SMF05C.TCT [SEMTECH]

TVS Diode Array For ESD and Latch-Up Protection; TVS二极管阵列用于ESD和闩锁保护


型号：	SMF05C.TCT
厂家：	SEMTECH CORPORATION
描述：	TVS Diode Array For ESD and Latch-Up Protection TVS二极管阵列用于ESD和闩锁保护瞬态抑制器二极管电视光电二极管 PC 局域网
文件：	总7页 (文件大小：153K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMF05C

TVS Diode Array

For ESD and Latch-Up Protection

PRELIMINARY

PROTECTION PRODUCTS

Features

Description

The SMF series TVS arrays are designed to protect sen-

sitive electronics from damage or latch-up due to ESD

and other voltage-induced transient events. They are

designed for use in applications where board space is at

a premium. Each device will protect up to five lines. They

are unidirectional devices and may be used on lines where

the signal polarities are above ground.

ESD protection for data lines to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

IEC 61000-4-4 (EFT) 40A (5/50ns)

Small package for use in portable electronics

Protects five I/O lines

Working voltage: 5V

Low leakage current

TVS diodes are solid-state devices designed specifically

for transient suppression. They feature large cross-sec-

tional area junctions for conducting high transient cur-

rents. They offer desirable characteristics for board level

protection including fast response time, low operating

and clamping voltage, and no device degradation.

Low operating and clamping voltages

Solid-state silicon-avalanche technology

Mechanical Characteristics

EIAJ SC70-6L package

Molding compound flammability rating: UL 94V-0

Marking : Marking Code

The SMF series devices may be used to meet the immu-

nity requirements of IEC 61000-4-2, level 4. The small

SC70 package makes them ideal for use in portable elec-

tronics such as cell phones, PDA’s, notebook comput-

ers, and digital cameras.

Packaging : Tape and Reel per EIA 481

Applications

Cellular Handsets and Accessories

Cordless Phones

Personal Digital Assistants (PDA’s)

Notebooks and Handhelds

Portable Instrumentation

Digital Cameras

Peripherals

MP3 Players

Circuit Diagram

Schematic & PIN Configuration

SC70-6L (Top View)

www.semtech.com

Revision 08/04/04

SMF05C

PRELIMINARY

PROTECTION PRODUCTS

Absolute Maximum Rating

Rating

Peak Pulse Power (tp = 8/20µs)

Peak Pulse Current (tp = 8/20µs)

Symbol

P_pk

Value

100

Units

Watts

I_PP

ESD per IEC 61000-4-2 (Air)

ESD per IEC 61000-4-2 (Contact)

V_ESD

Lead Soldering Temperature

Operating Temperature

Storage Temperature

T_L

T_J

260 (10 seconds)

-55 to +125

^oC

T_STG

-55 to +150

Electrical Characteristics

SMF05C

Parameter

Symbol

V_RWM

V_BR

I_R

Conditions

Minimum

Typical

Maximum

Units

Reverse Stand-Off Voltage

Reverse Breakdown Voltage

Reverse Leakage Current

Clamping Voltage

I_t= 1mA

V_RWM= 5V, T=25°C

I_PP= 5A, t_p= 8/20µs

I_PP= 8A, t_p= 8/20µs

V_R= 0V, f = 1MHz

µA

V_C

9.8

Clamping Voltage

V_C

12.5

130

Junction Capacitance

C_j

www.semtech.com

2004 Semtech Corp.

SMF05C

PRELIMINARY

PROTECTION PRODUCTS

Typical Characteristics

Non-Repetitive Peak Pulse Power vs. Pulse Time

Power Derating Curve

110

100

0.1

0.01

100

125

150

0.1

100

1000

Pulse Duration - t_p(µs)

Ambient Temperature - T_A(^oC)

Pulse Waveform

Clamping Voltage vs. Peak Pulse Current

110

100

Waveform

Parameters:

tr = 8µs

td = 20µs

e^-t

td = I_PP/2

Waveform

Parameters:

tr = 8µs

td = 20µs

Time (µs)

