C9WT728 [SEOUL]
Specification; 规范
| 型号： | C9WT728 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Specification |
| 文件： | 总17页 (文件大小：1311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
C9WT728
SSC
CUSTOMER
Drawn
Approval
Approval
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
CONTENTS
1. Description
2. Absolute Maximum Ratings
3. Electro-Optical Characteristics
4. Optical characteristics
5. Reliability Test
6. Color & Binning
7. Bin Code Description
8. Outline Dimension
9. Reel Structure
10. Packing
11. Soldering
12. Precaution for use
13. Handling of Silicone Resin LEDs
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
C9WT728
C9WT728
1. Description
Features
•
White & Warm colored
SMT package.
TOP VIEW LED is designed for
•
•
High CRI PKG
Pb-free Reflow Soldering
Application
high current operation and
high flux output applications.
•
Suitable for all SMT
Furthermore, its thermal management characteristic
is better than other LED solutions by package SMD
design and good thermal emission material.
According to these advantages, it enables to apply
various lighting applications and design solution,
automotive lighting etc.
assembly methods ;
Suitable for all soldering
methods
•
•
RoHS Compliant
MSL LEVEL 2a
Applications
•
•
•
Interior lighting
General lighting
Indoor and out door
displays
•
Architectural / Decorative
lighting
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
2. Absolute maximum ratings
Parameter
Symbol
Value
324
Unit
mW
Power Dissipation
Pd
Forward Current
IF
90
mA
mA
Peak Forward Current
(Per die)
*2
IFM
100
Reverse Voltage (per die)
Operating Temperature
Storage Temperature
VR
5
V
Topr
Tstg
-40 ~ +85
-40 ~ +100
ºC
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter
Symbol Condition
Min
3.0
-
Typ
3.3
-
Max
3.6
10
Unit
V
IF =20mA
VR=5V
Forward Voltage (per die)
Reverse Current (per die)
VF
IR
µA
*1
Luminance Intensity
IF =60mA
IF =60mA
IF =60mA
IV
IV
4.0
4.0
-
4.8
4.5
-
-
-
cd
cd
lm
[4,700 ~ 7,000 K]
*1
Luminance Intensity
[2,600 ~ 4,700 K ]
Luminance Flux
14.5
ΦV
[CIE X = 0.31, Y = 0.31]
Color Temperature
Optical Efficiency
CCT
2,600
7,000
K
Ŋelc
IF =60mA
IF =60mA
IF =60mA
-
-
73
120
95
-
-
lm/W
deg
*2
2θ
Viewing Angle
½
Color Rendering Index
Ra
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Forward Voltage
vs. Forward Current (Per die)
Forward Current
vs. Relative Luminous Intensity
2.5
2.0
1.5
1.0
0.5
0.0
10
1
2.0
2.5
3.0
3.5
4.0
0
50
100
150
200
Forward Voltage[V]
Forward Current IF[mA]
Ambient Temperature
vs. Maximum Forward Current (per die)
Directivity
35
30
25
20
15
10
5
0
30
-30
60
-60
90
-90
0
-25
0
25
50
75
100
Ambient temperature Ta(OC)
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
5. Reliability Test
Number
of
Damaged
Duration /
Cycle
Item
Reference
Test Conditions
EIAJ
ED-4701
Ta =-40oC(30min) ~
1000
Cycle
Thermal Shock
0/22
0/22
0/22
0/22
0/22
100oC(30min)
High Temperature
Storage
EIAJ
ED-4701
Ta =100oC
Ta =60oC, RH=90%
Ta =-40oC
1000 Hours
1000 Hours
1000 Hours
1000 Hours
High Temp. High
Humidity Storage
EIAJ
ED-4701
Low Temperature
Storage
EIAJ
ED-4701
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =60mA
High Temperature
High Humidity Life
Test
Internal
Reference
500
Hours
Ta =60oC, RH=90%, IF =60mA
Ta =85oC, IF =60mA
0/22
0/22
High Temperature
Life Test
Internal
Reference
1000 Hours
Low Temperature
Life Test
Internal
Reference
Ta =-40oC, IF =60mA
1KV at 1.5kΩ; 100pF
1000 Hours
3 Time
0/22
0/22
MIL-STD-
883D
ESD(HBM)
□ CRITERIA FOR JUDGING THE DAMAGE
Criteria for Judgment
Item
Symbol
Condition
MIN
MAX
USL*1 × 1.2
USL*1 × 2.0
-
IF =60mA
(20mA per die)
Forward Voltage
Reverse Current
Luminous Intensity
VF
IR
IV
-
VR=5V
-
IF =60mA
(20mA per die)
LSL*2 × 0.5
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
