SMDA12.T [SEMTECH]
Unidirectional TVS Array for Protection of Four Lines; 单向TVS阵列的保护四行
| 型号： | SMDA12.T |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Unidirectional TVS Array for Protection of Four Lines |
| 文件： | 总7页 (文件大小：163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMDA05 through SMDA24
Unidirectional TVS Array
for Protection of Four Lines
PROTECTION PRODUCTS
Features
Description
The SMDAxx series of TVS arrays are designed to provide
undirectional protection for sensitive electronics from
damage or latch-up due to ESD, lightning, and other
voltage-induced transient events. Each device will
protect four data or I/O lines. They are available with
operating voltages of 5V, 12V, 15V and 24V.
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Undirectional protection
Small SO-8 package
Protects four I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
TVS diodes are solid-state devices designed specifically
for transient suppression. They offer desirable charac-
teristics for board level protection including fast re-
sponse time, low operating and clamping voltage and no
device degradation. The low profile SO-8 package allows
the user to protect up to four independent lines with one
package. The SMDAxx series is suitable protection for
sensitive semiconductors components such as micropro-
cessors, ASICs, transceivers, transducers, and CMOS
memory.
Mechanical Characteristics
JEDEC SO-8 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
The SMDAxx series devices may be used to meet the
ESD immunity requirements of IEC 61000-4-2, level 4 for
air and contact discharge.
Applications
RS-232 data lines
Microprocessor based equipment
Notebooks, Desktops, and Servers
Instrumentation
LAN/WAN equipment
Peripherals
Serial and Parallel Ports
Schematic & PIN Configuration
1
8
2
3
7
6
4
5
SO-8 (Top View)
www.semtech.com
Revision 08/15/06
1
SMDA05 through SMDA24
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20µs)
ESD Voltage (HBM per IEC 61000-4-2)
Lead Soldering Temperature
Operating Temperature
Symbol
Ppk
Value
300
Units
Watts
kV
VESD
TL
>25
260 (10 sec.)
-55 to +125
-55 to +150
°C
TJ
°C
Storage Temperature
TSTG
°C
Electrical Characteristics (T=25oC)
SMDA05
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
5
V
V
It = 1mA
6
VRWM = 5V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 5A, tp = 8/20µs
tp = 8/20µs
20
9.8
11
µA
V
VC
Clamping Voltage
VC
V
Peak Pulse Current
IPP
17
A
Junction Capacitance
Cj
VR = 0V, f = 1MHz
400
pF
SMDA12
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
12
It = 1mA
13.3
V
VRWM = 12V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 5A, tp = 8/20µs
tp = 8/20µs
1
19
24
µA
V
VC
Clamping Voltage
VC
V
Peak Pulse Current
Junction Capacitance
IPP
12
150
A
Cj
VR = 0V, f = 1MHz
pF
www.semtech.com
2005 Semtech Corp.
2
SMDA05 through SMDA24
PROTECTION PRODUCTS
Electrical Characteristics (Continued)
SMDA15
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
15
It = 1mA
16.7
V
VRWM = 15V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 5A, tp = 8/20µs
tp = 8/20µs
1
24
µA
V
VC
Clamping Voltage
VC
30
10
V
Peak Pulse Current
IPP
A
Junction Capacitance
Cj
VR = 0V, f = 1MHz
100
pF
SMDA24
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
24
It = 1mA
26.7
V
VRWM = 24V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 5A, tp = 8/20µs
tp = 8/20µs
1
43
55
5
µA
V
VC
Clamping Voltage
VC
V
Peak Pulse Current
Junction Capacitance
IPP
A
Cj
VR = 0V, f = 1MHz
60
pF
www.semtech.com
2005 Semtech Corp.
3
SMDA05 through SMDA24
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
100
90
80
70
60
50
40
30
20
10
0
1
0.1
0.01
0
25
50
75
100
125
150
0.1
1
10
100
1000
Pulse Duration - tp (µs)
Ambient Temperature - TA (oC)
Pulse Waveform
110
100
90
80
70
60
50
40
30
20
10
0
W aveform
Parameters:
tr = 8µs
td = 20µs
e-t
td = IPP/2
0
5
10
15
20
25
30
Tim e (µs)
ESD Pulse Waveform (IEC 61000-4-2)
IEC 61000-4-2 Discharge Parameters
Level
First
Peak
Peak
Test
Test
Peak
Current
Current
Voltage
(Contact
Voltage
(Air
Current at 30 ns at 60 ns
Discharge) Discharge)
(A)
7.5
(A)
4
(A)
8
(kV)
(kV)
1
2
3
4
2
2
15
22.5
30
8
4
6
8
4
6
8
4
8
12
16
15
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2005 Semtech Corp.
