TS30013-M018QFNR [SEMTECH]
Switching Regulator;
| 型号： | TS30013-M018QFNR |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Switching Regulator 开关 |
| 文件： | 总18页 (文件大小：1553K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS30011/12/13
High Efficiency 1A/2A/3A Current-Mode
Synchronous Buck DC/DC Converter, 1MHz
TRIUNE PRODUCTS
Features
Description
•
•
•
Fixed output voltage choices: 1.5V, 1.8V, 2.5V, 3.3V, and 5V
with +/- 2% output tolerance
Adjustable version output voltage range: 0.9V to (VCC –
1V) with +/-1.5% reference.
Wide input voltage range
The TS30011 (1A), TS30012 (2A) and TS30013 (3A) are DC/DC
synchronous switching regulator with fully integrated power
switches, internal compensation, and full fault protection. The
switching frequency of 1MHz enables the use of small filter
components resulting in minimal board space and reduced
BOM costs.
TS30011/12: 4.5V to 24V (26.4V Abs Max
TS30013: 4.5V to 18V (20V Abs Max)
•
•
1MHz +/- 10% fixed switching frequency
Continuous output current: 1A (TS30011), 2A (TS30012)
and 3A (TS30013)
High efficiency – up to 95%
Current mode PWM control with PFM mode for improved
light load efficiency
Voltage supervisor for VOUT reported at the PG pin
Input supply under voltage lockout
Soft start for controlled startup with no overshoot
Cycle-by-cycle currrent limit with frequency foldback
Full protection for over-temperature and VOUT
over-voltage
The TS30011/12/13 utilizes current mode feedback in normal
regulation PWM mode. When the regulator is placed in
standby (EN is low), the device draws less than 10uA quiescent
current.
•
•
The TS30011/12/13 integrates a wide range of protection
circuitry including input supply under-voltage lockout, output
voltage soft start, current limit, and thermal shutdown.
•
•
•
•
•
The TS30011/12/13 includes supervisory reporting through
the PG (Power Good) open drain output to interface other
components in the system.
•
•
Less than 10uA in standby mode
Low external component count
Summary Specification
•
Junction operating temperature -40 °C to 125 °C
•
Packaged in a 16pin QFN (3x3)
Applications
•
•
•
On-card switching regulators
Set-top box, DVD, LCD, LED supply
Industrial power supplies
Typical Application Circuit
TS30011/12/13
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Pin Configuration
Figure 1: 16 Lead 3x3 QFN, Top View
Pin Description
Pin # Pin Symbol Function
Description
Switching Voltage Node Connected to 4.7uH (typical) inductor
1
2
3
4
VSW
VCC
VCC
GND
Input Voltage
Input Voltage
GND
Input voltage
Input voltage
Primary ground for the majority of the device except the low-side power FET
Regulator FB Input. Connects to VOUT for fixed mode and the output resistor
divider for adjustable mode
Feedback Input
5
FB
No Connect
Not Connected
Not Connected
Open-drain output
6
7
8
NC
NC
PG
No Connect
Power Good Output
Above 2.2V the device is enabled. GND the EN pin to put device in standby
mode. Includes internal pull-up resistor.
Enable Input
9
EN
Bootstrap capacitor for the high-side FET gate driver. Connect a ceramic
capacitor in the range 15 nF - 200 nF from BST pin to VSW pin
Bootstrap Capacitor
Input Voltage
10
BST
Input Voltage
11
12
13
14
15
16
17
VCC
Switching Voltage Node Connected to 4.7uH (typical) inductor
Switching Voltage Node Connected to 4.7uH (typical) inductor
VSW
VSW
PGND
PGND
VSW
PAD
Power GND
Power GND
GND supply for internal low-side FET/integrated diode
GND supply for internal low-side FET/integrated diode
Switching Voltage Node Connected to 4.7uH (typical) inductor
Thermal PAD
Connected internally to GND
TS30011/12/13
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Functional Block Diagrams
Figure 2: TS30011/12/13 Block Diagram
Figure 3: Monitor & Control Logic Functionality
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Absolute Maximum Ratings
Over operating free–air temperature range unless otherwise noted(1, 2).
