SX9501IULTRT_技术文档

SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

GENERAL

D

ESCRIPTION

KEY PRODUCT FEATURES

The SX9501 is a low-cost, very low power 4-channel

capacitive controller that can operate either as a proximity or

button sensor. It operates directly from an input supply

voltage of 2.7 to 5.5V.

2.7 – 5.5V Input Supply Voltage

Capacitive Sensor Inputs

4 fF Capacitance Resolution

Stable Proximity & Touch Sensing With Temperature

Capacitance Offset Compensation to 30pF

The SX9501 is simple to use since there are no host

software interfacing requirements. All touch or proximity

communication is direct on a set of dedicated active low

open drain outputs, enabling interfacing to separate host

voltage supplies.

Active Sensor Guarding

Automatic Calibration

Ultra Low Power Consumption:

Active Mode:

Doze Mode:

Sleep Mode:

122 uA

26 uA

2.1 uA

The SX9501 is highly programmable for wide range of

applications, featuring six (6) digitally controlled hardware

inputs to set capacitive sensors sensitivity, detection

threshold, and hysteresis.

Individual Capacitive Sensor Dedicated Outputs

Direct Capacitive Sensor Mapping To Outputs

Open Drain Outputs With 6 mA Sink Current

Additionally, the SX9501 includes sophisticated on-chip auto-

calibration circuitry to regularly perform sensitivity

adjustments, maintaining peak performance over a wide

variation of temperature, humidity and noise environments,

providing simplified product development and enhanced

performance.

Two (2) Reset Sources: POR, NRST pin

-40°C to +85°C Operation

Compact Size: 3 x 3mm Thin QFN package

Pb & Halogen Free, RoHS/WEEE compliant

A dedicated transmit enable (TXEN) pin is available to

synchronize capacitive measurements for applications that

require synchronous detection, enabling very low supply

current and high noise immunity by only measuring proximity

when requested.

A

PPLICATIONS

•

TV

Mechanical button replacement

Mobile Appliances

ORDERING INFORMATION

Part Number

SX9501IULTRT ¹

SX9500EVKA ²

Package Marking

QFN-20

Eval. Kit

ZC92

1

3000 Units/reel

2

Cf. §7.3 for more information

T

YPICAL

APPLICATION CIRCUIT

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

Table of Contents

G

ENERAL

EY RODUCT

PPLICATIONS.......................................................................................................................................1ꢀ

RDERING NFORMATION......................................................................................................................1ꢀ

YPICAL PPLICATION CIRCUIT ............................................................................................................1ꢀ

ENERAL ESCRIPTION...............................................................................................................4ꢀ

D

ESCRIPTION........................................................................................................................1ꢀ

K

A

P

F

EATURES.....................................................................................................................1ꢀ

O

I

T

A

1ꢀ

G

D

1.1

1.2

1.3

1.4

ꢀ

Pin Diagram

4ꢀ

5ꢀ

Marking Information

Pin Description

Acronyms

2ꢀ

3ꢀ

E

LECTRICAL CHARACTERISTICS .................................................................................................6ꢀ

2.1

2.2

2.3

2.4

ꢀ

Absolute Maximum Ratings

Operating Conditions

6ꢀ

7ꢀ

ꢀ

Thermal Characteristics

Electrical Specifications

ꢀ

PROXIMITY SENSING INTERFACE.................................................................................................8ꢀ

3.1

3.2

3.3

ꢀ

Introduction

Scan Period

8

ꢀ

8

ꢀ

Analog Front-End (AFE)

9

11

ꢀ

3.3.1

3.3.2

3.3.3

ꢀ

Capacitive Sensing Basics

AFE Block Diagram

Offset Compensation

3.4

3.5

ꢀ

Digital Processing

Operational Modes

12

ꢀ

13

ꢀ

3.5.1

3.5.2

3.5.3

3.5.4

ꢀ

Active

Doze

Sleep

TXEN Pin

4ꢀ

5ꢀ

R

ESET.........................................................................................................................................14ꢀ

4.1

4.2

ꢀ

Power-up

NRST Pin

14

ꢀ

PINS DESCRIPTION .....................................................................................................................15ꢀ

