RCLAMP7538P [SEMTECH]
8-Line ESD protection;
| 型号： | RCLAMP7538P |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | 8-Line ESD protection |
| 文件： | 总8页 (文件大小：278K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RClamp7538P
Low Capacitance RClamp®
8-Line ESD protection
PROTECTION PRODUCTS - RailClamp®
Features
Description
RailClamp® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specifically engineered
to protect sensitive components which are connected
to high-speed data and transmission lines from over-
voltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20s)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects eight high-speed lines
Low capacitance: 0.60pF Maximum (I/O to Ground)
Low ESD clamping voltage
The RClamp®7538P will protect eight lines or four
differential pairs. Each line has a maximum capaci-
tance of only 0.60pF between any I/O pin and ground.
This allows it to be used on circuits operating in excess
of 3GHz with minimal signal attenuation. They feature
high maximum ESD withstand voltage of +/- 20kV
contact, +/-25kV air discharge per IEC 61000-4-2.
Low dynamic resistance: 0.42 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP3810N9 9-pin package (3.8 x 1.0 x 0.50mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.4mm (intra-pair), 0.50mm (pair-to-
pair)
Lead finish: NiPdAu
Marking: Marking Code
The RClamp7538P is in a 9-pin SLP3810N9 package. It
measures 3.8 x 1.0mm with a nominal height of 0.50mm.
Intra-pair lead pitch is 0.40mm while the pair-to-pair pitch
is 0.5mm. The innovative flow through package design
simplifies pcb layout and allows matched trace lengths
for consistant impedance between high speed differen-
tial lines.
Packaging: Tape and Reel
Applications
HDMI 1.4
V-By-One
MHL
LVDS Interfaces
eSATA Interfaces
The combination of small size, low capacitance, and high
level of ESD protection makes this device a flexible solu-
tion for applications such as HDMI, MHL, LVDS, and eSATA
interfaces.
Dimensions
Circuit Diagram
0.40 BSC
3.80
1
2
1.00
1
2
4
5
3
6
7
8
9
0.50 BSC
0.50
Nominal Dimensions in mm (Bottom View)
8-Line Protection
www.semtech.com
Revision 6/27/2013
1
RClamp7538P
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
A
Peak Pulse Power (tp = 8/20s)
Peak Pulse Current (tp = 8/20s)
75
5
IPP
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
+/- 25
+/- 20
kV
Operating Temperature
Storage Temperature
TJ
-55 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics (T=25oC)
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Any I/O to GND
5
V
V
VBR
It = 1mA,
6.5
9
11
Any I/O to GND
Reverse Leakage Current
Clamping Voltage
IR
VRWM = 5.0V,
Any I/O to GND
0.005
0.100
12
A
V
VC
VC
VC
VC
IPP = 1A, tp = 8/20s
Any I/O to GND
Clamping Voltage
IPP = 5A, tp = 8/20s
15
V
Any I/O to GND
ESD Clamping Voltage1
ESD Clamping Voltage1
IPP = 4A,
tlp = 0.2/100ns
12
17
V
IPP = 16A,
V
tlp = 0.2/100ns
Dynamic Resistance2
Junction Capacitance
RD
Cj
tp = 100ns
0.42
0.50
Ohms
pF
VR = 0V, f = 1MHz,
Any I/O to GND
0.60
0.4
VR = 0V, f = 1MHz,
Between I/O pins
0.25
pF
Notes
1)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
2) Dynamic resistance calculated between Ipp = 4A and Ipp = 16A
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© 2013 Semtech Corporation
2
RClamp7538P
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
8/20us Pulse Waveform
10
110
100
90
80
70
60
50
40
30
20
10
0
DR040412-75
Waveform
Parameters:
tr = 8μs
td = 20μs
1
e-t
td = IPP/2
0.1
0.01
0
5
10
15
20
25
30
0.1
1
10
100
1000
Time (μs)
Pulse Duration - tp (μs)
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
14
13
12
11
10
9
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
8
Waveform
Parameters:
tr = 8μs
7
td = 20μs
f = 1 MHz
6
0
1
2
3
4
5
6
0
1
2
3
4
5
Peak Pulse Current - IPP (A)
Reverse Voltage - VR(V)
TLP Characteristic (Positive)
TLP Characteristic (Negative)
30
0
-5
Transmission Line Pulse Test
(TLP) Settings:
p = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
1 = 70ns to t2 = 90ns
Transmission Line Pulse Test
(TLP) Settings:
t
tp = 100ns, tr = 0.2ns,
25
20
15
10
5
ITLP and VTLP averaging window:
t
t
1 = 70ns to t2 = 90ns
-10
-15
-20
-25
-30
0
0
5
10
15
20
25
-40
-35
-30
-25
-20
-15
-10
-5
0
TLP Voltage (V)
TLP Voltage (V)
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© 2013 Semtech Corporation
3
RClamp7538P
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
140
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB attenuator.
