SMDA12C-5TB [SEMTECH]

Bidirectional TVS Array for Protection of Five Lines; 双向TVS阵列为保护五行
SMDA12C-5TB
型号: SMDA12C-5TB
厂家: SEMTECH CORPORATION    SEMTECH CORPORATION
描述:

Bidirectional TVS Array for Protection of Five Lines
双向TVS阵列为保护五行

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文件: 总7页 (文件大小:163K)
中文:  中文翻译
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SMDA05C-5 THRU SMDA24C-5  
Bidirectional TVS Array  
for Protection of Five Lines  
PROTECTION PRODUCTS  
Features  
Description  
The SMDAxxC-5 series of transient voltage suppres-  
sors are designed to protect components which are  
connected to data and transmission lines from voltage  
surges caused by ESD (electrostatic discharge), EFT  
(electrical fast transients), and lightning.  
u Transient protection for data lines to  
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)  
IEC 61000-4-4 (EFT) 40A (5/50ns)  
IEC 61000-4-5 (Lightning) 12A (8/20µs)  
u Small SO-8 surface mount package  
u Protects five I/O lines  
u Working voltages: 5V, 12V, 15V and 24V  
u Low leakage current  
u Low operating and clamping voltages  
u Solid-state silicon avalanche technology  
TVS diodes are characterized by their high surge  
capability, low operating and clamping voltages, and  
fast response time. This makes them ideal for use as  
board level protection of sensitive semiconductor  
components. The SMDAxxC-5 is designed to provide  
transient suppression on multiple data lines and I/O  
ports. The low profile SO-8 design allows the user to  
protect up to five data and I/O lines with one package.  
Mechanical Characteristics  
u JEDEC SO-8 package  
u Molding compound flammability rating: UL 94V-0  
u Marking : Part number, date code, logo  
u Packaging : Tube or Tape and Reel per EIA 481  
The SMDAxxC-5 TVS diode array will meet the surge  
requirements of IEC 61000-4-2 (Formerly IEC 801-2),  
Level 4, “Human Body Model” for air and contact  
discharge.  
Applications  
u RS-232 & RS-422 Data Lines  
u Microprocessor Based Equipment  
u LAN/WAN Equipment  
u Notebooks, Desktops, & Servers  
u Instrumentation  
u Peripherals  
u Set Top Box  
u Serial and Parallel Ports  
Schematic & PIN Configuration  
SO-8 (Top View)  
www.semtech.com  
Revision 9/2000  
1
SMDA05C-5 THRU SMDA24C-5  
PROTECTION PRODUCTS  
Absolute Maximum Rating  
Rating  
Peak Pulse Power (tp = 8/20µs)  
Lead Soldering Temperature  
Operating Temperature  
Symbol  
Ppk  
Value  
300  
Units  
Watts  
°C  
TL  
260 (10 sec.)  
-55 to +125  
-55 to +150  
TJ  
°C  
Storage Temperature  
TSTG  
°C  
Electrical Characteristics  
SMDA05C-5  
Parameter  
Symbol  
VRWM  
VBR  
IR  
Conditions  
Minimum  
Typical  
Maximum  
Units  
Reverse Stand-Off Voltage  
Reverse Breakdown Voltage  
Reverse Leakage Current  
Clamping Voltage  
5
V
V
It = 1mA  
6
VRWM = 5V, T=25°C  
IPP = 1A, tp = 8/20µs  
tp = 8/20µs  
20  
9.8  
17  
µA  
V
VC  
Maximum Peak Pulse Current  
Junction Capacitance  
IPP  
A
Cj  
Between I/O Pins and  
Gnd  
350  
pF  
VR = 0V, f = 1MHz  
SMDA12C-5  
Parameter  
Symbol  
VRWM  
VBR  
IR  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
Reverse Stand-Off Voltage  
Reverse Breakdown Voltage  
Reverse Leakage Current  
Clamping Voltage  
12  
It = 1mA  
16.7  
V
VRWM = 12V, T=25°C  
IPP = 1A, tp = 8/20µs  
tp = 8/20µs  
1
µA  
V
VC  
19  
Maximum Peak Pulse Current  
Junction Capacitance  
IPP  
12  
A
Cj  
Between I/O Pins and  
Gnd  
120  
pF  
VR = 0V, f = 1MHz  
www.semtech.com  
ã 2000 Semtech Corp.  
2
SMDA05C-5 THRU SMDA24C-5  
PROTECTION PRODUCTS  
Electrical Characteristics  
SMDA15C-5  
Parameter  
Symbol  
VRWM  
VBR  
IR  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
Reverse Stand-Off Voltage  
Reverse Breakdown Voltage  
Reverse Leakage Current  
Clamping Voltage  
15  
It = 1mA  
16.7  
V
VRWM = 15V, T=25°C  
IPP = 1A, tp = 8/20µs  
tp = 8/20µs  
1
µA  
V
VC  
24  
10  
75  
Maximum Peak Pulse Current  
Junction Capacitance  
IPP  
A
Cj  
Between I/O Pins and  
Gnd  
pF  
VR = 0V, f = 1MHz  
