SC4211H [SEMTECH]
Very Low Input /Very Low Dropout 1 Amp Regulator With Enable;
| 型号： | SC4211H |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Very Low Input /Very Low Dropout 1 Amp Regulator With Enable |
| 文件： | 总9页 (文件大小：405K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SC4211H
Very Low Input /Very Low Dropout
1 Amp Regulator With Enable
POWER MANAGEMENT
Description
Features
The SC4211H is a high performance positive voltage
regulator designed for use in applications requiring very
low Input voltage and very low dropout voltage at up to
1 amperes. It operates with a Vin as low as 1.4V, with
output voltage programmable as low as 0.5V. The
SC4211H features ultra low dropout, ideal for applica-
tions where Vout is very close to Vin. Additionally, the
SC4211H has an enable pin to further reduce power
dissipation while shutdown. The SC4211H provides ex-
cellent regulation over variations in line, load and tem-
perature.
© Input Voltage as low as 1.4V
© 400mV dropout @ 1A
© Adjustable output from 0.5V
© Over current and over temperature protection
© Enable pin
© 10µA quiescent current in shutdown
© Full industrial temperature range
© Available in SOIC-8-EDP Lead-free package, fully
WEEE and RoHS compliant
Applications
© Telecom/Networking cards
© Motherboards/Peripheral cards
© Industrial Applications
© Wireless infrastructure
© Set top boxes
The SC4211H is available in the SOIC-8-EDP (Exposed
Die Pad) package. Depending on how the FB pin is con-
figured, the output voltage can be either externally ad-
justed or fixed to 0.5V.
© Medical equipment
© Notebook computers
© Battery powered systems
Typical Application Circuits
SC4211H
4
5
NC
NC
VO
FB
GND
3
6
7
8
VIN
VIN
EN
NC
VO
2
ENABLE
0.5(R1+ R2)
1
R1
R2
VO
=
Volts
R2
U1
C1
C2
SC4211H
5
4
3
NC
VIN
EN
NC
VO
6
VIN
VO = 0.5V
2
1
7
ENABLE
FB
8
NC
GND
U1
C1
C2
Rev. 2.1
1
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SC4211H
POWER MANAGEMENT
Absolute Maximum Ratings
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in
the Electrical Characteristics section is not implied.
Parameter
Symbol
Max
Units
V
Vin, EN, Vo, FB to GND
Power Dissipation
7
Internally Limited
36
PD
θJA
θJC
TA
W
(1)
Thermal Resistance Junction to Ambient
°C/W
°C/W
°C
(1)
Thermal Resistance Junction to Case
5.5
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
-40 to +85
-40 to +125
-65 to +150
260
TJ
°C
TSTG
TP
°C
Peak IR Reflow Temperature (10s to 30s)
ESD Rating (Human Body Model) (2)
Notes:
°C
VESD
2
kV
(1) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per
JESD51 standards,
(2) Tested according to JEDEC standard JESD22-A114-B.
Electrical Characteristics
Unless specified: VEN = VIN, VFB = VO, VIN = 1.40V to 6.0V, IO = 8mA to 1A.
Values in bold apply over the full operating temperature range.
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VIN
Supply Voltage Range
Quiescent Current
VIN
IQ
1.40
6.0
3
V
VIN = 3.3V, IO = 0A
mA
µA
VIN = 6.0V, VEN = 0V
10
50
VO
Line Regulation(1)
Load Regulation(1)
Dropout Voltage(1)(2)
REG(LINE)
REG(LOAD)
VDO
IO = 10mA
IO = 10mA to 1A
IO = 500mA
0.2
0.5
0.4
1.5
%/V
%
100
250
300
mV
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SC4211H
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: VEN = VIN, VFB = VO, VIN = 1.40V to 6.0V, IO = 8mA to 1A.
Values in bold apply over the full operating temperature range.
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VO (Cont.)
