3.5
Ͳ4.0
0.01
0.1
1
10
Frequency (GHz)
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© 2013 Semtech Corporation
4
RClamp3331Y
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joints. The figure at the right details
Semtech’s recommended aperture based on the
assembly guidelines detailed in the table below. Note
that these are only recommendations and should
serve only as a starting point for design since there
are many factors that affect the assembly process.
Exact manufacturing parameters will require some
experimentation to get the desired solder application.
0.273
0.205
0.220
Assembly Parameter
Recommendation
0.320
Solder Stencil Design
Laser cut, Electro-polished
Rectangular with rounded
corners
Aperture shape
Land Pad
Stencil opening
Component
Solder Stencil Thickness
Solder Paste Type
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Recommended Mounting Pattern
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
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© 2013 Semtech Corporation
5
RClamp3331Y
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3E
B
E
D
A
DIMENSIONS
MILLIMETERS
DIM
A
MIN NOM MAX
0.235
0.250 0.265
A1 0.000 0.010 0.050
b
0.200 0.220 0.240
0.600
D
E
e
L
N
aaa
0.580
0.620
0.320
0.280 0.300
0.355 BSC
TOP VIEW
0.140 0.160 0.180
2
0.08
0.10
bbb
A
SEATING
PLANE
aaa C
A1
C
e/2
R0.025
TYP
bxN
bbb
C A B
2X L
e
BOTTOM VIEW
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS(ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3E
DIMENSIONS
DIM MILLIMETERS
(0.385)
0.181
0.273
0.205
0.590
C
G
X
Y
Z
Z
(C)
G
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY .
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET .
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© 2013 Semtech Corporation
6
RClamp3331Y
PROTECTION PRODUCTS
Marking Code
Ordering Information
Qty per
Part Number
Pocket
Pitch
Reel
Size
Reel
RClamp3331Y.TFT
Notes:
15,000
2mm
7 Inch
m
RailClamp and RClamp are trademarks of Semtech Corporation
Note:
Device is electrically symmetrical
Carrier Tape Specification
Device Orientation in Tape
www.semtech.com
© 2013 Semtech Corporation
7
RClamp3331Y
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2013 Semtech Corporation
8
相关型号：
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SEMTECH
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