SZWW05A0A [SEOUL]
Single Color LED, Warm White, T-1, 2.9mm, ROHS COMPLIANT, SMD, 3 PIN;
| 型号： | SZWW05A0A |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Single Color LED, Warm White, T-1, 2.9mm, ROHS COMPLIANT, SMD, 3 PIN 光电 |
| 文件： | 总16页 (文件大小：332K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Z5
Preliminary specification
Description
Features
• Super high Flux output
and high Luminance
• Designed for high
current operation
• SMT solderable
• Lead Free product
• RoHS compliant
The Z-Power series is designed for high
current operation and high flux output
applications.
It incorporates state of the art SMD
design and low thermal resistant material.
The Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive, large
LCD backlights and high performance torches.
Applications
• Mobile phone flash
• Automotive interior /
exterior lighting
• Automotive signal
lighting
• Automotive forward
lighting
• General Torch
• Architectural lighting
• LCD TV / Monitor
Backlight
• Projector light source
• Traffic signals
• Task lighting
• Decorative / Pathway
lighting
• Remote / Solar
powered lighting
* The appearance and specifications of the product can be changed
for improvement without notice.
Rev. 05
August 2010
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Outline dimensions
Side View
Bottom View
ⓐ
ⓑ
ⓐ
ⓑ
Top View
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ±0.1mm
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August 2010
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Characteristics of Z5 (Part no : SZWW05A0A)
1. Warm white
1-1 Electro-Optical characteristics at 350mA
Value
Typ
75
Parameter
Symbol
Unit
Min
Max
[1]
[2]
Luminous Flux
lm
K
ФV
[3]
Correlated Color Temperature
CRI
CCT
Ra
-
3000
80
-
-
-
[4]
Forward Voltage
VF
3.3
4
V
Thermal resistance (J to S)
View Angle
RθJ-S
2Θ ½
12
K /W
deg.
120
1-2 Absolute Maximum Ratings
Parameter
Forward Current
Symbol
Value
Unit
IF
V
700
5
mA
V
Reverse Voltage
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Pd
Tj
2.8
W
ºC
ºC
ºC
-
145(@ IF ≤ 700mA)
-40 ~ +85
Topr
Tstg
-
-40 ~ +100
[5]
ESD Sensitivity
±8,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tolerance.
[4] Tolerance is ±0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
Rev. 05
August 2010
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3
Color Spectrum TA=25℃
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August 2010
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Forward Current Characteristics
Forward Voltage vs. Forward Current, Ta=25℃
Forward Current vs. Normalized Relative Luminous Flux, Ta=25℃
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August 2010
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Radiation pattern
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August 2010
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Binning Structure
IF=350mA, Ta=25℃
2600K
2700K
2900K
0.44
0.42
0.40
0.38
0.36
3000K
H9
3200K
H8
G9
G8
H1
H0
H3
G1
G0
H2
H5
G3
H4
H7
G2
G5
G4
H6
G7
G6
0.40
0.42
0.44
0.46
0.48
CIE X
* Note
Red area is ANSI bin.
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August 2010
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● COLOR RANK
<IF=350mA, Ta=25℃>
Rev. 05
August 2010
* Measurement Uncertainty of the Color Coordinates : ± 0.01
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● Luminous Flux
Rank
LF [lm]
71~80
80~91
Condition
350mA
T1
T2
U1
U2
U3
91~100
100~109
109~118.5
● Forward Voltage
Rank
Condition
350mA
VF [V]
H
I
3.0~3.25
3.25~3.50
3.50~3.75
3.75~4.0
J
K
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August 2010
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Labeling
P/ N: ####-#####
####
제품명 SSC-SZWW5A0A
Lot No #########
수량 : 1000
Rank
Day
Month
Year
Rank
#1#2#3#4
- #1 : Luminous Flux : LF [lm]
- #2#3 : Color Coordinates : x, y
- #4 : Forward Voltage : VF [V]
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August 2010
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Emitter Carrier & Reel Packaging
CATHODE MARK
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August 2010
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August 2010
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Recommended solder pad
SOLDER PAD
ISOLATION
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] This drawing without tolerances are for reference only
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August 2010
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Reflow Soldering Conditions / Profile
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Cooling
-5 °C/sec
Rising
5 °C/sec
Pre-heating
180
150
0
Time
[Hr]
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
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August 2010
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Precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum
humidity of 50%.
• Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Soldering should be done immediately after opening the package (within 24Hrs).
b. Required conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than 30%
c. If the package has been opened more than 1 week or the color of the desiccant changes,
components should be dried for 10-12hr at 60±5℃
• Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
• Do not rapidly cool device after soldering.
• Components should not be mounted on warped (non coplanar) portion of PCB.
• Radioactive exposure is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
• When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is isolated from anode electrically.
Therefore, we recommend that you don’t isolate the heat sink.
• Attaching LEDs, do not use adhesives that outgas organic vapor.
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August 2010
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Handling of Silicone resin LEDs
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.
Notes for handling:
• Avoid touching silicone resin parts especially with sharp tools such as Pincette
(Tweezers)
• Avoid leaving fingerprints on silicone resin parts.
• Silicone resin will attract dust so use covered containers for storage.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that excessive mechanical
pressure on the surface of the resin must be prevented.
• It is not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
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August 2010
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