SZ5-M1-WN-00 [SEOUL]
Superior Efficacy and Lumen output with Small Form Factor;
| 型号： | SZ5-M1-WN-00 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Superior Efficacy and Lumen output with Small Form Factor |
| 文件： | 总26页 (文件大小：959K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SZ5-M1-WX-XX – High-Power LED
Superior Efficacy and Lumen output with Small Form Factor
Z Power LED – Z5-M1
SZ5-M1-WX-XX (Cool, Neutral, Warm)
MacAdam
3-Step
RoHS
Product Brief
Description
Features and Benefits
•
•
•
The Z-Power series is designed for high
flux output applications with high current
operation capability.
•
•
•
•
•
•
•
High Lumen Output and Efficacy
Designed for high current operation
Low Thermal Resistance
Wide CCT range 3000~7000K
High Color Quality, CRI Min. 80
ANSI compliant Binning
It incorporates state of the art SMD
design and low thermal resistant
material.
MacAdam 3 Step for Warm White
The Z Power LED is ideal light sources
for directional lighting applications such
as Spot Lights, various outdoor
applications, automotive lightings and
high performance torches .
Key Applications
•
•
•
•
•
•
•
Indoor lighting
Outdoor lighting
Automotive
Architectural lighting
Industrial lighting (High/Low bay)
Portable Torch
Home appliance
Table 1. Product Selection Table
CCT
CRI
Min
70
Part Number
Color
Min.
Typ.
Max.
SZ5-M1-W0-00
SZ5-M1-W0-C8
SZ5-M1-WN-00
SZ5-M1-WN-C8
SZ5-M1-WW-00
SZ5-M1-WW-C8
SZ5-M1-WW-C9
Cool White
Cool White
4700K
4700K
3700K
3700K
2600K
2600K
2600K
5300K
5300K
4000K
4000K
3000K
3000K
3000K
7000K
7000K
4700K
4700K
3200K
3700K
3200K
75
Neutral White
Neutral White
Warm White
Warm White
Warm White
70
80
68
80
90
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
1
SZ5-M1-WX-XX – High-Power LED
Table of Contents
Index
•
•
•
•
Product Brief
1
2
3
5
Table of Contents
Product Performance
Characteristics Graph
•
•
•
Color Bin Structure
11
16
17
Mechanical Dimensions
Packaging Information
•
•
•
Product Nomenclature
18
19
20
Recommended Solder Pad
Reflow Soldering Characteristics
•
•
•
Handling of Silicone Resin for LEDs
Precaution For Use
21
22
25
Company Information
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
2
SZ5-M1-WX-XX – High-Power LED
Performance Characteristics
Table 2. Electro Optical Characteristics, Tj=25ºC, RH30%
Viewing
CRI
,
Angle
Typical
Typical Forward
Voltage (VF) [4]
CCT
(K) [1]
[5]
Luminous Flux [2]
(degree
s)
ФV [3] (lm)
Part Number
Ra
2Θ ½
Typ.
118
118
118
118
118
118
118
Typ.
350mA
700mA*
285
1.2A*
350mA
700mA*
3.14
3.14
3.14
3.14
3.14
3.14
3.14
1.2A*
3.33
3.33
3.33
3.33
3.33
3.33
3.33
Min.
70
75
70
80
68
80
90
SZ5-M1-W0-00
SZ5-M1-W0-C8
SZ5-M1-WN-00
SZ5-M1-WN-C8
SZ5-M1-WW-00
SZ5-M1-WW-C8
SZ5-M1-WW-C9
5300
5300
4000
4000
3000
3000
3000
158
150
156
142
148
128
105
433
411
415
382
403
353
286
2.95
2.95
2.95
2.95
2.95
2.95
2.95
271
276
253
265
231
188
Table 3. Electro Optical Characteristics, Tj=85ºC
Typical
CCT (K)
Typical Forward
Voltage (VF) [4]
Luminous Flux [2]
[1]
ФV [3] (lm)
Part Number
Typ.
350mA
142
135
137
126
141
117
95
700mA*
258
1.2A*
393
373
380
349
364
322
232
350mA
700mA*
2.96
2.96
2.96
2.96
2.96
2.96
2.96
1.2A*
3.14
3.14
3.14
3.14
3.14
3.14
3.14
SZ5-M1-W0-00
SZ5-M1-W0-C8
SZ5-M1-WN-00
SZ5-M1-WN-C8
SZ5-M1-WW-00
SZ5-M1-WW-C8
SZ5-M1-WW-C9
5300
5300
4000
4000
3000
3000
3000
2.78
2.78
2.78
2.78
2.78
2.78
2.78
245
250
229
239
210
153
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color
coordinate : 0.005, CCT 5% tolerance.