5.1

5.2

5.3

5.4

5.5

ꢀ

V_DD

15

ꢀ

TXEN

ꢀ

Capacitive Sensing Interface (CS0, CS1, CS2, CS3, CSG)

PROX[3:0]

ꢀ

HYST, C_INR[1:0], THRESH[2:0], NRST and TXEN

6ꢀ

7ꢀ

C

ONFIGURATION ........................................................................................................................16ꢀ

6.1

6.2

6.3

6.4

ꢀ

Introduction

CINR[1:0]

THRESH[2:0]

HYST

16

17

ꢀ

APPLICATION

INFORMATION......................................................................................................18ꢀ

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

7.1

7.2

7.3

ꢀ

Typical Application Circuit

External Components Recommended Values

Evaluation

18

ꢀ

8ꢀ

P

ACKAGING INFORMATION ........................................................................................................19ꢀ

8.1

8.2

ꢀ

Outline Drawing

Land Pattern

19

20

ꢀ

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

1 GENERAL

DESCRIPTION

1.1 Pin Diagram

Figure 1: Pin Diagram

1.2 Marking Information

Figure 2: Marking Information

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Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

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1.3 Pin Description

Number Name

Type

Description

1

2

CSG

CS3

CS2

CS1

CS0

GND

Analog

Ground

Input

Capacitive Sensor Guard/Shield

Capacitive Sensor 3, do not connect if not used

Capacitive Sensor 2, do not connect if not used

Capacitive Sensor 1, do not connect if not used

Capacitive Sensor 0, do not connect if not used

Ground

3

4

5

6

7

CINR0

Sensitivity/Range bit 0, 3-state, connect to V_DD,GND or leave open

Sensitivity/Range bit 1, 3-state, connect to V_DD,GND or leave open

8

CINR1

Input

9

HYST

THRESH0

V_DD

Input

Hysteresis, 3-state, connect to V_DD,GND or leave open

Detection Threshold bit 0, 3-state, connect to V_DD,GND or leave open

Chip power supply

10

11

12

13

14

15

16

17

18

19

20

DAP

Input

Power

Input

THRESH2

THRESH1

PROX3

PROX2

TXEN

Detection Threshold bit 2, 3-state, connect to V_DD,GND or leave open

Detection Threshold bit 1, 3-state, connect to V_DD,GND or leave open

CS3 detection output, active LOW, requires pull-up to max V_DD

CS2 detection output, active LOW, requires pull-up to max V_DD

Transmit Enable, active HIGH (Tie to V_DDif not used).

External reset, active LOW (Tie to V_DDif not used).

CS1 detection output, active LOW, requires pull-up to max V_DD

CS0 detection output, active LOW, requires pull-up to max V_DD

Ground

Input

Digital Output

Digital Input

NRST

PROX1

PROX0

GND

Digital Output

Ground

GND

Ground

Exposed Pad. Connect to Ground

Table 1: Pin Description

1.4 Acronyms

DAP

RF

Die Attach Paddle

Radio Frequency

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Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

2 ELECTRICAL

CHARACTERISTICS

2.1 Absolute Maximum Ratings

Stresses above the values listed in “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at these, or any other conditions beyond the

“Operating Conditions”, is not implied. Exposure to Absolute Maximum Rating conditions for extended periods

may affect device reliability and proper functionality.

Parameter

Symbol

Min

-0.5

-10

-40

-

Max

6.0

Unit

V

Supply Voltage

V

DD

Input Voltage (non-supply pins)

Input Current (non-supply pins)

Operating Junction Temperature

Reflow Temperature

V_IN

I_IN

V

DD+0.3

10

mA

T_JCT

125

260

150

-

T_RE

°C

kV

Storage Temperature

T_STOR

ESD_HBM

-50

8

ESD HBM (Human Body model, to JESD22-A114)

Table 2: Absolute Maximum Ratings

2.2 Operating Conditions

Parameter

Symbol

V_DD

Min

2.7

-

Max

5.5

Unit

V

Supply Voltage

PROX [3:0] Output Supply Voltage

Ambient Temperature

PV_DD

T_A

V_DD

85

V

-40

°C

Table 3: Operating Conditions

2.3 Thermal Characteristics

Parameter

Symbol

Typical

Unit

Thermal Resistance – Junction to Air (Static Airflow)

34

°C/W

θ_JA

Table 4: Thermal Characteristics

^Note:θ_JAis calculated from a package in still air, mounted to 3" x 4.5", 4-layer FR4 PCB with thermal vias under

exposed pad per JESD51 standards.