Dropout Voltage(1)(2)
200
400
VDO
IO = 1A
mV
500
Minimum Load Current(3)
Current Limit(4)
IO
VIN = VO + 0.5V
8
mA
A
ICL
1.1
1.5
0.5
80
2.0
Feedback
Reference Voltage(1)
VREF
VIN = 3.3V, VFB = VOUT, IO = 10mA
Full IOUT , and VIN Range
VFB = VREF
0.495
0.505
0.510
200
V
0.490
Feedback Pin Current(4)
EN
IADJ
nA
Enable Pin Current
Enable Pin Threshold
IEN
VIH
VIL
VEN = 0V, VIN = 3.3V
VIN = 3.3V
1.5
10
µA
V
1.6
VIN = 3.3V
0.4
Over Temperature Protection
High Trip level
THI
160
10
°C
°C
Hysteresis
THYST
Notes:
(1)
(2)
(3)
(4)
Low duty cycle pulse testing with Kelvin connections required.
VDO = VIN -VO when VO decreases by 1.5% of its nominal output voltage with VIN = VO +0.8V.
Required to maintain regulation. Voltage set resistors R1 and R2 are usually utilized to meet this requirement.
Guaranteed by design.
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SC4211H
POWER MANAGEMENT
Ordering Information
Part Number
Package
SOIC-8-EDP
Temp. Range (TJ)
SC4211HSTRT(1)(2)
-40 to +125 OC
SC4211HEVB
Notes:
Evaluation Board
(1) Only available in tape and reel packaging. A reel con-
tains 2500 devices.
(2) Lead-free product. This product is fully WEEE and RoHS
compliant.
Pin Configuration
Pin Descriptions
Pin #
Pin Name
Pin Description
Enable Input. Pulling this pin below 0.4V turns the regulator off, reducing the quiescent current to a
fraction of its operating value. The device will be enabled if this pin is left open. Connect to VIN if not
being used.
2
EN
Input voltage. For regulation at full load, the input to this pin must be between (VO + 0.5V) and 5.5V.
Minimum VIN=1.4V. A large bulk capacitance should be placed closely to this pin to ensure that the
input supply does not sag below 1.4V. Also a minimum of 4.7uF ceramic capacitor should be placed
directly at this pin.
3
VIN
The pin is the power output of the device. A minimum of 10uF capacitor should be placed directly at this
pin.
6
7
VO
FB
Output voltage feedback pin. If connected to the VO pin, the output voltage will be set at 0.5V. If external
feedback resistors are used, the output voltage will be (See Application Circuits on page 1):
VO = [0.5 (R1+R2)] / R2 Volts
8
GND
Reference ground. The GND pin and the exposed die pad must be connected together at the IC pin.
No connection.
1, 4, 5
NC
Pad for heatsinking purposes. Connect to ground plane using multiple vias. Not electrically connected
internally.
THERMAL PAD
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SC4211H
POWER MANAGEMENT
Block Diagram
Marking Information
Top View
SC4211H
yyww
xxxxx
yyww = Datecode (Example: 0015)
xxxxx = Semtech Lot No. (Example: 00101)
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SC4211H
POWER MANAGEMENT
Typical Characteristics
Region of Instability
Stable Region
Region of Instability
Region of Instability
Stable Region
Region of Instability
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SC4211H
POWER MANAGEMENT
Applications Information
Introduction
operating value. A pull up resistor up to 400kOhms should
be connected from this pin to the VIN pin in application
The SC4211H is intended for applications where high where supply voltages of Vin < 1.9V is required. For ap-
current capability and very low dropout voltage are re- plications with higher voltages than 1.9V, EN pin could
quired. It provides a very simple, low cost solution that be left open or connected to VIN.
uses very little PCB real estate. Additional features in-
clude an enable pin to allow for a very low power con- Thermal Considerations
sumption standby mode, and a fully adjustable output.
The power dissipation in the SC4211H is approximately
Component Selection
equal to the product of the output current and the input
to output voltage differential:
Input capacitor: A large bulk capacitance of about
≥ 10uF/A (output load) should be closely placed to the
input supply pin of the SC4211H to ensure that Vin does
not sag below 1.4V. Also a minimum of 4.7µF ceramic
capacitor is recommended to be placed directly next to
the Vin pin. This allows for the device being some dis-
tance from any bulk capacitance on the rail. Additionally,
input droop due to load transients is reduced, improving
load transient response. Additional capacitance may be
added if required by the application.
