AWT801-S [SEOUL]
surface-mount LED; 表面贴装LED
| 型号： | AWT801-S |
| 厂家： | 
Seoul Semiconductor |
| 描述： | surface-mount LED |
| 文件： | 总16页 (文件大小：652K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
AWT801-S
SSC
CUSTOMER
Drawn
Approval
Approval
Rev. 01
August 2008
www.ZLED.com
CONTENTS
1. Features & Application
2. Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. Rank of AWT801-S
6. Color & Binning
7. Outline Dimension
8. Packing
9. Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
12. Reliability Test Item and Condition
Rev. 01
August 2008
www.ZLED.com
AWT801-S
AWT801-S
Description
Features
This surface-mount LED
comes in PLCC standard
package dimension. It has a
substrate made up of a molded
plastic reflector sitting on top
of a bent lead frame. The die is
attached within the reflector
cavity and the cavity is
• Industry Standard
PLCC SMT package
• High brightness
using InGaN dice
technologies
• High volume, high
reliability
encapsulated by epoxy or
silicone
The package design coupled
with careful selection of
component materials allow
these products to perform with
high reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 01
August 2008
www.ZLED.com
1. Features & Application
• Warm-White colored SMT package
• Material InGaN/SiC
• Suitable for all SMT assembly methods
Suitable for all soldering methods
• RoHS Compliant
•Interior automotive
•Electronic Signs and Signals
•Office Automation, Electrical Appliances, Industrial Equipment
Rev. 01
August 2008
www.ZLED.com
2. Absolute maximum ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Symbol
Value
120
30
Unit
mW
mA
mA
V
Pd
IF
*2
IFM
90
VR
5
Operating
Temperature
Topr
Tstg
-40 ~ +100
-40 ~ +100
oC
oC
Storage Temperature
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Symbol
Condition
Min
2.7
-
Typ
3.3
Max
4.0
50
Unit
V
Forward Voltage
VF
IF=20 mA
Reverse Current
Luminous Intensity*1
Luminance Flux
IR
IV
VR=5V
-
1600
4
μA
mcd
lm
IF=20 mA
IF =20 mA
IF=20 mA
ΦV
*2
Viewing Angle
2θ1/2
-
120
-
deg.
IF =20 mA
IF =20 mA
63
lm/W
K/W
Optical Efficiency
ηop
Thermal Resistance*3
Rthja
-
120
-
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with
the mechanical axis of
the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
*3. Rthja results from mounting on PCB FR4(pad size≥16mm2 per pad, thickness≒ 0.6mm)
Rev. 01
August 2008
www.ZLED.com
4. Optical characteristics
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
(Ta=25 OC )
(Ta=25 OC )
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
101
100
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
0
10
20
30
40
Forward Voltage VF[V]
Forward Current IF[mA]
Forward Current Derating Curve
Radiation Diagram
(Ta=25 OC )
40
0
30
20
10
0
30
-30
60
-60
90
-90
-40
-20
0
20
40
60
80
100
120
Ambient Temperature TA[oC]
Rev. 01
August 2008
www.ZLED.com
5. Rank of AWT801-S
▣ Rank Name
X1
X2
X3
IV
Color Rank
VF
▣ Luminous Intensity [mcd]
Rank Name
MIN
MAX
1300
1700
2300
Color Target
V, W
J0
J3
J7
1000
1300
1700
R, S, T, V, W
R, S, T, V
▣ Forward Voltage [V]
Rank Name
MIN
3.0
3.3
MAX
3.3
Z
A
3.6
Rev. 01
August 2008
www.ZLED.com
6. Color & Binning
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
520
525
515
510
530
535
540
545
550
555
505
560
565
570
575
580
585
590
595
600
500
495
610
620
490
630
830
485
480
475
470
460
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
C I E (x)
Rev. 01
August 2008
www.ZLED.com
6. Color & Binning
0.46
2700K
0.44
0.42
3000K
W1
V1
3500K
W0
WA
WB
T1
V0
4000K
S1
0.40
T0
TA
TB
VA
4500K
S0
R1
0.38
VB
SA
SB
R0
RA
RB
0.36
0.34
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
● COLOR RANK
<IF=20mA, Ta=25℃>
4500K
4000K
3500K
3000K
2700K
RB
RA
R0
S0
T0
R1
X
Y
X
Y
X
Y
X
Y
0.3515
0.35
0.3487
0.34
0.3531
0.3515
0.3676
0.3704
0.3605
0.3487
0.36
0.3546
0.3531
0.3704
0.3733
0.3717
0.3605
0.3725
0.3855
0.3562
0.3546
0.3733
0.376
0.3826
0.3717
0.3855
0.3974
0.3649
0.3676
0.3482
0.36
0.3725
SB
SA
S1
X
Y
X
Y
X
Y
X
Y
0.3676
0.3649
0.3866
0.391
0.36
0.3704
0.3676
0.391
0.3952
0.3725
0.36
0.3733
0.3704
0.3952
0.3997
0.3855
0.3725
0.3881
0.402
0.376
0.3733
0.3997
0.4044
0.3974
0.3855
0.402
0.416
0.3482
0.3618