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

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2.4 Electrical Specifications

All values are valid within the operating conditions unless otherwise specified.

Typical values are given for T_A= +25°C, VDD=3.3V unless otherwise specified.

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Current Consumption

Sleep

(TXEN low)

I_SLEEP

I_DOZE

-

2.1

26

-

Doze

C_INR0 = C_INR1 = low

ȝA

(TXEN high, no prox detected)

Active

I_ACTIVE

122

(TXEN high, prox detected)

Outputs: PROX[3:0]

Output Current

I_OL

VOL = 0.4V

6

-

mA

V

Inputs: C_INR[1:0], HYST, THRESH[2:0], TXEN

Input logic high

V_IH

V_IL

0.7 x VDD

-0.3

-

V

DD + 0.3

Input logic low

0.8

1

Input leakage current

I

L

CMOS input

-1

ȝA

0.05x

V_DD

Hysteresis

V_HYS

-

V

-

Maximum capacitance

allowed on these pins

Input Capacitance

INCAPMAX

50

pF

Delay between TXEN rising

TXEN Delay

TXEN_ACTDLYedge and SX9501 starting

measurements

-

100

-

ȝs

Input: NRST

Input logic high

V_IH

V_IL

0.7 x V_DD

-

V_DD+ 0.3

V

Input logic low

-

0.6

-

ns

NRST minimum pulse width T_RESETPW

-

20

Start-up

Power-up time

T_POR

-

1

-

ms

Table 5: Electrical Specifications

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

3 PROXIMITY

SENSING INTERFACE

3.1 Introduction

The purpose of the proximity sensing interface is to detect when a conductive object (usually a body part i.e.

finger, palm, face, etc) is in the proximity of the system. Note that proximity sensing can be done thru the air or

thru a solid (typically plastic) overlay (also called “touch” sensing).

The chip’s proximity sensing interface is based on capacitive sensing technology. An overview is given in figure

below.

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Figure 3: Proximity Sensing Interface Overview

The sensor can be a simple copper area on a PCB or FPC for example. Its capacitance (to ground) will

vary when a conductive object is moving in its proximity.

The optional shield can be also be a simple copper area on a PCB or FPC below/under/around the

sensor. It is used to protect the sensor against potential surrounding noise sources and improve its

global performance. It also brings directivity to the sensing, for example sensing objects approaching

from top only.

The analog front-end (AFE) performs the raw sensor’s capacitance measurement and converts it into a

digital value. It also controls the shield.

The digital processing block computes the raw capacitance measurement from the AFE and extracts a

binary information corresponding to the proximity status of each sensor, i.e. object is “Far” or “Close”.

3.2 Scan Period

To save power and since the proximity event is slow by nature, the chip will be waken-up regularly at every

programmed scan period to first sense sequentially each of the CSx pins and then process new proximity

samples/info. The chip will be in idle mode most of the time. This is illustrated in figure below

Figure 4: Proximity Sensing Sequencing

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

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During the Idle phase, the SX9501‘s analog circuits are turned off. Upon expiry of the idle timer, a new scan

period cycle begins.

The scan period determines the minimum reaction time (actual/final reaction time also depends on debounce and

filtering settings). It is fixed to 30ms in Active mode and 240ms in Doze mode.

3.3 Analog Front-End (AFE)

3.3.1

Capacitive Sensing Basics

Capacitive sensing is the art of measuring a small variation of capacitance in a noisy environment. As mentioned

above, the chip’s proximity sensing interface is based on capacitive sensing technology. In order to illustrate

some of the user choices and compromises required when using this technology it is useful to understand its

basic principles.

To illustrate the principle of capacitive sensing we will use the simplest implementation where the sensor is a

copper plate on a PCB.

The figure below shows a cross-section and top view of a typical capacitive sensing implementation. The sensor

connected to the chip is a simple copper area on top layer of the PCB. It is usually surrounded (shielded) by

ground for noise immunity (shield function) but also indirectly couples via the grounds areas of the rest of the

system (PCB ground traces/planes, housing, etc). For obvious reasons (design, isolation, robustness …) the

sensor is stacked behind an overlay which is usually integrated in the housing of the complete system.