(2) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is 0.06V on forward voltage measurements.
(5) Tolerance is 2.0 on CRI measurements.
* No values are provided by real measurement. Only for reference purpose
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
3
SZ5-M1-WX-XX – High-Power LED
Performance Characteristics
Table 4. Absolute Maximum Ratings, Tj=25ºC
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
1500
2000
5
Forward Current [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
IF
IF
-
-
mA
mA
V
VR
-
-
Power Dissipation
Pd
-
-
-
5.22
150
125
125
-
W
Junction Temperature
Operating Temperature
Storage Temperature
Thermal resistance (J to S) [3]
ESD Sensitivity(HBM) [4]
Tj
-
-
ºC
Topr
Tstg
RθJ-S
- 40
- 40
-
ºC
-
ºC
4.5
K/W
Class 3A JESD22-A114-E
Notes :
(1) At Junction Temperature 25℃ condition.
(2) Pulse width ≤10ms, duty cycle ≤ 10% condition.
(3) RθJ-S is tested at 350mA.
(4) The zener diode is included to protect the product from ESD.
•
Thermal resistance can be increased substantially depending on the heat sink design/operating
condition, and the maximum possible driving current will decrease accordingly.
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
4
SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 1. Color Spectrum, Tj=25ºC
1.25
Cool white
Neutral white
Warm white
1.00
0.75
0.50
0.25
0.00
350
400
450
500
550
600
650
700
750
800
Wavelength [nm]
Fig 2. Typical Spatial Distribution
100
90
80
70
60
50
40
30
20
10
0
-80
-60
-40
-20
0
20
40
60
80
Angular Displacement [degrees]
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
5
SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj=25℃
1600
1400
1200
1000
800
600
400
200
0.0
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, Tj=25℃
400
350
300
250
200
150
100
50
0
0
200
400
600
800
1000
1200
1400
1600
Forward Current [mA]
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
6
SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 5. Forward Current vs. CIE x, y Shift, Tj=25℃
0.02
ΔCIE x
ΔCIE y
0.01
0.00
-0.01
-0.02
0
200
400
600
800
1000
1200
1400
Forward Current [mA]
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
7
SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 6. Relative Light Output vs. Junction Temperature, IF=350mA
120
100
80
60
40
20
0
25
50
75
100
125
150
Junction Temperature [oC]
Fig 7. Junction Temp. vs. CIE x, y Shift, IF=350mA
0.02
ΔCIE x
ΔCIE y
0.01
0.00
-0.01
-0.02
25
50
75
100
125
150
o
Junction Temperature [ C]
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
8
SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 8. Relative Forward vs. Junction Temperature, IF=350mA
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
40
60
80
100
120
140
160
o
Junction Temperature [ C]
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
9
SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.)=150℃, IF =1500mA
1600
Rth(j-a)=15℃/W
Rth(j-a)=20℃/W
Rth(j-a)=25℃/W
1400
1200
1000
800
600
400
200
0.0
0
20
40
60
80
100
120
140
Ambient Temperature [oC]
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
10
SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
Table 5. Bin Code description, IF=350mA, Tj=25℃
Luminous Flux (lm)
Color
Typical Forward Voltage (VF)
Part Number
Chromaticity
Coordinate
Bin Code
V2
Min.
130
140
150
160
130
140
150
130
140
150
160
109
118.5
130
140
130
140
150
109
118.5
130
140
91
Max.
140
150
160
170
140
150
160
140
150
160
170
118.5
130
140
150
140
150
160
118.5
130
140
150
100
109
118.5
Bin Code
Min.
Max.