6. Color & Binning
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
520
525
515
510
530
535
540
545
550
555
505
560
565
570
500
575
580
585
590
595
600
495
610
620
490
630
830
485
480
475
470
460
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
C I E (x)
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
6. Color & Binning
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.30
0.28
ENERGY STAR RANK
2600K
2700K
2900K
3000K
3200K
(7000K~2600K)
H3
H1
H4
G3
3500K
G1
3700K
F3
H2
4000K
F1
G4
E3
G2
4200K
4500K
4700K
5000K
F4
E1
F2
D3
E4
D1
E2
5300K
C3
D4
C1
5600K
6000K
6500K
7000K
D2
C4
C2
Z
B2
B1
A2
X
A1
Y
0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48
CIE X
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
6. Color & Binning
● COLOR RANK
<IF=60mA, Ta=25℃>
7000 ~ 6500 K
6500 ~ 6000 K 6000 ~ 5600 K
5600 ~ 5300 K
A1
A2
C2
B1
B2
CIE X
0.3028
0.3068
0.3145
0.3117
CIE Y
0.3304
0.3113
0.3187
0.3393
CIE X
0.3117
0.3145
0.3221
0.3205
CIE Y
0.3393
0.3187
0.3261
0.3481
CIE X
0.3207
0.3222
0.3294
0.3292
CIE Y
0.3462
0.3243
0.3306
0.3539
CIE X
0.3292
0.3294
0.3366
0.3376
CIE Y
0.3539
0.3306
0.3369
0.3616
5300 ~ 5000 K
5000 ~ 4700 K
C1
C3
C4
CIE X
0.3376
0.3371
0.3451
0.3463
CIE Y
0.3616
0.349
0.3554
0.3687
CIE X
0.3371
0.3366
0.344
CIE Y
0.349
0.3369
0.3428
0.3554
CIE X
0.3463
0.3451
0.3533
0.3551
CIE Y
0.3687
0.3554
0.362
CIE X
0.3451
0.344
0.3515
0.3533
CIE Y
0.3554
0.3428
0.3487
0.362
0.3451
0.376
7000 ~ 6000 K
6000 ~ 5300 K
5300 ~ 4700 K
X
Y
Z
CIE X
0.3104
0.3068
0.3221
0.3234
CIE Y
0.294
0.3113
0.3261
0.3105
CIE X
0.3234
0.3222
0.3366
0.3365
CIE Y
0.3105
0.3243
0.3369
0.3258
CIE X
0.3365
0.3366
0.3515
0.35
CIE Y
0.3258
0.3369
0.3487
0.34
● A~C, X~Z -> CCT 4700 ~ 7000 K
Rev. 03
June 2009
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
6. Color & Binning
● COLOR RANK
<IF=60mA, Ta=25℃>
4700 ~ 4500 K
4500 ~ 4200 K
D1
D2
D3
E3
D4
CIE X
0.3548
0.3529
0.3615
0.3641
CIE Y
0.3736
0.3597
0.3659
0.3804
CIE X
0.3529
0.3512
0.359
CIE Y
0.3597
0.3465
0.3521
0.3659
CIE X
0.3641
0.3615
0.3702
0.3736
CIE Y
0.3804
0.3659
0.3722
0.3874
CIE X
0.3615
0.359
0.367
0.3702
CIE Y
0.3659
0.3521
0.3578
0.3722
0.3615
4200 ~4000 K
4000 ~ 3700 k
E1
E2
E4
CIE X
0.3736
0.3702
0.3825
0.3869
CIE Y
CIE X
0.3702
0.367
0.3783
0.3825
CIE Y
CIE X
0.3869
0.3825
0.395
CIE Y
CIE X
0.3825
0.3783
0.3898
0.395
CIE Y
0.3874
0.3722
0.3798
0.3958
0.3722
0.3578
0.3646
0.3798
0.3958
0.3798
0.3875
0.4044
0.3798
0.3646
0.3716
0.3875
0.4006
3700 ~ 3500 K
3500 ~ 3200 K
F1
G1
H1
F2
G2
H2
F3
G3
H3
F4
G4
H4
CIE X
0.3996
0.3941
0.408
CIE Y
0.4015
0.3848
0.3916
0.4089
CIE X
0.3941
0.3889
0.4017
0.408
CIE Y
0.3848
0.369
0.3751
0.3916
CIE X
0.4146
0.408
0.4221
0.4299
CIE Y
0.4089
0.3916
0.3984
0.4165
CIE X
0.408
0.4017
0.4147
0.4221
CIE Y
0.3916
0.3751
0.3814
0.3984
0.4146
3200 ~3000 K
3000 ~ 2900 k
CIE X
0.4299
0.4221
0.4342
0.443
CIE Y
CIE X
0.4221
0.4147
0.4259
0.4342
CIE Y
CIE X
0.443
0.4342
0.4465
0.4562
CIE Y
0.4212
0.4028
0.4071
0.426
CIE X
0.4342
0.4259
0.4373
0.4465
CIE Y
0.4165
0.3984
0.4028
0.4212
0.3984
0.3814
0.3853
0.4028
0.4028
0.3853
0.3893
0.4071
2900 ~ 2700 K
2700 ~ 2600 K
CIE X
0.4562
0.4465
0.4582
0.4687
CIE Y
0.426
0.4071
0.4099
0.4289
CIE X
0.4465
0.4373
0.4483
0.4582
CIE Y
0.4071
0.3893
0.3919
0.4099
CIE X
0.4687
0.4582
0.47
CIE Y
0.4289
0.4099
0.4126
0.4319
CIE X
0.4582
0.4483
0.4593
0.47
CIE Y
0.4099
0.3919
0.3944
0.4126
0.4813
● D~H -> CCT 2600 ~ 4700 K
Rev. 03
June 2009
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
7. Bin Code Description
Bin Code
Color Rank
A1
Luminous Intensity [mcd]
M0
Forward Voltage [V]
Z1
4,700K ~ 7,000K
Color Rank
@ IF = 60mA
Luminous Intensity [mcd]
Average for Total
Forward Voltage [V]
@ IF = 60mA
@ IF = 60mA
A1
B1
C1
C3
X
A2
B2
C2
C4
Y
RANK
M0
Min.