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Figure 5: Typical Capacitive Sensing Implementation

When the conductive object to be detected (finger/palm/face, etc) is not present, the sensor only sees an

inherent capacitance value C_Envcreated by its electrical field’s interaction with the environment, in particular

with ground areas.

When the conductive object (finger/palm/face, etc) approaches, the electrical field around the sensor will be

modified and the total capacitance seen by the sensor increased by the user capacitance C_User. This

phenomenon is illustrated in the figure below.

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Ultra Low Power, Four Channels

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Figure 6: Proximity Effect on Electrical Field and Sensor Capacitance

The challenge of capacitive sensing is to detect this relatively small variation of C_Sensor(C_Userusually contributes

for a few percent only) and differentiate it from environmental noise (C_Envalso slowly varies together with the

environment characteristics like temperature, etc). For this purpose, the chip integrates an auto offset

compensation mechanism which dynamically monitors and removes the C_Envcomponent to extract and process

C

_Useronly.

In first order, C_Usercan be estimated by the formula below:

İ ⋅İ_r⋅ A

0

C_User

=

d

A

is the common area between the two electrodes hence the common area between the user’s finger/palm/face

and the sensor.

d

is the distance between the two electrodes hence the proximity distance between the user and the system.

is the free space permittivity and is equal to 8.85 10e-12 F/m (constant)

İ

0

İ_r

is the dielectric relative permittivity.

Typical permittivity of some common materials is given in the table below.

Material

Typical

İ_r

Glass

FR4

Acrylic Glass

Wood

8

5

3

2

1

Air

Table 6: Typical Permittivity of Some Common Materials

From the discussions above we can conclude that the most robust and efficient design will be the one that

minimizes C_Envvalue and variations while improving C_User

.

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

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3.3.2

AFE Block Diagram

Figure 7: Analog Front-End Block Diagram

3.3.3

Offset Compensation

Offset compensation consists in performing a one-time measurement of C_Envand subtracting it to the total

capacitance C_Sensorin order to feed the ADC with the closest contribution of C_Useronly.

Figure 8: Offset Compensation Block Diagram

The ADC input C_Useris the total capacitance C_Sensorto which C_Envis subtracted.

There are two possible compensation sources which are illustrated in the figure below. When set to 1 by any of

these sources, COMPSTAT will only be reset once the compensation is completed.

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Ultra Low Power, Four Channels

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Figure 9: Compensation Request Sources

Reset: a compensation for all sensors is automatically requested when a reset is performed (power-up,

NRST pin)

CEnv Drift: a compensation for all sensors is automatically requested if it is detected that C_Envhas drifted

beyond a pre-programmed range.

Note that when a compensation occurs all sensors’ flags PROX[3:0] will show inactive status (ie no proximity

detected) independently from the user’s actual presence.

3.4 Digital Processing

The main purpose of the digital processing block is to convert the raw capacitance information coming from the

AFE (PROXRAW) into robust and reliable digital flags PROX[3:0] indicating if something is close to the proximity

sensors.

The offset compensation performed in the AFE is a one-time measurement. However, the environment

capacitance C_Envmay vary with time (temperature, nearby objects, etc). Hence, in order to get the best

estimation of C_User(PROXDIFF) it is needed to dynamically track and subtract C_Envvariations. This is performed

by filtering PROXUSEFUL to extract its slow variations (PROXAVG).

PROXDIFF is then compared to a user programmable threshold (THRESH[2:0]) +/- hysteresis (HYST) to extract

PROX[3:0] value.

Figure 10: Digital Processing Block Diagram

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Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

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3.5 Operational Modes

3.5.1

Active

Active mode is automatically enabled as soon as at least one of the sensors detects proximity. In this mode all

sensors are scanned at a scan period of 30ms.

3.5.2

Doze

In most applications, the reaction/sensing time needs to be fast when the user is present (proximity detected),

but can be slow when no detection has been done for some time.

Doze mode is automatically enabled when no sensor detects proximity. In this mode all sensors are scanned at a

scan period of 240ms.

This allows reaching low average power consumption values at the expense obviously of longer reaction times.