0
-40
120
ESD gun return path connected to ESD
ground plane
100
80
60
40
20
0
-80
-120
-160
-200
-240
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB attenuator.
ESD gun return path connected to ESD
ground plane
-20
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
Typical Insertion Loss S21
Analog Crosstalk
CH1S21 LOG
6 dB / REF 0 dB
CH1S21 LOG
20dB /REF 0 dB
1: - .09000 dB
800 MHz
2: - .09670 dB
900 MHz
5
0 dB
12
0 dB
3
4
3: - .38870 dB
1.8 GHz
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
-20 dB
-40 dB
4: - 1.1907 dB
2.5 GHz
5: - 1.3072 dB
2.7 GHz
-60 dB
-80 dB
-100 dB
-120 dB
-140 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
-160 dB
3
.
STOP 000000000MHz
3 .
STOP 000000000MHz
START
.030MHz
.
START 030MHz
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© 2013 Semtech Corporation
4
RClamp7538P
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
Assembly Parameter
Recommendation
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. Semtech's recommended assem-
bly guidelines for mounting this device are shown in
the Table. The figure below details Semtech’s recom-
mended aperture based on the below recommenda-
tions. Note that these are only recommendations and
should serve only as a starting point for design since
there are many factors that affect the assembly
process. The exact manufacturing parameters will
require some experimentation to get the desired
solder application.
Solder Stencil Design
Laser cut, Electro-polished
Rectangular with rounded
corners
Aperture shape
Solder Stencil Thickness
Solder Paste Type
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Stencil Opening
0.250
Land Pad ( Follow Drawing)
0.700
0.350
1.000
3.800
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Mounting Pattern
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© 2013 Semtech Corporation
5
RClamp7538P
PROTECTION PRODUCTS
Outline Drawing - SLP3810N9
DIMENSIONS
A
D
B
E
MILLIMETERS
DIM
MIN NOM MAX
0.45 0.50 0.55
0.00 0.02 0.05
(0.13)
A
A1
A2
b
PIN 1
INDICATOR
(LASER MARK)
0.15 0.20 0.25
3.70 3.80 3.90
0.90 1.00 1.10
0.80 BSC
0.90 BSC
0.25 0.30 0.35
9
D
E
e
e1
L
N
A
SEATING
PLANE
aaa
0.08
aaa
C
bbb
0.10
C
A1
A2
D/2
e1
e
1
2
LxN
E/2
N
e/2
e
bxN
e1
bbb
C A B
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP3810N9
P1
P
P/2
DIMENSIONS
DIM MILLIMETERS
(0.95)
0.35
0.80
0.90
0.20
0.60
1.55
C
G
P
P1
X
Z
(C)
G
Y
Z
Y
X
(P)
(P1)
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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© 2013 Semtech Corporation
6
RClamp7538P
PROTECTION PRODUCTS
Marking Code
Ordering Information
Device to
Device
Pitch
Qty per
Reel
Reel
Size
Part Number
7538P
PIN 1
YYWW
INDICATOR
RClamp7538P.TZT
RClamp7538P.TNT
4mm
2mm
7 Inch
7 Inch
5,000
10,000
YYWW = Date Code
RailClamp and RClamp are trademarks of Semtech Corporation.
Carrier Tape Specification
Notes:ꢀ
Notes:ꢀ
1)ꢀPinꢀ1ꢀtowardsꢀsprocketꢀholes
2)ꢀEveryꢀotherꢀpocketꢀpopulated
1)ꢀPinꢀ1ꢀtowardsꢀsprocketꢀholes
2)ꢀEveryꢀpocketꢀpopulated
Device Orientation in Tape (5K Piece Option)
Device Orientation in Tape (10K Piece Option)
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© 2013 Semtech Corporation
7
RClamp7538P
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2013 Semtech Corporation
8
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