G
2.75
3.00
V3
SZ5-M1-W0-00
Refer to page.13
Refer to page.13
Refer to page.14
H
I
3.00
3.25
2.75
3.25
3.50
3.00
W1
W2
V2
G
SZ5-M1-W0-C8
SZ5-M1-WN-00
V3
H
3.00
3.25
W1
V2
G
H
I
2.75
3.00
3.25
2.75
3.00
3.25
3.00
3.25
3.50
3.00
3.25
3.50
V3
W1
W2
U3
G
H
I
V1
SZ5-M1-WN-C8
SZ5-M1-WW-00
SZ5-M1-WW-C8
SZ5-M1-WW-C9
Refer to page.14
Refer to page.15
Refer to page.15
Refer to page.15
V2
V3
V2
G
H
I
2.75
3.00
3.25
3.00
3.25
3.50
V3
W1
U3
G
H
I
2.75
3.00
3.25
3.00
3.25
3.50
V1
V2
V3
U1
G
H
I
2.75
3.00
3.25
3.00
3.25
3.50
U2
100
109
U3
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
11
SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
Table 6. Flux Bin Code description, Tj=85℃
Luminous Flux (lm)
350mA*
700mA*
Bin Code
Min.
84
Max.
92
Min.
152
167
182
193
205
218
240
256
Max.
167
182
198
205
218
240
256
272
U1
U2
U3
V1
V2
V3
W1
W2
92
100
109
119
129
138
147
156
100
109
119
129
138
147
Table 7. VF Bin Code description, Tj=85℃
Forward Voltage (VF)
350mA*
Max.
2.82
700mA*
Bin Code
Min.
2.60
2.82
3.06
Min.
2.77
3.02
3.27
Max.
3.02
3.27
3.52
G
H
I
3.06
3.30
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
12
SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Tj =25℃, IF=350mA
4700K
0.38
0.36
0.34
0.32
0.30
5000K
C1
C3
5300K
B1
C0
5600K
C2
C4
6000K
C5
B0
B3
B5
6500K
A1
A3
A5
B2
B4
7000K
A0
A2
A4
0.30
A1
0.32
0.34
0.36
CIE (x)
A0
A5
B4
C3
A2
B1
C0
C5
A3
B2
C1
A4
B3
C2
CIE x
0.3028
0.3041
0.3126
0.3115
CIE y
CIE x
CIE y
0.3393
0.3324
0.3408
0.3481
CIE x
CIE y
CIE x
0.3126
0.3136
0.3216
0.3210
CIE y
CIE x
0.3055
0.3068
0.3146
0.3136
CIE y
0.3177
0.3113
0.3187
0.3256
0.3304
0.3240
0.3324
0.3393
0.3115
0.3126
0.3210
0.3205
0.3041
0.3055
0.3136
0.3126
0.3240
0.3177
0.3256
0.3324
0.3324
0.3256
0.3334
0.3408
B0
B5
C4
CIE x
0.3136
0.3146
0.3221
0.3216
CIE y
0.3256
0.3187
0.3261
0.3334
CIE x
0.3207
0.3212
0.3293
0.3292
CIE y
0.3462
0.3389
0.3461
0.3539
CIE x
0.3292
0.3293
0.3373
0.3376
CIE y
0.3539
0.3461
0.3534
0.3616
CIE x
0.3212
0.3217
0.3293
0.3293
CIE y
0.3389
0.3316
0.3384
0.3461
CIE x
0.3293
0.3293
0.3369
0.3373
CIE y
0.3461
0.3384
0.3451
0.3534
CIE x
0.3217
0.3222
0.3294
0.3293
CIE y
0.3316
0.3243
0.3306
0.3384
CIE x
0.3293
0.3294
0.3366
0.3369
CIE y
0.3384
0.3306
0.3369
0.3451
CIE x
0.3376
0.3373
0.3456
0.3463
CIE y
0.3616
0.3534
0.3601
0.3687
CIE x
0.3463
0.3456
0.3539
0.3552
CIE y
0.3687
0.3601
0.3669
0.3760
CIE x
0.3373
0.3369
0.3448
0.3456
CIE y
0.3534
0.3451
0.3514
0.3601
CIE x
0.3456
0.3448
0.3526
0.3539
CIE y
0.3601
0.3514
0.3578
0.3669
CIE x
0.3369
0.3366
0.3440
0.3448
CIE y
0.3451
0.3369
0.3428
0.3514
CIE x
0.3448
0.3440
0.3514
0.3526
CIE y
0.3514
0.3428
0.3487
0.3578
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
13
SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Neutral white), Tj =25℃, IF=350mA
0.42
3700K
4000K
0.40
0.38
0.36
0.34
E1
4200K
E0
E2
E4
4500K
E3
E5
4700K
D1
D3
D5
D0
D2
D4
0.34
0.36
0.38
0.40
CIE (x)
D0
D5
E4
D1
E0
E5
D2
D3
D4
CIE x
0.3548
0.3536
0.3625
0.3641
CIE y
CIE x
CIE y
0.3804
0.3711
0.3775
0.3874
CIE x
0.3536
0.3524
0.3608
0.3625
CIE y
CIE x
CIE y
CIE x
0.3524
0.3512
0.3590
0.3608
CIE y
0.3555
0.3465
0.3521
0.3616
0.3736
0.3646
0.3711
0.3804
0.3641
0.3625
0.3714
0.3736
0.3646
0.3555
0.3616
0.3711
0.3625
0.3608
0.3692
0.3714
0.3711
0.3616
0.3677
0.3775