Max.
4,500
5,000
5,500
6,000
6,500
RANK
Z1
Min.
3.0
Max.
3.1
4,000
4,500
5,000
5,500
6,000
M5
N0
Z2
3.1
3.2
N5
Z3
3.2
3.3
Z
P0
A1
3.3
3.45
3.6
A2
3.45
2,600K ~ 4,700K
Color Rank
@ IF = 60mA
D1
D3
E1
E3
F1
D2
D4
E2
E4
F2
F3
F4
G1
G3
H1
H3
G2
G4
H2
H4
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
8.Outline Dimension
Package Outlines
5
2
4
3
6
1
Package
Marking
(Cathode)
Rear View
Front View
Right View
( Tolerance: ±0.2, Unit: mm )
Circuit Diagram
R e c o m m e n d e d
S o ld e r P a d
White Anode
5
4
6
1
W1
W2
W3
2
3
White Cathode
* MATERIALS
PARTS
Package
MATERIALS
Heat-Resistant Polymer
Silicone Resin
Encapsulating Resin
Electrodes
Ag Plating Copper Alloy
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
9. Reel Structure
4±0.1
2±0.05
0.3-0.05
5.3
2.1±0.1
8±0.1
Package
Marking
15.4±1.0
13±0.3
180
2
22
13
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 1,000pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10 to the carrier tape
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
10. Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
245 220 102
7inch
245 220 142
SIDE
1
c
TUV
MADE IN KOREA
1
QUANTITY : XXXX
Acriche
Semiconductor EcoLight
LOT NUMBER : XXXXXXXXXX
RoHS
b
PART NUMBER :
a
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
11. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
Pre-heat
120~150℃
120 sec. Max.
240℃ Max.
10 sec. Max.
10 sec. Max.
Pre-heat time
Pre-heating
o
60sec. Max.
Peak-Temperature
Soldering time Condition
120~150 C
2.5~5 C / sec.
o
Above 200 C
120sec. Max.
(2) Lead-Free Solder
Lead-free Solder
Lead Free Solder
o
o
1~5 C / sec.
260 C Max.
Pre-heat
150~200℃
120 sec. Max.
260℃ Max.
10 sec. Max.
Pre-heating
o
Pre-heat time
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Above 220 C
Peak-Temperature
Soldering time Condition
10 sec. Max.
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter,
the picking up nozzle that does not affect the silicone resign should be used.
[Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
12. Precaution for use
1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
with a desiccant. Otherwise, to store them in the following environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
3) In the case of more than 4 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
5) Quick cooling shall be avoided.
6) Components shall not be mounted on warped direction of PCB.
7) Anti radioactive ray design is not considered for the products.
8) This device should not be used in any type of fluid such as water, oil, organic solvent etc.
When washing is required, IPA should be used.
9) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage.
11) The LEDs must be soldered within seven days after opening the moisture-proof packing.
12) Repack unused products with anti-moisture packing, fold to close any opening and then store
in a dry place.
13) The appearance and specifications of the product may be modified for improvement without notice.
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
13. Handling of Silicone Resin LEDs
1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
3) When populating boards in SMT production, there are basically no restrictions regarding the form of the
pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions
must be considered during the handling of such devices. Compared to standard encapsulants, silicone is
generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution
must be applied to the surface after the
soldering of components.
5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
6) Please do not mold this product into another resin (epoxy, urethane, etc) and
do not handle this product with acid or sulfur material in sealed space.
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
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