Parameter
Value
Units
VCC to PGND
BST to PGND
BST to VSW
-0.3 to 26.4 (-0.3 to 20 for TS30013)
-0.3 to (VCC+6)
V
V
V
V
-0.3 to 6
VSW to PGND
-1 to 26.4 (-1 to 20 for TS30013)
EN, PG, FB to GND
-0.3 to 6
-0.3 to 0.3
+/-2k
V
V
V
PGND to GND
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Charge Device Model
Lead Temperature (soldering, 10 seconds)
+/-500
260
V
OC
(1) Stresses beyond those listed under “absolute maximum ratings”may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions”is not implied. Exposure to
absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
Thermal Characteristics
Parameter
Symbol Value
Units
Thermal Resistance Junction to Air (Note 1)
Thermal Resistance Junction to Case (Note 1)
Storage Temperature Range
θJA
34.5
OC/W
OC/W
OC
θJC
2.5
TSTG
TJ MAX
-65 to 150
150
Maximum Junction Temperature
OC
Operating junction Temperature Range
TJ
-40 to 125
OC
Note 1: Assumes 16LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD
Recommended Operating Conditions
Parameter
Symbol Min
Typ
Max
Units
Input Operating Voltage
VCC
4.5
15
3.3
33
2
12
22
24 (18 for TS30013)
V
nF
Bootstrap Capacitor
CBST
200
Output Filter Inductor Typical Value (Note 1)
Output Filter Capacitor Typical Value (Note 2)
Output Filter Capacitor ESR
LOUT
4.7
5.64
uH
uF
COUT
44 (2 x 22)
COUT-ESR
CBYPASS
100
mΩ
uF
Input Supply Bypass Capacitor Typical Value (Note 3)
8
10
Note 1: For best performance, use an inductor with saturation current rating exceeding the maximum expected load plus 50% of the inductor current ripple.
Note 2: For best performance, a low ESR ceramic capacitor should be used.
Note 3: For best performance, a low ESR ceramic capacitor should be used. If CBYPASS is not a low ESR ceramic capacitor, a 0.1uF ceramic capacitor should be add-
ed in parallel to CBYPASS
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Electrical Characteristics
Electrical Characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Parameter
Symbol Conditions
Min. Typ. Max. Units
VCC Supply Voltage
24
Input Supply Voltage
VCC
4.5
(18 for
V
TS30013)
Quiescent current Normal Mode
Quiescent current Normal Mode
– Non-switching
ICC-NORM
VCC = 12V, VOUT=1.8V, ILOAD = 0A
3.3
2.3
5
mA
mA
μA
ICC-NOSWITCH VCC=12V, ILOAD=0A, Non-switching
Quiescent current Standby Mode
ICC-STBY
VCC = 12V, EN = 0V
10
VCC Under Voltage Lockout
Input Supply Under Voltage Threshold
VCC-UV
VCC Increasing
VCC Decreasing
4.3
4.5
V
Input Supply Under Voltage Threshold
Hysteresis
VCC-UV_HYST
350
mV
OSC
Oscillator Frequency
fOSC
ffb
0.9
91
1
1.1
95
MHz
KHz
Foldback Switching Frequency
VFB<60% x 0.9V (For TS30013)
Sweep VFB from Low-to-High
250
PG Open Drain Output
PG Threshold Voltage
PG Hysteresis
VOUT_UV
93
%VOUT
%VOUT
VOUT_UV_HYST Sweep VFB from High-to-Low
1.5
PG recovery after power
restoration
PG Recovery Hold Time
tPG
11
ms
High-Level Output Leakage
Low-Level Output Voltage
IOH-PG
VPG = 5V
0.5
μA
V
VOL-PG
VFB < 90% x VNOM, IPG = -0.3mA
0.01
0.8
EN Input Voltage Thresholds
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis
VIH-EN
2.2
V
V
VIL-EN
VHYST-EN
480
3.5
mV
μA
μA
VEN = 5V
VEN = 0V
Input Leakage
IIN-EN
-1.5
Thermal Shutdown
Thermal Shutdown Junction Temperature TSD
Note: not tested in production
Note: not tested in production
150
170
10
°C
°C
TSD Hysteresis
TSDHYST
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Regulator Characteristics
Electrical Characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Parameter
Symbol Conditions
Min.