As soon as proximity is detected on any sensor, the chip will automatically switch to Active mode while when it

has not detected an object for 240ms; it will automatically switch back to Doze mode.

3.5.3

Sleep

Sleep mode can be entered by pulling low TXEN pin. It places the SX9501 in its lowest power mode, with sensor

scanning completely disabled and idle period set to continuous.

3.5.4

TXEN Pin

The TXEN input enables proximity sensing when HIGH, likewise when the TXEN input is LOW, the SX9501 is in

Sleep mode. Specifically, on the rising edge of TXEN the SX9501 will begin measuring the sensors normally as

long as TXEN remains HIGH. When TXEN goes LOW the current measurement sequence will complete and

then measurement will cease until the next rising edge of TXEN.

This feature can be used to synchronize proximity sensing with noisy and/or RF activity for example.

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Ultra Low Power, Four Channels

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4 RESET

4.1 Power-up

Chip is ready once V_DDhas met the minimum input voltage requirements and a T_PORtime has expired.

Figure 11: Power-up

4.2 NRST Pin

When the host asserts NRST LOW (for min. T_RESETPW) and then HIGH, the SX9501 will reset and will become

active after T_POR. When not used, this pin must be pulled high to V_DD

.

Figure 12: Hardware Reset

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Ultra Low Power, Four Channels

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5 PINS DESCRIPTION

5.1 V_DD

This is the device’s supply pin. It should be set between 2.7V and 5.5V.

5.2 TXEN

This signal can be used in many applications if a conversion trigger/enable is needed. This input pin

synchronizes the Capacitance Sensing inputs in systems that need to (for example) transmit RF signals. When

this signal is active, SX9501 performs capacitive measurements. If this input becomes inactive during the middle

of a measurement, the SX9501 will complete all remaining measurements and will enter sleep mode until TXEN

goes active again.

5.3 Capacitive Sensing Interface (CS0, CS1, CS2, CS3, CSG)

The Capacitance Sensing input pins CS0, CS1, CS2 and CS3 are connected directly to the Capacitance Sensing

Interface circuitry which converts the sensed capacitance into digital values. The Capacitive Sensor Guard

(CSG) output provides a guard reference to minimize the parasitic sensor pin capacitances to ground.

Capacitance sensor pins which are not used must not be connected. Additionally, CSx pins must be connected

directly to the capacitive sensors using a minimum length circuit trace to minimize external “noise” pick-up.

The capacitance sensor and capacitive sensor guard pins are protected from ESD events to VDD and GND.

5.4 PROX[3:0]

These pins are open-drain outputs that require an external pull-up (max VDD) and are protected from ESD

events to VDD and GND.

5.5 HYST, C_INR[1:0], THRESH[2:0], NRST and TXEN

The HYST, C_INR, THRESH, NRST, and TXEN pins are high impedance input pins that are protected from ESD

events to V_DDand GND.

The HYST, C_INR, and THRESH inputs are designed to be either connected to VDD, GND, or open circuited (no

connect), while NRST and TXEN must be connected to a logic level, either directly or through an external pull-up

resistor.

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Ultra Low Power, Four Channels

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6 CONFIGURATION

6.1 Introduction

The SX9501 can be seen as an SX9500 programmed with the settings below:

Address

0x06

Register

Value

0x0F

010000wwb

00001xxxb

0x65

0x80

0x16

000yyyyyb

01zz0000b

0x00

RegProxCtrl0

RegProxCtrl1

RegProxCtrl2

RegProxCtrl3

RegProxCtrl4

RegProxCtrl5

RegProxCtrl6

RegProxCtrl7

RegProxCtrl8

0x07

0x08

0x09

0x0A

0x0B

0x0C

0x0D

0x0E

Table 7: Equivalent SX9500 Settings

In order to allow some flexibility to match with the different designs/applications requirements, the most critical

parameters (ww, xxx, yyyyy and zz above) are defined thru external pins as described in the following sections.

Each of these pins can be set to 0, 1 or HZ (floating, not connected). Settings apply equally to all sensors.

Important: The external pins configuration is only read and taken into account once during the reset; it cannot be

changed dynamically during normal operation.