4
SMDA05 through SMDA24
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Four Data Lines
Circuit Diagram
The SMDAxx series of devices are designed to protect up
to four data lines. The devices are connected as follows:
1
8
z
The SMDAxx are unidirectional devices and are
designed for use on lines where the normal operat-
ing voltage is above ground. Pins 1, 2, 3, and 4 are
connected to the protected lines. Pins 5, 6, 7, and 8
are connected to ground. The ground connections
should be made directly to the ground plane for best
results. The path length is kept as short as possible
to reduce the effects of parasitic inductance in the
board traces.
2
3
7
6
4
5
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
I/O Line Protection
Good circuit board layout is critical for the suppression of
ESD induced transients. The following guidelines are
recommended:
z
z
z
z
Place the TVS near the input terminals or connectors
to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
z
z
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Typical Connection
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish is
composed of 100% tin solder with large grains. Since
the solder volume on the leads is small compared to the
solder paste volume that is placed on the land pattern of
the PCB, the reflow profile will be determined by the
requirements of the solder paste. Therefore, these
devices are compatible with both lead-free and SnPb
assembly techniques. In addition, unlike other lead-free
compositions, matte tin does not have any added alloys
that can cause degradation of the solder joint.
To Protected
Device
1
2
8
7
Ground
3
4
6
5
From Connector
www.semtech.com
2005 Semtech Corp.
5
SMDA05 through SMDA24
PROTECTION PRODUCTS
Outline Drawing - SO-8
A
h
D
E
e
DIMENSIONS
N
INCHES
MILLIMETERS
h
DIM
A
MIN NOM MAX MIN NOM MAX
H
E/2
2X
-
-
-
-
-
-
-
-
-
-
.053
.069 1.35
.010 0.10
.065 1.25
.020 0.31
.010 0.17
1.75
0.25
1.65
0.51
0.25
A1 .004
A2 .049
E1
c
GAGE
b
c
D
.012
.007
PLANE
1
2
.189 .193 .197 4.80 4.90 5.00
0.25
L
(L1)
E1 .150 .154 .157 3.80 3.90 4.00
ccc
C
01
E
e
.236 BSC
6.00 BSC
2X N/2 TIPS
e/2
B
.050 BSC
1.27 BSC
-
0.50
-
DETAIL A
h
.010
.020 0.25
L
.016 .028 .041 0.40 0.72 1.04
(.041)
(1.04)
L1
N
8
8
D
-
-
01
aaa
bbb
ccc
0°
8°
0°
8°
aaa C
.004
.010
.008
0.10
0.25
0.20
A2
A
SEE DETAIL A
SEATING
PLANE
SIDE VIEW
C
A1
bxN
bbb
C
A-B D
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
REFERENCE JEDEC STD MS-012, VARIATION AA.
4.
Land Pattern - SO-8
X
DIMENSIONS
DIM
INCHES
MILLIMETERS
(.205)
(5.20)
3.00
1.27
0.60
2.20
7.40
C
G
P
X
Y
Z
.118
.050
.024
.087
.291
(C)
G
Y
Z
P
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.
REFERENCE IPC-SM-782A, RLP NO. 300A.
www.semtech.com
2005 Semtech Corp.
6
SMDA05 through SMDA24
PROTECTION PRODUCTS
Ordering Information
Working
Part Number
Lead
Finish
Qty per Reel
Reel Size
Voltage
SMDA05.TB
SMDA12.TB
SMDA15.TB
SMDA24.TB
SMDA05.TBT
SMDA12.TBT
SMDA15.TBT
SMDA24.TBT
SMDA05
5
SnPb
SnPb
500
500
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
N/A
12
15
24
5
SnPb
500
SnPb
500
Pb Free
Pb Free
Pb Free
Pb Free
SnPb
500
12
15
24
5
500
500
500
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
SMDA12
12
15
24
5
SnPb
N/A
SMDA15
SnPb
N/A
SMDA24
SnPb
N/A
SMDA05.T
SMDA12.T
SMDA15.T
SMDA24.T
Pb Free
Pb Free
Pb Free
Pb Free
N/A
12
15
24
N/A
N/A
N/A
Note: Lead-free devices are RoHS/WEEE Compliant
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2005 Semtech Corp.
7
相关型号：
SMDA12.TE
Trans Voltage Suppressor Diode, 300W, Unidirectional, 4 Element, Silicon, MS-012AA,
SEMTECH
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