Typ.
Max.
Units
Switch Mode Regulator: L=4.7uH and C=2 x 22uF
Output Voltage Tolerance in PWM Mode VOUT-PWM
ILOAD =1A
VOUT – 2%
VOUT – 1%
VOUT
VOUT + 2%
VOUT + 3%
V
V
Output Voltage Tolerance in PFM Mode
VOUT-PFM
ILOAD = 0A
VOUT + 1%
Vcc = 4.5V to 24V
(to 18V for TS30013)
Line Regulation
0.5
0.5
%
%
IOUT = 100mA to 3A
(For TS30013)
Load Regulation
High Side Switch On Resistance
Low Side Switch On Resistance
IVSW = -1A (Note 1)
IVSW = 1A (Note 1)
TS30013 (Note 4)
TS30012 (Note 4)
TS30011
180
120
mΩ
mΩ
A
RDSON
3
2
Output Current
IOUT
A
1
A
TS30013
3.4
2.4
3.8
2.8
1.8
0.9
4.4
3.4
2.4
0.914
1.5
500
A
Over Current Detect
(High Side Switch Current)
IOCD
TS30012
A
TS30011
1.4
A
Feedback Reference (Adjustable Mode)
Feedback Reference Tolerance
Feedback Bias Current
FBTH
FBTH-TOL
IFB
(Note 3)
0.886
-1.5
V
(Note 3)
%
nA
ms
V
VFB=0.6V
50
4
Soft start Ramp Time
tSS
PFM Mode FB Comparator Threshold
FBTH-PFM
VOUT + 1%
VOUT Over Voltage Threshold
VOUT-OV
103% VOUT
VOUT Over Voltage Hysteresis
Max Duty Cycle
VOUT-OV_HYST
DUTYMAX
1% VOUT
97%
(Note 2)
95%
99%
Note 1: RDSON is characterized at 1A and tested at lower current in production.
Note 2: Regulator VSW pin is forced off for 240ns every 8 cycles to ensure the BST cap is replenished.
Note 3: For the adjustable version, the ratio of VCC/Vout cannot exceed 16.
Note 4: Based on Over Current Detect testing
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Typical Performance Characteristics
TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Figure 4. Startup Response
Figure 6. 100mA to 2A Load (VCC=12V, VOUT=1.8V)
Figure 8. 100mA to 2A Load Step (VCC=12V, VOUT=3.3V)
TS30011/12/13
Figure 5. 100mA to 1A Load Step (VCC=12V, VOUT=1.8V)
Figure 7. 100mA to 1A Load Step (VCC=12V, VOUT=3.3V)
Figure 9. Line Transient Response (VCC=12V, VOUT=3.3V)
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Typical Performance Characteristics continued
TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Figure 10. Load Regulation (VOUT = 3.3V)
Figure 11. Line Regulation (IOUT=1A)
Figure 12. Efficiency vs. Output Current (VOUT = 1.8V)
Figure 13. Efficiency vs. Output Current (VOUT = 3.3V)
Figure 14. Efficiency vs. Output Current (VOUT = 5V)
Figure 15. Efficiency vs. Input Voltage (VOUT = 3.3V)
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Typical Performance Characteristics continued
TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Figure 16. Standby Current vs. Input Voltage
Figure 18. Output Voltage vs. Temperature (VOUT = 3.3V)
Figure 20. Quiescent Current vs. Temperature (No load)
TS30011/12/13
Figure 17. Standby Current vs. Temperature
Figure 19. Oscillator Frequency vs. Temperature (IOUT=300mA)
Figure 21. Input Current vs. Temperature (No load, No switching)
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In the case of where the switch mode approaches 100% duty
cycle for the high side FET, the device automatically reduces
the duty cycle switch to a minimum off time on every 8th cycle
to allow this capacitor to re-charge
Functional Description
The TS30011/12/13 current-mode synchronous step-down
regulator is ideal for use in the commercial, industrial, and
automotive market segments. It includes flexibility to be
used for a wide range of output voltages and is optimized for
high efficiency power conversion with low RDSON integrated
synchronous switches. A 1MHz internal switching frequency
facilitates low cost LC filter combinations. Additionally, the
fixed output versions enable reduce the external component
count and provide a complete regulation solution with only 4
external components: an input bypass capacitor, an inductor,
an output capacitor, and the bootstrap capacitor. The regulator
automatically transitions between PFM and PWM mode to
maximize efficiency for the load demand.