6.2 CINR[1:0]

These pins control the RANGE (ww) and RESOLUTION (xxx) parameters as defined below:

C

INR1

0

HZ

1

C

INR0

0

RANGE (ww)

RESOLUTION (xxx)

Medium Coarsest (010)

Medium Coarse (011)

Medium (100)

0

Small (11)

0

HZ

1

0

HZ

1

HZ

1

Medium Fine (101)

Finest (111)

Coarse (001)

Medium Coarse (011)

Medium (100)

Medium Small (10)

Medium Fine (101)

Table 8: CINR[1:0] Configuration

RANGE defines the input capacitance range while RESOLUTION defines the capacitance measurement

resolution/precision.

Recommended setting is CINR[1:0]=[HZ;HZ] i.e. both pins left floating.

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6.3 THRESH[2:0]

These pins control the PROXTHRESH (yyyyy) parameter as defined below:

THRESH2

THRESH1

THRESH0

PROXTHRESH (yyyyy)

0 (00000)

0

HZ

1

0

20 (00001)

40 (00010)

0

HZ

1

0

HZ

1

0

HZ

1

0

HZ

1

0

HZ

1

0

HZ

1

0

HZ

1

0

HZ

1

HZ

1

0

HZ

1

0

HZ

1

60 (00011)

80 (00100)

100 (00101)

120 (00110)

140 (00111)

160 (01000)

180 (01001)

200 (01010)

220 (01011)

240 (01100)

260 (01101)

280 (01110)

300 (01111)

350 (10000)

400 (10001)

450 (10010)

500 (10011)

600 (10100)

700 (10101)

800 (10110)

900 (10111)

1000 (11000)

1100 (11001)

1200 (11010)

HZ

1

Table 9: THRESH[2:0] Configuration

PROXTHRESH defines the proximity detection threshold.

Low values allow good sensitivity/distance while higher values allow better noise immunity.

6.4 HYST

This pin controls the HYST (zz) parameter as defined below:

HYST

HYST (zz)

32 (00)

64 (01)

0

HZ

1

128 (10)

Table 10: HYST Configuration

HYST defines the proximity detection hysteresis applied to PROXTHRESH.

Recommended setting is HYST=0 i.e. pin connected to GND.

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

7 APPLICATION

INFORMATION

7.1 Typical Application Circuit

Figure 13: Typical Application Circuit

7.2 External Components Recommended Values

Symbol Description

CVDD Supply decoupling capacitor

RPULL Host interface pull-ups

Note

Min

-

Typ.

100

10

Max

-

Unit

nF

kȍ

+/- 50%

Table 11: External Components Recommended Values

7.3 Evaluation

SX9500EVKA can be used for performance evaluation and parameters fine-tuning of the SX9501.

The settings listed in §6.1 should be first programmed to the on-board chip using the GUI.

Then RANGE, RESOLUTION, PROXTHRESH and HYST can be played with according to the values available

thru the SX9501 pins (Cf. §6.2, 6.3, and 6.4) to find the best configuration.

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

8 PACKAGING

INFORMATION

8.1 Outline Drawing

Figure 14: Outline Drawing

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

8.2 Land Pattern

Figure 15: Land Pattern

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SX9501

Ultra Low Power, Four Channels

Capacitive Proximity/Button Solution with Dedicated Outputs

WIRELESS & SENSING

copyright owner. The information presented in this document does not form part of any quotation or contract, is

believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the

publisher for any consequence of its use. Publication thereof does not convey nor imply any license under

patent or other industrial or intellectual property rights. Semtech assumes no responsibility or liability

whatsoever for any failure or unexpected operation resulting from misuse, neglect improper installation, repair

or improper handling or unusual physical or electrical stress including, but not limited to, exposure to

parameters beyond the specified maximum ratings or operation outside the specified range.

SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE

SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL

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Notice: All referenced brands, product names, service names and trademarks are the property of their

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Contact Information

Semtech Corporation

Wireless and Sensing Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111 Fax: (805) 498-3804

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型号：	SX9501IULTRT
厂家：	SEMTECH CORPORATION
描述：	Ultra Low Power, Four Channels Capacitive Proximity/Button Solution with Dedicated Outputs
文件：	总21页 (文件大小：775K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SX9501IULTRT [SEMTECH]

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