PD
≈ VIN − VOUT • IO
( )
The absolute worst-case dissipation is given by:
PD(MAX)
=
VIN
− VOUT
• IO(MAX) + VIN
• IQ(MAX)
(MAX)
(MAX)
(MIN)
For a typical scenario, VIN = 3.3V ± 5%, VOUT = 2.8V and
IO = 1A, therefore:
VIN(MAX) = 3.465V, VOUT(MIN) = 2.744V and IQ(MAX) = 1.75mA,
Thus PD(MAX) = .722W.
Output capacitor: A minimum bulk capacitance of
≥ 10µF/A (output load), along with a 0.1µF ceramic de-
coupling capacitor is recommended. Increasing the bulk
capacitance will improve the overall transient response.
The use of multiple lower value ceramic capacitors in
parallel to achieve the desired bulk capacitance will not
cause stability issues. Although designed for use with ce-
ramic output capacitors, the SC4211H is extremely tol-
erant of output capacitor ESR values and thus will also
work comfortably with tantalum output capacitors.
Using this figure, and assuming TA(MAX) = 70°C, we can cal-
culate the maximum thermal impedance allowable to main-
tain TJ ≤ 150°C:
TJ(MAX) −TA(MAX)
=
150−70
RTH(J−A)(MAX)
=
=110°C/W
PD(MAX)
.722
Noise immunity: In very electrically noisy environments,
it is recommended that 0.1µF ceramic capacitors be
placed from IN to GND and OUT to GND as close to the
device pins as possible.
This should be achievable for the SOIC-8-EDP package
using PCB copper area to aid in conducting the heat away,
such as one square inch of copper connected to the ground
pins of the device. Internal ground/power planes and air
flow will also assist in removing heat. For higher ambient
temperatures it may be necessary to use additional cop-
per area.
Internal voltage selection: By connecting the FB pin di-
rectly to the VO pin, the output voltage will be regulated
to the 0.5V internal reference.
External voltage selection resistors: The use of 1%
resistors, and designing for a current flow ≥ 8mA is
recommended to ensure a well regulated output (thus
R2 ≤ 62.5Ω).
Enable: Pulling this pin below 0.4V turns the regulator
off, reducing the quiescent current to a fraction of its
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SC4211H
POWER MANAGEMENT
Outline Drawing - SOIC-8-EDP
A
D
E
DIMENSIONS
MILLIMETERS
MIN NOM MAX
e
DIM
N
1
-
-
-
-
-
A
1.35
A1 0.00
A2 1.25
1.75
0.13
1.65
0.51
0.25
E/2
E1
b
c
D
0.31
0.17
4.80 4.90 5.00
E1 3.80 3.90 4.00
2
E
e
F
H
6.00 BSC
1.27 BSC
ccc C
2X N/2 TIPS
e/2
-
-
-
2.95
2.15
0.25
3.50
2.60
0.50
B
h
L
L1
N
01
aaa
bbb
ccc
0.40 0.72 1.04
(1.05)
D
aaa C
8
-
0°
8°
A2
A
SEATING
PLANE
0.10
0.25
0.20
C
A1
bxN
bbb
C A-B D
h
F
h
EXPOSED PAD
H
H
c
GAUGE
PLANE
L
0.25
01
(L1)
DETAIL A
SEE DETAIL A
SIDE VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
.
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. THE MEASUREMENT OF DIMENSION "F" DOES NOT INCLUDE EXPOSED TIE BAR.
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SC4211H
POWER MANAGEMENT
Land Pattern - SOIC-8-EDP
E
D
SOLDER
MASK
DIMENSIONS
DIM MILLIMETERS
(5.30)
3.50
5.10
2.60
3.20
1.27
0.60
2.10
7.40
C
D
E
F
G
P
X
Y
Z
(C)
F
G
Y
Z
THERMAL VIA
Ø 0.36mm
P
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSE ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE
CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY
COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF
THE DEVICE.
4. REFERENCE IPC-SM-782A, SECTION 9.1, RLP NO. 300A.
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
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