Sense feedback, FB
This is the input terminal for the output voltage feedback.
For the fixed output versions, this should be hooked directly to
VOUT. The PCB connection should be kept as short as possible,
and should be made as close as possible to the output
capacitor. The trace should not be shared with any other
connection. (Figure 24)
For adjustable output versions, the FB input should be
connected to the external resistor divider. To choose the
resistors, use the following equation:
The TS30011/12/13 provides these system benefits:
VOUT = 0.9 (1 + RTOP/RBOT
)
•
Reduced board real estate
•
Lower system cost
The FB input is high impedance and input current should be
less than 100nA. As a result, good layout practices are required
for the feedback resistors and feedback traces. When using the
adjustable version, the feedback trace should be kept as short
as possible with minimum width to reduce stray capacitance
and to reduce the injection of noise.
Lower cost inductor
Low external parts count
•
•
Ease of design
Bill of Materials and suggested board layout provided
Power Good output
Integrated compensation network
Wide input voltage range
For adjustable output versions, the ratio of VCC/VOUT cannot
exceed 16.
Robust solution
Over current, over voltage and over temperature
protection
Switching output, VSW
This is the switching node of the regulator. It should be
connected directly to the 4.7uH inductor with a wide, short
trace and also to one end of the Bootstrap capacitor. This node
switches between VCC and PGND at the switching frequency.
Detailed Pin Description
Unregulated input, VCC
This terminal is the unregulated input voltage source for the
IC. It is recommended that a 10uF bypass capacitor be placed
close to the device for best performance. Since this is the main
supply for the IC, good layout practices need to be followed for
this connection.
Ground, GND
This ground is used for the majority of the device including the
analog reference, control loop, and other circuits.
Power Ground, PGND
Bootstrap control, BST
This is a separate power ground connection used for the low-
side synchronous switch, to isolate switching noise from the
rest of the device. (Figure 24)
This terminal provides the bootstrap voltage required for the
upper internal NMOS switch of the buck regulator. An external
ceramic capacitor placed between the BST input terminal and
the VSW pin provides the necessary voltage for the upper
switch. In normal operation the capacitor is recharged on
every switching cycle when the low-side NMOS is on.
Enable, EN
This is the input terminal to activate the regulator. The input
threshold is TTL/CMOS compatible. It also has an internal pull-
up to ensure a stable state if the pin is disconnected.
TS30011/12/13
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Power Good Output, PG
Output Overvoltage
This is an open drain output. During start-up the FB input is
monitored and the PG line remains low, until the FB voltage
reaches the VOUT_UV threshold. A 10KΩ resistor to VOUT is
required for pull-up. Once the internal comparator detects
that the FB voltage is above the desired threshold, an internal
delay timer is activated and the PG line is de-asserted to high
once this delay timer expires. In the event of a fault, when the
FB voltage decreases below VOUT_UV, the PG line asserts low and
remains low until the FB input exceeds VOUT_UV and the delay
timer times out. See Figure 3 for the control of the PG signal.
If the FB input exceeds 103% of the regulation voltage, the
VSW outputs will tri-state to protect the device from damage.