SMDA24C-5  
Parameter  
Symbol  
VRWM  
VBR  
IR  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
Reverse Stand-Off Voltage  
Reverse Breakdown Voltage  
Reverse Leakage Current  
Clamping Voltage  
24  
It = 1mA  
26.7  
V
VRWM = 24V, T=25°C  
IPP = 1A, tp = 8/20µs  
tp = 8/20µs  
1
43  
5
µA  
V
VC  
Maximum Peak Pulse Current  
Junction Capacitance  
IPP  
A
Cj  
Between I/O Pins and  
Gnd  
50  
pF  
VR = 0V, f = 1MHz  
www.semtech.com  
ã 2000 Semtech Corp.  
3
SMDA05C-5 THRU SMDA24C-5  
PROTECTION PRODUCTS  
Typical Characteristics  
Non-Repetitive Peak Pulse Power vs. Pulse Time  
Power Derating Curve  
10  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1
0.1  
0.01  
0
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
1000  
Ambient Temperature - TA (oC)  
Pulse Duration - tp (µs)  
Pulse Waveform  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Waveform  
Parameters:  
tr = 8µs  
td = 20µs  
e-t  
td = IPP/2  
0
5
10  
15  
20  
25  
30  
Time (µs)  
ESD Pulse Waveform (Per IEC 61000-4-2)  
IEC 61000-4-2 Discharge Parameters  
Level  
First  
Peak  
Peak  
Test  
Test  
Peak  
Current  
Current  
Voltage  
(Contact  
Voltage  
(Air  
Current at 30 ns at 60 ns  
Discharge) Discharge)  
(A)  
7.5  
(A)  
4
(A)  
8
(kV)  
(kV)  
1
2
3
4
2
2
15  
22.5  
30  
8
4
6
8
4
6
8
4
8
12  
16  
15  
www.semtech.com  
ã 2000 Semtech Corp.  
4
SMDA05C-5 THRU SMDA24C-5  
PROTECTION PRODUCTS  
Applications Information  
Device Connection for Protection of Five Data Lines  
Circuit Diagram  
The SMDAxxC-5 is designed to protect up to 5 data or  
I/O lines. They are bidirectional devices and may be  
used on lines where the signal polarities are above and  
below ground.  
The SMDAxxC-5 TVS arrays employ a monolithic struc-  
ture. Therefore, the working voltage (VRWM) and break-  
down voltage (VBR) specifications apply to the differen-  
tial voltage between any two data line pins. For ex-  
ample, the SMDA24C-5 is designed for a maximum  
voltage excursion of +/-12V between any two data  
lines.  
The device is connected as follows:  
l
Pins 1, 2, 3, 4, and 5 are connected to the lines  
that are to be protected. Pin 8 is connected to  
ground. The ground connections should be made  
directly to the ground plane for best results. The  
path length is kept as short as possible to reduce  
the effects of parasitic inductance in the board  
traces. Pins 6 and 7 are not connected.  
Connection Diagram  
DATA IN  
DATA OUT  
8
7
6
5
Circuit Board Layout Recommendations for Suppres-  
sion of ESD.  
Good circuit board layout is critical for the suppression  
of ESD induced transients. The following guidelines are  
recommended:  
4
1
2
3
l
l
l
l
Place the TVS near the input terminals or connec-  
tors to restrict transient coupling.  
Minimize the path length between the TVS and the  
protected line.  
Minimize all conductive loops including power and  
ground loops.  
The ESD transient return path to ground should be  
kept as short as possible.  
DATA IN  
DATA OUT  
l
l
Never run critical signals near board edges.  
Use ground planes whenever possible.  
www.semtech.com  
ã 2000 Semtech Corp.  
5
SMDA05C-5 THRU SMDA24C-5  
PROTECTION PRODUCTS  
Outline Drawing - SO-8  
Land Pattern - SO-8  
www.semtech.com  
ã 2000 Semtech Corp.  
6
SMDA05C-5 THRU SMDA24C-5  
PROTECTION PRODUCTS  
Ordering Information  
Working  
Part Number  
Qty per  
Reel  
Reel Size  
Voltage  
SMDA05C-5.TB  
SMDA05C-5.TE  
SMDA12C-5.TB  
SMDA12C-5.TE  
SMDA15C-5.TB  
SMDA15C-5.TE  
SMDA24C-5.TB  
SMDA24C-5.TE  
5V  
500  
2,500  
500  
7 Inch  
13 Inch  
7 Inch  
5V  
12V  
12V  
15V  
15V  
24V  
24V  
2,500  
500  
13 Inch  
7 Inch  
2,500  
500  
13 Inch  
7 Inch  
2,500  
13 Inch  
Note:  
(1) No suffix indicates tube pack.  
Contact Information  
Semtech Corporation  
Protection Products Division  
652 Mitchell Rd., Newbury Park, CA 91320  
Phone: (805)498-2111 FAX (805)498-3804  
www.semtech.com  
ã 2000 Semtech Corp.  
7

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