UCLAMP5011ZATNT [SEMTECH]
1-Line, 5V ESD Protection;
| 型号： | UCLAMP5011ZATNT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | 1-Line, 5V ESD Protection |
| 文件： | 总8页 (文件大小：601K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
µClamp5011ZA
Ultra Small µClamp®
1-Line, 5V ESD Protection
PROTECTION PRODUCTS
Description
Features
•
High ESD withstand voltage: +/-15kV (contact) and
+/-18kV (air) per IEC 61000-4-2
Ultra-small 0201 package
µClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones,
notebook computers, and other portable electronics.
It features large cross-sectional area junctions for
conducting high transient currents. This device offers
desirable characteristics for board level protection
including fast response time, low operating and
clamping voltage, and no device degradation.
•
•
•
•
•
•
•
•
Protects one data line
Low ESD clamping voltage
Working voltage: 5V
Low capacitance: 5pF Maximum
Low leakage current
Low dynamic resistance: 0.15 Ohms Typical
Solid-state silicon-avalanche technology
Mechanical Characteristics
µClamp®5011ZA features extremely good ESD protec-
tion characteristics highlighted by low typical dynamic
resistance of 0.15 Ohms, low peak ESD clamping voltage,
and high ESD withstand voltage (+/-15kV contact per IEC
61000-4-2). Low maximum capacitance (5pF at VR=0V)
minimizes loading on sensitive cirucuits. Each device will
protect one data or power line operating at 5 Volts.
•
•
•
•
•
•
SLP0603P2X3F package
Pb-Free, Halogen Free, RoHS/WEEE compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking code
Packaging: Tape and Reel
µClamp5011ZA is in a 2-pin SLP0603P2X3F package. It
measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with NiAu. The small
package gives the designer the flexibility to protect
single lines in applications where arrays are not
practical. The combination of small size and high ESD
surge capability makes them ideal for use in portable
applications such as cellular phones, digital cameras, and
tablet PC’s.
Applications
•
•
•
•
•
Cellular Handsets & Accessories
Peripherals
Portable Instrumentation
Notebook Computers
Tablet PC
Package Dimension
Schematic & Pin Configuration
0.600
0.220
0.300
0.160
0.250
1
0.355 BSC
2
SLP0603P2X3F (Bottom View)
µClamp5011ZA
Final Datasheet
Revision Date
1 of 8
Semtech
www.semtech.com
Rev 3.2
1/2/2018
Absolute Maximum Rating
Rating
Symbol
Value
30
Units
W
Peak Pulse Power (tp = 8/20µs)
PPK
IPP
Peak Pulse Current (tp = 8/20µs)
2.5
A
ESD per IEC 61000-4-2 (Air)(1)
18
15
VESD
kV
ESD per IEC 61000-4-2 (Contact)(1)
Operating Temperature
Storage Temperature
TJ
-40 to +125
-55 to +150
OC
OC
TSTG
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol Conditions
Min.
Typ.
Max.
Units
Reverse Stand-Off Voltage
VRWM
Pin 1 to 2 or Pin 2 to 1
5
V
Reverse Breakdown Voltage VBR
IBR = 1mA, Pin 1 to 2 or Pin 2 to 1
VRWM = 5V, Pin 1 to 2 or Pin2 to 1
IPP = 2.5A, tp = 8/20µs
6.5
8.5
5
10.5
20
12
V
Reverse Leakage Current
Clamping Voltage
IR
nA
V
VC
I = 4A, tp = 0.2/100ns
8
ESD Clamping Voltage2
VC
V
I = 16A, tp = 0.2/100ns
9.8
0.15
4.2
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
Ω
VR = 0V, f = 1MHz, I/O pin to GND
5
pF
Notes
1) ESD gun return path connected to ESD ground plane.
2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
µClamp5011ZA
Final Datasheet
Revision Date
2 of 8
Semtech
www.semtech.com
Rev 3.2
1/2/2018
Typical Characteristics
ESD Clamping (-8kV Contact per IEC 61000-4-2)
ESD Clamping (8kV Contact per IEC 61000-4-2)
40
5
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
35
return path connected to ESD ground plane.