This check occurs at the start of each switching cycle. If it
occurs during the middle of a cycle, the switching for that
cycle will complete, and the VSW outputs will tri-state at the
beginning of the next cycle.
VCC Under-Voltage Lockout
The device is held in the off state until VCC reaches 4.5V
(typical). There is a 500mV hysteresis on this input, which
requires the input to fall below 4.0V (typical) before the device
will disable.
Internal Protection Details
Internal Current Limit
Transient Response
The high-side NMOS current is sensed on a cycle by cycle basis
and if current limit is reached, the IC truncates the high-side
on-time. The device also senses the FB pin to identify hard
output shorts or extended over-current conditions. It then
directs the VSW output to skip 4 cycles and frequency will
foldback to 250KHz, if current limit occurs when FB is low. This
allows current built up in the inductor during the minimum on
time to decay sufficiently. Current limit is always active when
the regulator is enabled. Soft start ensures current limit does
not prevent regulator startup.
TS30011/12/13 has been designed to work under a wide range
of input and output voltages, supporting different values and
types of output capacitance. By design, the TS30011/12/13
has a lower control loop bandwidth. For designs with a high
slew rate load requirement, using a 1nF feed-forward capacitor
CFF (Figure 23) in parallel with RTOP feedback resistor is recom-
mended. A typical response is shown in Figure 22.
Figure 22. 100mA to 2A Load Step
(Load Slew Rate=2.5A/us, VCC=12V, VOUT=4V)
Once the over current condition is removed, the device returns
to normal operation automatically. (Alternately the factory can
configure the device to shutdown the regulator if an extended
over current event is detected, which requires a toggle of the
Enable pin to return the device to normal operation. Contact
Semtech Marketing for specific information.)
Thermal Shutdown
If the die temperature exceeds 170°C (typical), the VSW
outputs will tri-state to protect the device from damage. The
PG and all other protection circuitry stay active to inform
the system of the failure mode. Once the device cools to
160°C (typical), the device will start up again, following the
normal soft start sequence. If the die again reaches 170°C, the
shutdown/restart sequence will repeat.
Reference Soft Start
The reference in this device is ramped at a rate of 4ms to
prevent the output from overshoot during startup. This ramp
restarts whenever there is a rising edge sensed on the Enable
pin. This occurs in both the fixed and adjustable versions.
During the soft start ramp, current limit is still active, and will
still protect the device in case of a short on the output.
TS30011/12/13
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Typical Application Schematic
Figure 23: TS30011/12/13 Application Schematic
A minimal schematic suitable for most applications is shown on page 1. Figure 23 includes optional components that may be
considered to address specific issues as listed in the External Component Selection section.
PCB Layout
For proper operation and minimum EMI, care must be taken during PCB layout. An improper layout can lead to issues such as poor
stability and regulation, noise sensitivity and increased EMI radiation. (Figure 24) The main guidelines are the following:
•
•
•
provide low inductive and resistive paths for loops with high di/dt or high dV/dt,
provide low capacitive paths with respect to all the other nodes for traces with high di/dt or high dV/dt,
sensitive nodes not assigned to power transmission should be referenced to the analog signal ground (GND) and should
always be separated from the power ground (PGND).
The negative ends of CBYPASS, COUT and the Schottky diode DCATCH (optional) should be placed close to each other and connected
using a wide trace. Vias must be used to connect the PGND node to the ground plane. The PGND node must be placed as close as
possible to the TS30011/12/13 PGND pins to avoid additional voltage drop in traces.
The bypass capacitor CBYPASS (optionally paralleled to a 0.1µF capacitor, CBYPASS2) must be placed close to the VCC pins of
TS30011/12/13.
The inductor must be placed close to the VSW pins and connected directly to COUT in order to minimize the area between the VSW
pin, the inductor, the COUT capacitor and the PGND pins. The trace area and length of the switching nodes VSW and BST should be
minimized.
