SUYT801 [SEOUL]
surface-mount LED; 表面贴装LED
| 型号： | SUYT801 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | surface-mount LED |
| 文件： | 总10页 (文件大小：174K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
SUYT801
SSC
Drawn
Approval
Approval
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
SUYT801
1. Features
2. Absolute M axim um Ratings
3. Electro Characteristics
4. Optical characteristics
5. Outline Dim ension
6. Packing
7. Soldering
8. Precaution for use
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
SUYT801
SUYT801
Description
Features
This surface-m ount LED
com es in PLCC standard
package dim ension. It has a
substrate m ade up of a m olded
plastic reflector sitting on top
of a bent lead fram e. The die is
attached within the reflector
cavity and the cavity is
• Industry Standard
PLCC SMT package
• High brightness
using AlInGaP and
InGaN dice
technologies
encapsulated by epoxy or
silicone
• Available in multiple
colors
The package design coupled
with careful selection of
com ponent m aterials allow
these products to perform with
high reliability in a larger
tem perature range -40℃ to
100℃. The high reliability
feature is crucial to Autom otive
interior and Indoor ESS.
• High volume, high
reliability
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 09
December 2006
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
1. Features
• Yellow colored SM T package
• M aterial AlInGaP
• Suitable for all SM T assem bly m ethods
Suitable for all soldering m ethods
• RoHS Com pliant
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
m W
m A
m A
V
Power Dissipation
Forward Current
Pd
75
I
30
F
*2
Peak Forward Current
Reverse Voltage
I
90
FM
VR
5
Operating Temperature
Storage Temperature
Topr
Tstg
-40 ~ + 100
-40 ~ + 100
oC
oC
*1 Care is to be taken that power dissipation does not exceed the absolute m axim um rating of the product.
*2 IFM was m easured at TW ≤ 1m sec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Param eter
Forward Voltage
Sym bol Condition
M in
Typ
M ax
Unit
VF
I =20m A
1.7
-
2.1
-
2.5
10
500
-
V
F
Reverse Current
µA
m cd
nm
I
VR=5V
R
Luminance Intensity *1
Peak Wavelength
I
I =20m A
250
-
350
595
589
17
V
F
λP
λd
I =20m A
F
Dominant Wavelength
Spectral Bandwidth 50%
Viewing Angle *2
I =20m A
584
-
594
-
nm
F
∆λ
I =20m A
nm
F
2θ
I =20m A
-
120
-
deg.
½
F
*1. The lum inous intensity IV was m easured at the peak of the spatial pattern which m ay not be aligned with the m echanical axis of
the LED package. Lum inous Intensity M easurem ent allowance is ±10%
*2. 2θ½ is the off-axis where the lum inous intensity is 1/2 of the peak intensity.
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
(Ta=25 OC )
(Ta=25 OC )
1 0 2
1 0 1
1 0 0
1 .6
1 .4
1 .2
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
1 .8 0
1 .8 5
1 .9 0
1 .9 5
2 .0 0
2 .0 5
0
5
1 0
1 5
2 0
2 5
3 0
Forward Current IF [mA]
Forward Voltage VF (V)
Forward Current Derating Curve
Radiation Diagram
(Ta=25 OC )
40
30
20
10
0
0
30
-30
60
-60
90
-90
-40
-20
0
20
40
60
80
100
120
O
Ambient Temperature TA [ C]
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
5.outline dimension
Recom m endedS older Pattern
1.9
0.85
2.80
2.20
Cathode
Anode
2.2
C0.8
0.50
0.15
ATTENTION M ARKING ON LED IS ANODE(+ )
( Tolerance: ±0.2, Unit: mm )
6. packing
1.55
± 0.05
4.0±0.1
0.22±0.05
2.0±0.05
1.0±0.1
8°
3.1±0.1
2.22±0.1
11.4±0.1
9.0 ±0.3
+0
-3
180
2.0 ±0.2
LABLE
13±0.2
30°
10
22
(1) Quantity : 2000pcs/Reel
(2) Cum ulative Tolerance : Cum ulative Tolerance/10 pitches to be ±0.2m m
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, M anufacturing data Code No. and quantity to be indicated on a dam p proof Package
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
b
PART NUMBER :
a
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
7. soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
120~150 C
Pre-heat tim e
120 sec. M ax.
240℃ M ax.
10 sec. M ax.
o
60sec. Max.
Above 200 C
2.5~5 C / sec.
o
Peak-Tem perature
Soldering tim e Condition
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
Pre-heat tim e
120 sec. M ax.
260℃ M ax.
o
60sec. Max.
Above 220 C
o
150~200
C
1~5 C / sec.
o
Peak-Tem perature
Soldering tim e Condition
10 sec. M ax.
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
8. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 00
November 2007
www.ZLED.com
: SSC-QP-7-07-24 (Rev.00)
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