SSC-MBT6420 [SEOUL]
TOP LED DEVICE; TOP LED器件
| 型号： | SSC-MBT6420 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | TOP LED DEVICE |
| 文件： | 总11页 (文件大小：514K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
*Customer:
SPECIFICATION
ITEM
MODEL
TOP LED DEVICE
SSC-MBT722
[Contents]
1. Features ------------------------------------------------------------- 2
2. Application ------------------------------------------------------------- 2
3. Absolute Maximum Ratings ------------------------------------------ 2
4. Electro-optical Characteristics ---------------------------------------- 3
5. Rank of MBT722 ------------------------------------------
6. Soldering Profile ----------------------------------------------------
4
5
6
6
7. Outline Dimension
-----------------------------------------------
8. Packing -------------------------------------------------------------
9. Reel Packing Structure ------------------------------------------------- 7
10. Precaution for Use ---------------------------------------------------
8
11. Characteristic Diagram ---------------------------------------- 9
CUSTOMER
Checked by
Approved by
SUPPLIER
Checked by
Drawn by
Approved by
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-MBT722
SSC-QP-7-03-08(REV.00)
- 1/9 -
1. Features
ꢀ Pb-free Reflow Soldering application
ꢀ RoHS Compliant
ꢀ Material : InGaN
ꢀ Suitable for all SMT assembly methods ; Suitable for all soldering methods
ꢀ White colored SMT package and colorless clear window
ꢀ Encapsulating Resin : Epoxy Resin
2. Application
ꢀ Indoor and outdoor displays
ꢀ LCD Backlights etc.
ꢀ Blue – displays
ꢀ Automotive
ꢀ Indicator
3. Absolute Maximum Ratings *1
(Ta=25ºC)
Parameter
Symbol
Value
360
Unit
Power Dissipation
Pd
IF
mW
mA
mA
V
Forward Current
90
*2
Forward Peak Surge Current (per die)
Reverse Voltage (per die)
Operating Temperature
Storage Temperature
IFM
100
VR
Topr
Tstg
5
-30 ~ +85
-40 ~ +100
ºC
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
SEOUL SEMICONDUCTOR CO., LTD.
SSC-MBT722
SSC-QP-7-03-08(REV.00)
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 2/9 -
4. Electro-Optical Characteristics
(Ta=25ºC)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
VF
IR
IF =20 mA
VR=5V
Forward Voltage (per die)
Reverse Current (per die)
Luminance Intensity *1
2.7
-
3.3
-
4.0
10
V
µA
mcd
IV
IF =60 mA
300
580
860
IF =60 mA
IF =60 mA
IF =60mA
IF =60 mA
Luminance Flux
Dominant Wavelength
Peak Wavelength
Φ V
λd
-
465
-
1.8
470
463
27
-
477
-
lm
nm
nm
nm
λP
Spectral Bandwidth
-
-
∆λ
Viewing Angle *2
Optical Efficiency
-
-
120
9
-
-
deg
IF =60 mA
IF =60 mA
2θ
½
η
lm/W
opt
*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
Luminous Intensity Measurement allowance is ±10%.
*2 2θ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
½
[Note] All measurements were made under the standardized environment of SSC.
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-MBT722
SSC-QP-7-03-08(REV.00)
- 3/9 -
5. Rank of MBT722
▣ Rank Name Table
X1
Iv
X2
λd
X3
Vf
▣ Luminous Intensity [Iv]
Rank
Name
Iv (mcd)
MIN
MAX
N
O
P
300
400
510
650
400
510
650
860
Q
▣ Dominant Wavelength [λd]
Rank
λd (nm)
Name
MIN
MAX
469
465
469
473
A
B
C
473
477
▣ Forward Voltage
Vf (V)
Rank
Name
MIN
MAX
3.1
3.6
1
2
2.7
3.1
3
3.6
4.0
SEOUL SEMICONDUCTOR CO., LTD.
SSC-MBT722
SSC-QP-7-03-08(REV.00)
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 4/9 -
6.Soldering Profile
(1) Reflow Soldering Conditions / Profile (Lead Free Solder)
Temp
[°C]
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Cooling
-5 °C/sec
Rising
5 °C/sec
Pre-heating
180
150
0
Time
[Hr]
(2) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-MBT722
SSC-QP-7-03-08(REV.00)
- 5/9 -
7. Outline Dimension
Package Outlines
5
2
4
3
6
Package
Marking
1
(Cathode)
Front View
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
Recommended
Solder Pad
Circuit Diagram
Blue
Blue
Blue
Anode
Anode
Anode
6
5
4
B1
B2
B3
1
2
3
Blue
Blue
Blue
Cathode
Cathode
Cathode
( Tolerance: ±0.2, Unit: mm )
* MATERIALS
PARTS
Package
Encapsulating Resin
Electrodes
MATERIALS
Heat-Resistant Polymer
Epoxy Resin
Ag Plating Copper Alloy
SEOUL SEMICONDUCTOR CO., LTD.
SSC-MBT722
SSC-QP-7-03-08(REV.00)
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 6/9 -
8. Packing
Package
Marking
( Tolerance: ±0.2, Unit: mm )
(1) Quantity : 700pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the
carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-MBT722
SSC-QP-7-03-08(REV.00)
- 7/9 -
9. Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
SIDE
1
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
TOP LED
a
b
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
SEOUL SEMICONDUCTOR CO., LTD.
SSC-MBT722
SSC-QP-7-03-08(REV.00)
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 8/9 -
10. Lot Number
The lot number is composed of the following characters;
MBT○□□◎◎ # ~ #
MBT ꢀFirst Part Name
○ ꢀ
Year (6 for 2006, 7 for 2007, 8 for 2008 )
□□ ꢀ Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.)
◎◎ ꢀ Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.)
# ~# ꢀ The number of the internal quality control
XXX
QUANTITY : 700
LOT NUMBER : MBT70426 01 512
PART NUMBER : MBT722
SEOUL SEMICONDUCTOR CO., LTD.
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-MBT722
SSC-QP-7-03-08(REV.00)
- 9/9 -
10. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
with a desiccant. Otherwise, to store them in the following environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
transmission efficiency, causing the light intensity to drop. Attention in followed;
Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When
washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry
place.
(12) The appearance and specifications of the product may be modified for improvement without notice.
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-MBT722
SSC-QP-7-03-08(REV.00)
- 10/9 -
11. Characteristic Diagram
Forward Current vs Forward Voltage
(per die)
(Ta=25ºC)
(Ta=25ºC)
6
5
4
3
2
1
0
100
50
20
10
5
1
0
30
(10)
60
(20)
90
120 150 180 210 240 270 300
< total
2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4
(50) (60)
(100)
(90)
(30) (40)
(70) (80)
< per die
Foward Current If[mA]
Forward Voltage VF [V]
Forward Current Derating Curve
(per die)
Radiation Diagram
(TA=25ºC)
40
3 Chip ON
0
30
20
10
0
30
-30
60
-60
90
-90
0
20
40
60
80
100
Ambient Temperature TA [oC ]
SEOUL SEMICONDUCTOR CO., LTD.
SSC-MBT722
SSC-QP-7-03-08(REV.00)
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 11/9 -
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