Peak Pulse Current - I_PP(A)

Capacitance vs. Reverse Voltage

ESD Clamping Characteristics

(8kV Contact Discharge per IEC 61000-4-2)

140

120

100

f = 1MHz

Reverse Voltage - V_R(V)

www.semtech.com

2004 Semtech Corp.

SMF05C

PRELIMINARY

PROTECTION PRODUCTS

Applications Information

Device Connection for Protection of Five Data Lines

SMF05C Circuit Diagram

The SMF05C is designed to protect up to five unidirec-

tional data lines. The device is connected as follows:

1. Unidirectional protection of five I/O lines is

achieved by connecting pins 1, 3, 4, 5 and 6 to the

data lines. Pin 2 is connected to ground. The

ground connection should be made directly to the

ground plane for best results. The path length is

kept as short as possible to reduce the effects of

parasitic inductance in the board traces.

Circuit Board Layout Recommendations for Suppres-

sion of ESD.

Good circuit board layout is critical for the suppression

of ESD induced transients. The following guidelines are

recommended:

Protection of Five Unidirectional Lines

Place the SMF05C near the input terminals or

connectors to restrict transient coupling.

Minimize the path length between the SMF05C and

the protected line.

Minimize all conductive loops including power and

ground loops.

The ESD transient return path to ground should be

kept as short as possible.

Never run critical signals near board edges.

Use ground planes whenever possible.

Matte Tin Lead Finish

Matte tin has become the industry standard lead-free

replacement for SnPb lead finishes. A matte tin finish

is composed of 100% tin solder with large grains.

Since the solder volume on the leads is small com-

pared to the solder paste volume that is placed on the

land pattern of the PCB, the reflow profile will be

determined by the requirements of the solder paste.

Therefore, these devices are compatible with both

lead-free and SnPb assembly techniques. In addition,

unlike other lead-free compositions, matte tin does not

have any added alloys that can cause degradation of

the solder joint.

www.semtech.com

2004 Semtech Corp.

SMF05C

PRELIMINARY

PROTECTION PRODUCTS

Typical Applications

www.semtech.com

2004 Semtech Corp.

SMF05C

PRELIMINARY

PROTECTION PRODUCTS

Outline Drawing - SC70 6L

DIMENSIONS

INCHES MILLIMETERS

DIM

MIN NOM MAX MIN NOM MAX

.043

1.10

0.10

A1 .000

.004 0.00

E/2

SEE DETAIL A

A2 .028 .035 .039 0.70 0.90 1.00

.006

.003

.012 0.15

.009 0.08

0.30

0.22

SIDE VIEW

.075 .079 .083 1.90 2.00 2.10

E1 .045 .049 .053 1.15 1.25 1.35

ccc C

2X N/2 TIPS

.083 BSC

.026 BSC

.051

2.10 BSC

0.65 BSC

1.30 BSC

.010 .014 .018 0.26 0.36 0.46

GAGE

(.017)

(0.42)

PLANE

0.15

0°

8°

0°

8°

aaa

.004

.012

0.10

0.30

(L1)

bbb

ccc

aaa C

^DETAILA

SEATING

PLANE

bxN

bbb

C A-B D

NOTES:

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-

DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS

OR GATE BURRS.

REFERENCE JEDEC STD MO-203, VARIATION AB.

Land Pattern - SC70 6L

DIMENSIONS

DIM

INCHES

MILLIMETERS

(.073)

.039

.026

.016

.033

.106

(1.85)

1.00

0.65

0.40

0.85

2.70

NOTES:

1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

www.semtech.com

2004 Semtech Corp.

SMF05C

PRELIMINARY

PROTECTION PRODUCTS

Marking Codes

Marking

Part Number

Code

SMF05C

Note:

(1) Pin 1 Identified with a dot

Ordering Information

Qty per

Reel

Part Number

Lead Finish

Reel Size

SMF05C.TC

SMF05C.TCT

SnPb

3,000

7 Inch

Matte Sn

Contact Information

Semtech Corporation

Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804

www.semtech.com

2004 Semtech Corp.

相关型号：