30
-5
25
20
15
10
5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
0
-5
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
TLP Characteristic (Negative Pulse)
TLP Characteristic (Positive Pulse)
25
20
15
10
5
5
0
Transmission Line Pulse Test
(TLP) Settings:
p = 100ns, tr = 0.2ns,
TLP and VTLP averaging window:
t
I
t1 = 70ns to t2 = 90ns
-5
-10
-15
-20
-25
Transmission Line Pulse Test
(TLP) Settings:
0
t
p = 100ns, tr = 0.2ns,
TLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
I
-5
0
2
4
6
8
10
12
-12
-10
-8
-6
-4
-2
0
Clamping Voltage (V)
Clamping Voltage (V)
Clamping Voltage vs. Peak Pulse Current (tp = 8/20µs)
Junction Capacitance vs. Reverse Voltage
11
4.5
4
10
9
3.5
3
2.5
2
8
1.5
1
7
0.5
0
TA = 25OC
Waveform: tp= 8x20us
f = 1MHz
T=25oC
6
0
1
2
3
4
5
0
0.5
1
1.5
2
2.5
3
Voltage (V)
Peak Pulse Current - IPP (A)
µClamp5011ZA
Final Datasheet
Revision Date
3 of 8
Semtech
www.semtech.com
Rev 3.2
1/2/2018
Application Information
Assembly Guidelines
Recommended Mounting Pattern
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joints. The figure at the right details Semtech’s
recommended mounting pattern. Recommended
assembly guidelines are shown in Table 1. Note that
these are only recommendations and should serve only
as a starting point for design since there are many factors
that affect the assembly process. Exact manufacturing
parameters will require some experimentation to get the
desired solder application.
0.300
Stencil opening
Component
0.250
0.600
0.175
0.675
Solder Stencil
Stencil design is one of the key factors which will
determine the volume of solder paste which is deposited
onto the land pad. The area ratio of the stencil aperture
will determine how well the stencil will print. The area
ratio takes into account the aperture shape, aperture
size, and stencil thickness. A minimum area ratio of 0.66
is preferred for the subject package. The area ratio of a
rectangular aperture is given as:
Land Pattern
0.270
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Area Ratio = (L * W )/ (2 * (L + W) * T)
Table 1 - Assembly Guidelines
Assembly Parameter
Solder Stencil Design
Aperture Shape
Recommendation
Laser Cut, Electro-Polished
Where:
L = Aperture Length
W = Aperture Width
T = Stencil Thickness
Rectangular with
Rounded Corners
Solder Stencil Thickness
Solder Paste Type
0.075mm (0.003”) or
0.100mm (0.004”)
Semtech recommends a stencil with square aperture
and rounded corners for consistent solder release. The
stencil should be laser cut with electro-polished finish. A
stencil thickness of 0.075mm (0.003”) is recommended.
A 0.100mm (0.004”) stencil may be used, however the
stencil opening may need to be increased slightly to
achieve the desired area ratio to ensure proper solder
coverage on the pad.
Type 4 Size Sphere or
Smaller
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Per JEDEC J-STD-020
Solder Mask Defined
OSP or NiAu
µClamp5011ZA
Final Datasheet
Revision Date
4 of 8
Semtech
www.semtech.com
Rev 3.2
1/2/2018
Outline Drawing - SLP0603P2X3F
B
E
D
A
DIMENSIONS
MILLIMETERS
DIM
A
MIN NOM MAX
0.235 0.250 0.265
A1 0.000 0.010 0.050
b
D
E
e
0.200 0.220 0.240
0.600
0.300
0.580
0.620
0.280
0.320
0.355 BSC
TOP VIEW
L
0.140 0.160 0.180
2
N
aaa
0.08
0.10
bbb
A
SEATING
PLANE
aaa
C
C
A1
e/2
R0.025
TYP
bxN
A B
bbb
C
2X L
e
BOTTOM VIEW
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3F
DIMENSIONS
MILLIMETERS
DIM
(C)
G
X
Y
Z
(0.425)
0.175
0.270
0.250
0.675
Z
(C)
G
Y
X
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
µClamp5011ZA
Final Datasheet
Revision Date
5 of 8
Semtech
www.semtech.com
Rev 3.2
1/2/2018
Marking Code
f
Notes: Device is electrically symmetrical.
Tape and Reel Specification - Paper Tape
µClamp5011ZA
Final Datasheet
Revision Date
6 of 8
Semtech
www.semtech.com
Rev 3.2
1/2/2018
Tape and Reel Specification - Plastic Tape
Ordering Information
Part Number
Qty per Reel Carrier Tape Reel Size
μClamp5011ZATFT
15,000
Paper
7”
μClamp5011ZATNT
10,000
Plastic
7”
MicroClamp, uClamp and µClamp are registered trademarks of Semtech Corporation.
µClamp5011ZA
Final Datasheet
Revision Date
7 of 8
Semtech
www.semtech.com
Rev 3.2
1/2/2018
Important Notice
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided
as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves
the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before
placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications
applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS,
DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY,
LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD
TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized
application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against
all claims, costs damages and attorney fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be
marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described
in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of
its products for any particular purpose. All rights reserved.
© Semtech 2017
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
µClamp5011ZA
Final Datasheet
Revision Date
8 of 8
Semtech
3.2
1/2/2018
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