SMF05C.TGT [SEMTECH]
Trans Voltage Suppressor Diode, 100W, Unidirectional, 5 Element, Silicon, PLASTIC, SC-70, 6 PIN;
| 型号： | SMF05C.TGT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Trans Voltage Suppressor Diode, 100W, Unidirectional, 5 Element, Silicon, PLASTIC, SC-70, 6 PIN 局域网 光电二极管 |
| 文件： | 总7页 (文件大小：521K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMF05C
TVS Diode Array
For ESD and Latch-Up Protection
PROTECTION PRODUCTS
Features
Description
The SMF series TVS arrays are designed to protect sen-
sitive electronics from damage or latch-up due to ESD
and other voltage-induced transient events. They are
designed for use in applications where board space is at
a premium. Each device will protect up to five lines. They
are unidirectional devices and may be used on lines where
the signal polarities are above ground.
ESD protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Small package for use in portable electronics
Protects five I/O lines
Working voltage: 5V
Low leakage current
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec-
tional area junctions for conducting high transient cur-
rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
EIAJ SC70-6L package
The SMF series devices may be used to meet the immu-
nity requirements of IEC 61000-4-2, level 4. The small
SC70 package makes them ideal for use in portable elec-
tronics such as cell phones, PDA’s, notebook comput-
ers, and digital cameras.
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
Applications
Cellular Handsets and Accessories
Cordless Phones
Personal Digital Assistants (PDA’s)
Notebooks and Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Circuit Diagram
Schematic & PIN Configuration
1
3
4
5
6
1
2
3
6
5
4
2
SC70-6L (Top View)
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Revision 01/29/03
1
SMF05C
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20µs)
Peak Pulse Current (tp = 8/20µs)
Symbol
Ppk
Value
100
8
Units
Watts
A
IPP
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
20
15
VESD
kV
Lead Soldering Temperature
Operating Temperature
Storage Temperature
TL
TJ
260 (10 seconds)
-55 to +125
oC
oC
oC
TSTG
-55 to +150
Electrical Characteristics
SMF05C
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
5
It = 1mA
6
V
VRWM = 5V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 8A, tp = 8/20µs
VR = 0V, f = 1MHz
5
µA
V
VC
9.8
Clamping Voltage
VC
12.5
130
V
Junction Capacitance
Cj
pF
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2003 Semtech Corp.
2
SMF05C
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
10
1
0.1
0.01
0
25
50
75
100
125
150
0.1
1
10
100
1000
Pulse Duration - tp (µs)
Ambient Temperature - TA (oC)
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
110
100
90
80
70
60
50
40
30
20
10
0
9
Waveform
Parameters:
tr = 8µs
8
7
6
5
4
3
2
1
0
td = 20µs
e-t
td = IPP/2
Waveform
Parameters:
tr = 8µs
td = 20µs
0
5
10
15
20
25
30
Time (µs)
0
2
4
6
8
10
Peak Pulse Current - IPP (A)
Capacitance vs. Reverse Voltage
ESD Clamping Characteristics
(8kV Contact Discharge per IEC 61000-4-2)
140
120
100
80
60
40
20
0
f = 1MHz
0
1
2
3
4
5
6
Reverse Voltage - VR (V)
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2003 Semtech Corp.
3
SMF05C
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Five Data Lines
SMF05C Circuit Diagram
4
The SMF05C is designed to protect up to five unidirec-
tional data lines. The device is connected as follows:
1
3
5
6
1. Unidirectional protection of five I/O lines is
achieved by connecting pins 1, 3, 4, 5 and 6 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
2
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Protection of Five Unidirectional Lines
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
Place the SMF05C near the input terminals or
connectors to restrict transient coupling.
Minimize the path length between the SMF05C and
the protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
z
z
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2003 Semtech Corp.
4
SMF05C
PROTECTION PRODUCTS
Typical Applications
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2003 Semtech Corp.
5
SMF05C
PROTECTION PRODUCTS
Outline Drawing
Land Pattern
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2003 Semtech Corp.
6
SMF05C
PROTECTION PRODUCTS
Marking Codes
Marking
Part Number
Code
SMF05C
5C
Note:
(1) Pin 1 Identified with a dot
Ordering Information
Working
Part Number
Qty per Reel
Reel Size
Voltage
SMF05C.TC
SMF05C.TG
5V
5V
3,000
7 Inch
10,000
13 Inch
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2003 Semtech Corp.
7
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