UCLAMP2401T [SEMTECH]
Low Profile μClampTM 1-Line ESD protection; 薄型μClampTM 1线ESD保护型号: | UCLAMP2401T |
厂家: | SEMTECH CORPORATION |
描述: | Low Profile μClampTM 1-Line ESD protection |
文件: | 总8页 (文件大小:178K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
uClamp2401T
Low Profile µClampTM
1-Line ESD protection
PROTECTION PRODUCTS - MicroClampTM
Features
Description
The µClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. It is designed to replace multilayer varistors
(MLVs) in portable applications such as cell phones, note-
book computers, and other portable electronics. It fea-
tures large cross-sectional area junctions for conducting
high transient currents. They offer desirable character-
istics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.4mm)
Protects one data line
Low clamping voltage
Working voltage: 24V
Low leakage current
Solid-state silicon-avalanche technology
The µClampTM2401T is in a 2-pin, RoHS/WEEE compli-
ant, SLP1006P2T package. It measures 1.0 x 0.6 mm
with a nominal height of only 0.4mm. The leads are
spaced at a pitch of 0.65mm and are finished with
lead-free NiPdAu. Each device will protect one line
operating at 24 volts. It gives the designer the flexibil-
ity to protect single lines in applications where arrays
are not practical. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). The combination
of small size and high ESD surge capability makes
them ideal for use in portable applications such as
cellular phones, digital cameras, and MP3 players.
Mechanical Characteristics
SLP1006P2T package
RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.4 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code, cathode band
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Personal Digital Assistants (PDAs)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Dimensions
Schematic & PIN Configuration
1.0
0.60
0.65
0.40
Nominal Dimensions (mm)
SLP1006P2T (Bottom View)
www.semtech.com
Revision 01/15/2008
1
uClamp2401T
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20µs)
Symbol
Ppk
Value
Units
Watts
Amps
kV
150
3
Maximum Peak Pulse Current (tp = 8/20µs)
Ipp
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
+/- 20
+/- 15
Operating Temperature
Storage Temperature
TJ
-55 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics (T=25oC)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Forward Voltage
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
24
V
V
It = 1mA
27
VRWM = 24V, T=25°C
IF = 10mA
0.25
1.2
50
µA
V
VF
1
Clamping Voltage
VC
IPP = 3A, tp = 8/20µs
VR = 0V, f = 1MHz
V
Junction Capacitance
Cj
50
pF
www.semtech.com
2008 Semtech Corp.
2
uClamp2401T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
1
0.1
0.01
0.1
1
10
100
1000
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (us)
Forward Voltage vs. Forward Current
Clamping Voltage vs. Peak Pulse Current
60
50
40
30
20
10
0
2.5
2
1.5
1
Waveform
Waveform
Parameters:
tr = 8µs
0.5
0
Parameters:
tr = 8µs
td = 20µs
td = 20µs
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
2.5
3
3.5
Forward Current - IF (A)
Peak Pulse Current - IPP (A)
Normalized Junction Capacitance vs. Reverse Voltage
ESD Clamping
(8kV Contact per IEC 61000-4-2)
1.5
f = 1 MHz
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
Reverse Voltage - VR (V)
Note: Data is taken with a 10x attenuator
www.semtech.com
2008 Semtech Corp.
3
uClamp2401T
PROTECTION PRODUCTS
Typical Characteristics
Insertion Loss S21
CH1S21 LOG
6 dB / REF 0 dB
1: -16.256 dB
800 MHz
2: -18.898 dB
900 MHz
0 dB
3: -13.561 dB
1.8 GHz
5
-6 dB
4
-12 dB
-18 dB
3: -9.5299 dB
2.5 GHz
3
1
2
3: -9.072 dB
2.7 GHz
-24 dB
-30 dB
-36 dB
1
10
MHz
100
3
1
MHz
START 030 MHz
MHz
GHz GHz
3
.
STOP 000000000MHz
.
www.semtech.com
2008 Semtech Corp.
4
uClamp2401T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Circuit Diagram
This device is designed to protect one data or power
supply line. The device is unidirectional and may be
used on lines where the signal polarity is above ground.
The cathode band should be placed towards the line
that is to be protected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
z
z
Never run critical signals near board edges.
Use ground planes whenever possible.
www.semtech.com
2008 Semtech Corp.
5
uClamp2401T
PROTECTION PRODUCTS
Applications Information - Spice Model
uClamp2401T Spice Model
uClamp2401T Spice Parameters
Parameter
Unit
Amp
Volt
Volt
Ohm
Amp
Farad
sec
--
D1 (TVS)
3.87E-13
31.1
IS
BV
VJ
0.68
RS
IBV
CJO
TT
4.35
1.0E-3
27E-12
2.541E-9
0.32
M
N
--
1.1
EG
eV
1.11
www.semtech.com
2008 Semtech Corp.
6
uClamp2401T
PROTECTION PRODUCTS
Outline Drawing - SLP1006P2T
B
A
D
DIMENSIONS
INCHES MILLIMETERS
E
DIM
MIN NOM MAX MIN NOM MAX
A
A1
b
.015
.000
.018
.017 0.37 0.40 0.43
.016
0.00
.001 .002
0.03 0.05
TOP VIEW
.022 0.45 0.50 0.55
.020
D
E
1.00
0.60
.035 .039 .043 0.90
.020 .024 .028 0.50
1.10
0.70
e
.026 BSC
0.65 BSC
L
R
.008 .010 .012 0.20 0.25 0.30
.002 .004 .006 0.05 0.10 0.15
A
SEATING
PLANE
N
2
2
aaa C
A1
aaa
.003
.004
0.08
0.10
bbb
C
PIN 1 ID
R
bxN
bbb
C A B
2x L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006P2T
DIMENSIONS
Y
DIM
INCHES
MILLIMETERS
Z
(.033)
.012
.024
.022
.055
(0.85)
0.30
0.60
0.55
1.40
(C)
C
G
X
Y
Z
G
X
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
2008 Semtech Corp.
7
uClamp2401T
PROTECTION PRODUCTS
Marking Code
Ordering Information
Working Qty per Reel
Part Number
Voltage
Reel
Size
uClamp2401T.TCT
24V
3,000 7 Inch
Notes:
24
1) This is a lead-free, RoHS/WEEE compliant product
MicroClamp, uClamp and µClamp are marks of Semtech
Corporation
PIN 1 ID
Tape and Reel Specification
Cathode Bar
User Direction of feed
Device Orientation in Tape
A0
B0
K0
0.69 +/-0.10 mm
1.19 +/-0.10 mm
0.66 +/-0.10 mm
Tape
B, (Max)
Width
D
D1
E
F
P
P0
P2
T
W
1.5 + 0.1 mm
1.750±.10
mm
(.069±.004)
4.0±0.10
mm
(.157±.00-
4)
4.0±0.1
mm
(.157±.00-
4)
8.0 mm
+ 0.3 mm
- 0.1 mm
0.4 mm
±0.25
(.031)
3.5±0.05
mm
(.138±.002)
2.0±0.05
mm
(.079±.002)
4.2 mm
8 mm
- 0.0 mm
(0.59 +.005
- .000)
0.254±0.02
mm (.016)
(.165)
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2008 Semtech Corp.
8
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