E1
E2
E3
CIE x
0.3608
0.3590
0.3670
0.3692
CIE y
0.3616
0.3521
0.3578
0.3677
CIE x
0.3736
0.3714
0.3842
0.3869
CIE y
0.3874
0.3775
0.3855
0.3958
CIE x
0.3869
0.3842
0.3970
0.4006
CIE y
0.3958
0.3855
0.3935
0.4044
CIE x
0.3714
0.3692
0.3813
0.3842
CIE y
0.3775
0.3677
0.3751
0.3855
CIE x
0.3842
0.3813
0.3934
0.3970
CIE y
0.3855
0.3751
0.3825
0.3935
CIE x
0.3692
0.3670
0.3783
0.3813
CIE y
0.3677
0.3578
0.3646
0.3751
CIE x
0.3813
0.3783
0.3898
0.3934
CIE y
0.3751
0.3646
0.3716
0.3825
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
14
SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tj=25℃, IF=350mA
F0
F1
F2
F3
F4
CIE x
0.3996
0.396
CIE y
0.4015
0.3907
0.3978
0.4089
CIE x
0.4146
0.4104
0.4248
0.4299
CIE y
0.4089
0.3978
0.4048
0.4165
CIE x
0.396
CIE y
0.3907
0.3798
0.3865
0.3978
CIE x
0.4104
0.4062
0.4198
0.4248
CIE y
0.3978
0.3865
0.3931
0.4048
CIE x
0.3925
0.3889
0.4017
0.4062
CIE y
0.3798
0.369
0.3925
0.4062
0.4104
0.4104
0.4146
0.3751
0.3865
F5
G11
G22
G33
G12
G23
G34
G13
G24
G41
G14
G31
G42
CIE x
0.4062
0.4017
0.4147
0.4198
CIE y
0.3865
0.3751
0.3814
0.3931
CIE x
0.4299
0.4261
0.4324
0.4365
CIE y
0.4165
0.4077
0.4100
0.4189
CIE x
0.4261
0.4223
0.4284
0.4324
CIE y
0.4077
0.3990
0.4011
0.4100
CIE x
0.4223
0.4185
0.4243
0.4284
CIE y
0.3990
0.3902
0.3922
0.4011
CIE x
0.4185
0.4147
0.4203
0.4243
CIE y
0.3902
0.3814
0.3834
0.3922
G21
CIE x
0.4365
0.4324
0.4387
0.4430
CIE y
0.4189
0.4100
0.4122
0.4212
CIE x
0.4324
0.4284
0.4345
0.4387
CIE y
0.4100
0.4011
0.4033
0.4122
CIE x
0.4284
0.4243
0.4302
0.4345
CIE y
0.4011
0.3922
0.3943
0.4033
CIE x
0.4243
0.4203
0.4259
0.4302
CIE y
0.3922
0.3834
0.3853
0.3943
CIE x
0.4430
0.4387
0.4451
0.4496
CIE y
0.4212
0.4122
0.4145
0.4236
G32
CIE x
0.4387
0.4345
0.4406
0.4451
CIE y
0.4122
0.4033
0.4055
0.4145
CIE x
0.4345
0.4302
0.4361
0.4406
CIE y
0.4033
0.3943
0.3964
0.4055
CIE x
0.4302
0.4259
0.4316
0.4361
CIE y
0.3943
0.3853
0.3873
0.3964
CIE x
0.4496
0.4451
0.4515
0.4562
CIE y
0.4236
0.4145
0.4168
0.4260
CIE x
0.4451
0.4406
0.4468
0.4515
CIE y
0.4145
0.4055
0.4077
0.4168
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
15
SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tj=25℃, IF=350mA
G43
H14
H31
H42
G44
H21
H32
H43
H11
H22
H33
H44
H12
H23
H34
H13
H24
H41
CIE x
0.4406
0.4361
0.4420
0.4468
CIE y
0.4055
0.3964
0.3985
0.4077
CIE x
0.4361
0.4316
0.4373
0.4420
CIE y
0.3964
0.3873
0.3893
0.3985
CIE x
0.4625
0.4575
0.4515
0.4562
CIE y
0.4275
0.4182
0.4168
0.4260
CIE x
0.4575
0.4526
0.4468
0.4515
CIE y
0.4182
0.4090
0.4077
0.4168
CIE x
0.4526
0.4477
0.4420
0.4468
CIE y
0.4090
0.3998
0.3985
0.4077
CIE x
0.4477
0.4428
0.4373
0.4420
CIE y
0.3998
0.3906
0.3893
0.3985
CIE x
0.4687
0.4636
0.4575
0.4625
CIE y
0.4289
0.4197
0.4182
0.4275
CIE x
0.4636
0.4585
0.4526
0.4575
CIE y
0.4197
0.4104
0.4090
0.4182
CIE x
0.4585
0.4534
0.4477
0.4526
CIE y
0.4104
0.4012
0.3998
0.4090
CIE x
0.4534
0.4483
0.4428
0.4477
CIE y
0.4012
0.3919
0.3906
0.3998
CIE x
0.4750
0.4697
0.4636
0.4687
CIE y
0.4304
0.4211
0.4197
0.4289
CIE x
0.4697
0.4644
0.4585
0.4636
CIE y
0.4211
0.4118
0.4104
0.4197
CIE x
0.4644
0.4591
0.4534
0.4585
CIE y
0.4118
0.4025
0.4012
0.4104
CIE x
0.4591
0.4538
0.4483
0.4534
CIE y
0.4025
0.3932
0.3919
0.4012
CIE x
0.4810
0.4758
0.4697
0.4750
CIE y
0.4319
0.4225
0.4211