0.375
0.375
0.3881
TB
TA
T1
X
Y
X
Y
X
Y
X
Y
0.3898
0.386
0.4106
0.4158
0.3716
0.36
0.394
0.3898
0.4158
0.4225
0.3843
0.3716
0.3841
0.3991
0.3985
0.394
0.4225
0.4283
0.3983
0.3843
0.3991
0.4127
0.4037
0.3985
0.4283
0.4356
0.414
0.3983
0.4127
0.4294
0.372
0.3841
VB
VA
V0
V1
X
Y
X
Y
X
Y
X
Y
0.4158
0.4106
0.4307
0.4381
0.3841
0.372
0.3768
0.391
0.4225
0.4158
0.4381
0.4457
0.3991
0.3841
0.391
0.4058
0.4283
0.4225
0.4457
0.4541
0.4127
0.3991
0.4058
0.422
0.4356
0.4283
0.4541
0.4617
0.4294
0.4127
0.422
0.4371
WB
WA
W0
W1
X
Y
X
Y
X
Y
X
Y
0.4381
0.4307
0.4588
0.467
0.391
0.3768
0.3838
0.3979
0.4457
0.4381
0.467
0.478
0.4058
0.391
0.3979
0.415
0.4541
0.4457
0.478
0.4867
0.422
0.4058
0.415
0.43
0.4617
0.4541
0.4867
0.497
0.4371
0.422
0.43
Rev. 01
0.4466
August 2008
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.ZLED.com
6. Color & Binning
0.46
2700K
0.44
0.42
3000K
W1
V1
3500K
W0
WA
WB
T1
V0
VA
VB
4000K
S1
0.40
T0
TA
TB
4500K
S2
R1
0.38
SA
SB
R0
RA
RB
0.36
0.34
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
0.46
0.44
0.42
0.40
0.38
0.36
0.34
2500K
2900K
3200K
3700K
4200K
4700K
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
Rev. 01
August 2008
www.ZLED.com
7.outline dimension
Recommended Solder Pattern
1.9
0.85
2.80
2.20
Cathode
Anode
C0.8
0.50
2.2
0.15
ATTENTION MARKING ON LED IS ANODE(+)
( Tolerance: ±0.2, Unit: mm )
0.22±0.05
8. packing
1.55
± 0.05
4.0±0.1
2.0±0.05
1.0±0.1
8°
3.1±0.1
2.22±0.1
11.4±0.1
+0
180
-3
9.0 ±0.3
2.0 ±0.2
LABLE
13±0.2
30°
10
22
Package
Marking
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape
is turned off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp
proof Package
Rev. 01
August 2008
www.ZLED.com
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
245 220 102
7inch
245 220 142
SIDE
1
c
TUV
MADE IN KOREA
1
QUANTITY : XXXX
Acriche
Semiconductor EcoLight
LOT NUMBER : XXXXXXXXXX
RoHS
b
PART NUMBER :
a
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 01
August 2008
www.ZLED.com
9. soldering
(1) Lead Solder
Lead Solder
o
Lead Solder
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
Pre-heat time
120 sec. Max.
240℃ Max.
10 sec. Max.
o
60sec. Max.
120~150 C
2.5~5 C / sec.
o
Above 200 C
Peak-Temperature
Soldering time Condition
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
o
Pre-heat time
120 sec. Max.
260℃ Max.
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Above 220 C
Peak-Temperature
Soldering time Condition
10 sec. Max.
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated
part.
So when using the chip mounter, the picking up nozzle that does not affect
the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 01
August 2008
www.ZLED.com
10. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box
(or a desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 01
August 2008
www.ZLED.com
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
Rev. 01
August 2008
www.ZLED.com
12. Reliability Test Item and Condition
Number
of
Damage
Duration
/ Cycle
Item
Reference
Test Condition
EIAJ ED-
4701
Ta =-40oC (30MIN) ~ 100oC
100
Cycle
Thermal Shock
0/22
(30MIN)
Temperature
Cycle
EIAJ ED-
4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
100
Cycle
0/22
~ 100oC (30MIN) ~ 25oC (5MIN)
High
Temperature
Storage
EIAJ ED-
4701
1000
Hours
Ta =100oC
0/22
0/22
High
Temperature
High Humidity
Storage
EIAJ ED-
4701
1000
Hours
Ta =85oC, RH=85%
Low
Temperature
Storage
EIAJ ED-
4701
1000
Hours
Ta =-40oC
0/22
0/22
Operating
Endurance Test Reference
Internal
1000
Hours
Ta =25oC, IF =20mA
High
Temperature
High Humidity
Life Test
Internal
Reference
300
Hours
Ta =85oC, RH=85%, IF =15mA
Ta =85oC, IF =20mA
0/22
0/22
High
Temperature
Life Test
Internal
Reference
500
Hours
Low
Temperature
Life Test
Internal
Reference
1000
Hours
Ta =-40oC, IF =20mA
1KV at 1.5kΩ; 100pF
0/22
0/22
MIL-STD-
883D
ESD(HBM)
3 Time
Criteria for Judging the Damage
Criteria for Judgement
Item
Symbol
Condition
MIN
-
MAX
USL*1 × 1.2
Forward Voltage
Reverse Current
VF
IR
IF =20mA
VR=5V
-
USL*1 × 2.0
Luminous
Intensity
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
Rev. 01
August 2008
www.ZLED.com
相关型号：
©2020 ICPDF网 联系我们和版权申明