USBT801 [SEOUL]
surface-mount LED; 表面贴装LED![USBT801](http://pdffile.icpdf.com/pdf1/p00139/img/icpdf/USBT8_766975_icpdf.jpg)
型号: | USBT801 |
厂家: | ![]() |
描述: | surface-mount LED |
文件: | 总12页 (文件大小:490K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Specification
USBT801
SSC
CUSTOMER
Drawn
Approval
Approval
Rev. 00
November 2007
www.ZLED.com
USBT801
1. Features
2. Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. CIE Chromaticity Diagram
6. Outline Dimension
7. Packing
8. Soldering
9. Precaution for use
Rev. 00
November 2007
www.ZLED.com
USBT801
USBT801
Description
Features
This surface-mount LED
comes in PLCC standard
package dimension. It has a
substrate made up of a molded
plastic reflector sitting on top
of a bent lead frame. The die is
attached within the reflector
cavity and the cavity is
• Industry Standard
PLCC SMT package
• High brightness
using AlInGaP and
InGaN dice
technologies
encapsulated by epoxy or
silicone
• Available in multiple
colors
The package design coupled
with careful selection of
component materials allow
these products to perform with
high reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
• High volume, high
reliability
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 00
November 2007
www.ZLED.com
1. Features
• SKY BLUE colored SMT package
• Material InGaN/SiC
• Suitable for all SMT assembly methods
Suitable for all soldering methods
• RoHS Compliant
Rev. 00
November 2007
www.ZLED.com
2. Absolute maximum ratings
Parameter
Symbol
Pd
Value
Unit
mW
mA
mA
V
Power Dissipation
Forward Current
114
IF
30
*2
Peak Forward Current
Reverse Voltage
IFM
90
VR
5
Operating Temperature
Storage Temperature
Topr
Tstg
-40 ~ +100
-40 ~ +100
oC
oC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Forward Voltage
Symbol
Condition
Min
Typ
Max
Unit
VF
IR
IV
λP
X
IF =10mA
VR=5V
2.4
-
3.1
-
3.8
10
V
Reverse Current
Luminance Intensity *1
µA
IF =10mA
IF =10mA
40
75
110
mcd
nm
Peak Wavelength
-
455
-
-
0.144
0.060
-
0.163
0.080
-
Color Coordinate (x,y)
IF =10mA
-
y
-
Spectral Bandwidth 50%
Viewing Angle *2
∆λ
IF =10mA
IF =10mA
23
nm
2θ
-
120
-
deg.
½
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of
the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rev. 00
November 2007
www.ZLED.com
4. Optical characteristics
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
O
O
(Ta=25 C )
(Ta=25 C )
102
101
100
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.7
2.8
2.9
3.0
3.1
3.2
3.3
0
5
10
15
20
25
30
Forward Current IF [mA]
Forward Voltage VF (V)
Forward Current Derating Curve
Radiation Diagram
O
(Ta=25 C )
40
30
20
10
0
0
30
-30
60
-60
90
-90
-40
-20
0
20
40
60
80
100
120
O
Ambient Temperature TA [
C
]
Rev. 00
November 2007
www.ZLED.com
5. CIE Chromaticity Diagram
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
520
525
515
510
530
535
540
545
550
555
505
560
565
570
500
575
580
585
590
595
600
495
610
620
490
630
830
485
480
475
470
460
0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
CIE(x)
Rev. 00
November 2007
www.ZLED.com
0.090
0.085
0.080
0.075
0.070
0.065
0.060
0.055
0.050
0.140
0.145
0.150
0.155
0.160
0.165
CIE Coord. (X)
● COLOR RANK
<IF=10mA, Ta=25℃>
Color Coordinate
x
y
0.144
0.160
0.160
0.144
0.060
0.060
0.080
0.080
* Measurement Uncertainty of the Color Coordinates : ± 0.01
Rev. 00
November 2007
www.ZLED.com
6.outline dimension
Recommended Solder Pattern
1.9
2.8
0.8
2.2
0.15
Anode
Cathode
Cathode Mark
2.2
( Tolerance: ±0.2, Unit: mm )
7. packing
1.55
± 0.05
4.0±0.1
0.22±0.05
2.0±0.05
1.0±0.1
8°
3.1±0.1
2.22±0.1
11.4±0.1
9.0 ±0.3
+0
-3
180
2.0 ±0.2
LABLE
13±0.2
30°
10
22
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
Rev. 00
November 2007
www.ZLED.com
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
b
PART NUMBER :
a
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 00
November 2007
www.ZLED.com
8. soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
Pre-heat time
120 sec. Max.
240℃ Max.
10 sec. Max.
o
60sec. Max.
120~150 C
2.5~5 C / sec.
o
Above 200 C
Peak-Temperature
Soldering time Condition
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
o
Pre-heat time
120 sec. Max.
260℃ Max.
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Above 220 C
Peak-Temperature
Soldering time Condition
10 sec. Max.
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
November 2007
www.ZLED.com
9. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 00
November 2007
www.ZLED.com
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