For the adjustable output voltage version of the TS30011/12/13, feedback resistors RBOT and RTOP are required for Vout settings
greater than 0.9V and should be placed close to the TS30011/12/13 in order to keep the traces of the sensitive node FB as short
as possible and away from switching signals. RBOT should be connected to the analog ground pin (GND) directly and should never
be connected to the ground plane. The analog ground trace (GND) should be connected in only one point to the power ground
(PGND). A good connection point is under the TS30011/12/13 package to the exposed thermal pad and vias which are connected
to PGND. RTOP will be connected to the VOUT node using a trace that ends close to the actual load.
For fixed output voltage versions, RBOT and RTOP are not required and the FB pin should connect directly to VOUT
.
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PCB Layout - continued
The exposed thermal pad must be soldered to the PCB for mechanical reliability and to achieve good power dissipation. Vias must
be placed under the pad to transfer the heat to the ground plane.
Figure 24: TS30011/12/13 PCB Layout, Top View
External Component Bill of Materials
Suggested
Designator Function
Description
Manufacturer Code
CGA5L3X5R1V106K160AB
C2012X5R1A226K125AB
Qty
Manufacturer
Input Supply Bypass
10uF 10%
35V
CBYPASS
COUT
LOUT
TDK
1
2
1
1
1
1
Capacitor
22uF 10%
10V
Output Filter Capacitor
TDK
TDK
Wurth
SLF7045T-4R7M2R0-PF
7447745047
Output Filter Inductor (1A)
Output Filter Inductor (2A)
Output Filter Inductor (3A)
Boost Capacitor
4.7uH 2A
4.7uH 3A
TDK
Wurth
VLC5045T-4R7M
744774047
LOUT
TDK
Wurth
VLP6045LT-4R7M
744777004
LOUT
4.7uH 4.37A
15nF-200nF
10V
CBST
TDK
C1005X7R1C223K
Note 1: Assumes 16LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD
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External Component Bill of Materials continued
Suggested
Manufacturer
Designator Function
Description
17.8K (Note 1)
10K (Note 1)
10K
Manufacturer Code Qty
Voltage Feedback Resistor
(optional)
RTOP
1
1
1
Voltage Feedback Resistor
(optional)
RBOT
PG Pin Pull-up Resistor
(optional)
RPLP
30V 2A
DCATCH
DCATCH
DCATCH
Catch Diode (optional, 1A)
Catch Diode (optional, 2A)
Catch Diode (optional, 3A)
On Semiconductor
NXP Semiconductors
NXP Semiconductors
MBR230LSFT1G
PMEG4030ER,115
PMEG4050EP,1
1
1
1
SOD-123FL
40V 3A
SOD-123
40V 5A
SOD-123FL
Note 1:
The voltage divider resistor values are calculated for an output voltage of 2.5V. For fixed output versions, the FB pin is connected directly to VOUT.
External Component Selection
The 1MHz internal switching frequency of the TS30011/12/13 facilitates low cost LC filter combinations. Additionally, the fixed
output versions enable a minimum external component count to provide a complete regulator with only 4 external components:
an input bypass capacitor, an inductor, an output capacitor, and the bootstrap capacitor. The internal compensation is optimized
for a 44uF output capacitor and a 4.7uH inductor.
For best performance, a low ESR ceramic capacitor should be used for CBYPASS. If CBYPASS is not a low ESR ceramic capacitor, a 0.1uF
ceramic capacitor should be added in parallel to CBYPASS
.
The minimum allowable value for the output capacitor is 33uF. To keep the output ripple low, a low ESR (less than 35mOhm)
ceramic is recommended. Multiple capacitors can be paralleled to reduce the ESR.
The inductor range is 4.7uH +/-20%. For optimal over-current protection, the inductor should be able to handle up to the
regulator current limit without saturation. Otherwise, an inductor with a saturation current rating higher than the maximum IOUT
load requirement plus the inductor current ripple should be used.
For high current applications, the optional Schottky diode DCATCH improves overall efficiency and reduces heat. It is up to the user
to determine the cost/benefit of adding this additional component in the user’s application. The diode is typically not needed.