0.4304
CIE x
0.4758
0.4703
0.4644
0.4697
CIE y
0.4225
0.4132
0.4118
0.4211
CIE x
0.4703
0.4648
0.4591
0.4644
CIE y
0.4132
0.4038
0.4025
0.4188
CIE x
0.4648
0.4593
0.4538
0.4591
CIE y
0.4038
0.3944
0.3932
0.4025
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
16
SZ5-M1-WX-XX – High-Power LED
Mechanical Dimensions
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.1mm
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
17
SZ5-M1-WX-XX – High-Power LED
Emitter Tape & Reel Packaging
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
18
SZ5-M1-WX-XX – High-Power LED
Product Nomenclature
RANK :
QUANTITY : #####
LOT NUMBER : ###### #### ###
SSC PART NUMBER : ### ## ## ##
Table 8. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9
Part Number Code
Description
Company
Part Number
Value
X1
X2
S
Z
Z-Power LED series number
PKG series
X3
5
X4
PKG series
M
M series
X5
Revision number
Color Specification
1
New version
Pure white
X6 X7
W0
WN
WW
C8
C9
00
Neutral white
Warm white
CRI (min.) 80
CRI (min.) 90
The others
X8 X9
Color Specification
Table 9. Lot Numbering System : Y1Y1Y2Y3Y3Y4Y5Y5Y5Y5 - Y6Y6Y6 - Y7Y7Y7 - Y8Y8Y8Y8Y8Y8Y8
Lot Number Code
Description
Year
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Month
Day
Production area
Mass order
Taping number
Reel number
Internal management number
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
19
SZ5-M1-WX-XX – High-Power LED
Recommended Solder Pad
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only.
(4) Undefined tolerance is ±0.1mm.
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
20
SZ5-M1-WX-XX – High-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Table 10.
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
150 °C
200 °C
60-120 seconds
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
21
SZ5-M1-WX-XX – High-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to
LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing. In
cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are
used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic
cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(7) Avoid leaving fingerprints on silicone resin parts.
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
22
SZ5-M1-WX-XX – High-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing Z5 Series LEDs in a dry box with a
desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere
should be used for storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
23
SZ5-M1-WX-XX – High-Power LED
Precaution for Use
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. T
he result can be a significant loss of light output from the fixture. Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues.
(14) The slug is electrically isolated.
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the rev
erse voltage is applied to LED, migration can be generated resulting in LED damage.
(17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
24
SZ5-M1-WX-XX – High-Power LED
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
25
SZ5-M1-WX-XX – High-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT -
Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
www.seoulsemicon.com
Rev3.2, Jul 20. 2015
26
相关型号：
©2020 ICPDF网 联系我们和版权申明