For the adjustable output versions, the output voltage can be adjusted by sizing RTOP and RBOT feedback resistors. The equation for
the output voltage is
For the adjustable version, the ratio of VCC/Vout cannot exceed 16.
RPLP is only required when the Power Good signal (PG) is utilized.
Thermal Information
TS30011/12/13 is designed for a maximum operating junction temperature Tj of 125°C. The maximum output power is limited by
the power losses that can be dissipated over the thermal resistance given by the package and the PCB structures. The PCB must
provide heat sinking to keep the TS30011/12/13 cool. The exposed metal on the bottom of the QFN package must be soldered to
a ground plane. This ground should be tied to other copper layers with multiple thermal vias. Adding more copper to the top and
the bottom layers and tying this copper to the internal planes with vias can reduce thermal resistance further. For a hi-K JEDEC
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board and 13.5 square inch of 1 oz Cu, the thermal resistance from junction to ambient can be reduced to θ = 38°C/W. The
power dissipation of other power components (catch diode, inductor) cause additional copper heating andJAcan further increase
what the TS30011/12/13 sees as ambient temperature.
Package Mechanical Drawings (all dimentions in mm)
3001C
xxxxx
VLMY
Units
Millimeters
Dimensions Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
16
0.50 BSC
0.90
Overall Height
Standoff
A
0.80
0.00
1.00
0.05
A1
A3
D
0.02
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
0.20 REF
3.00 BSC
1.70
E2
E
1.55
1.80
3.00 BSC
1.70
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
D2
b
1.55
0.20
0.20
0.20
1.80
0.30
0.40
-
0.25
L
0.30
K
-
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Recommended PCB Land Pattern
Dimensions in Millimeters
Units
Millimeters
NOM
Dimensions Limits
MIN
MAX
Contact Pitch
E
0.50 BSC
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
W2
T2
C1
C2
X1
Y1
G
-
-
1.70
1.70
-
-
-
-
3.00
Contact Pad Spacing
-
3.00
-
Contact Pad Width (X16)
Contact Pad Length (X16)
Distance Between Pads
-
-
-
-
-
0.35
0.65
-
0.15
Notes:
Dimensions and tolerances per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact values shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information only.
Packaging Information
Pb-Free (RoHS): The TS30011/12/13 devices are fully compliant for all materials covered by European Union Directive 2011/65/EU
(RoHS 2), and meet all IPC-1752 Class 5 & 6 materials declaration requirements. These devices are Pb Free, WEEE, and low Halogen.
MSL, Peak Temp: The TS30011/12/13 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices
also have a Peak Profile Solder Temperature (Tp) of 260°C.
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Ordering Information
TS3001x-MvvvQFNR
x
Output Current
vvv
Output Voltage
1
1 Amp
2 Amp
3 Amp
015
1.5 V
2
3
018
025
033
050
000
1.8 V
2.5 V
3.3 V
5.0 V
Adjustable
Ordering Information
Top Mark
3001C
xxxxx
VLMY
Top Mark: Legend
Mark Method
Font Size:
Laser
25 Mils
Current Level - TS30011 = 1, TS30012 = 2, TS30013 = 3
(Example: C = y for part number TS3001y-M0xxQFNR)
Line 1 Marking:
Line 2 Marking:
3001C
XXXXX
o
Last five digits of Lot Number, non fractional
Pin 1 Mark
Voltage Level; 15 - 1.5V; 18 - 1.8V; 25 - 2.5V; 33 - 3.3V, 50 - 5.0V; 00 - 0V
(Example: VL = xx for part number TS3001y-M0xxQFNR)
VL
Line 3 Marking:
M
Y
Month Code: Jan-Sept 1-9, Oct - A, Nov - B, Dec - C
Year Code: A - 2011, B - 2012, C - 20013, ...
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IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall
indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and
names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document
without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any
particular purpose. All rights reserved.
© Semtech 2016
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
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