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UY101-IE1 [SEOUL]

Single Color LED, Yellow, Untinted Diffused, 1.2mm, 1.60 X 0.80 MM, 0.80 MM HEIGHT, LEAD FREE, LEADLESS, PLASTIC PACKAGE-2;
UY101-IE1
型号： UY101-IE1
厂家： Seoul Semiconductor    Seoul Semiconductor
描述：

Single Color LED, Yellow, Untinted Diffused, 1.2mm, 1.60 X 0.80 MM, 0.80 MM HEIGHT, LEAD FREE, LEADLESS, PLASTIC PACKAGE-2

光电
文件： 总13页 (文件大小：278K)
中文：  中文翻译
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Pb Free  
Specification  
UY101-IE1  
SSC  
Customer  
Drawn  
Approval  
Approval  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
[ Contents ]  
1. Description  
2. Absolute maximum ratings  
3. Electro-Optical characteristics  
4. Characteristic diagrams  
5. Reliability result  
6. Rank  
7. Outline Dimension  
8. Material  
9. Reel Structure  
10. Packing  
11. Soldering profile  
12. Precaution for Use  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
UY101-IE1  
UY101-IE1  
1. Description  
Features  
- Small size suitable for compact  
appliances.  
• 1.6 X 0.8 X 0.8 mm  
• Untinted, Diffused flat  
mold  
- Surface-mounted chip LED  
device.  
• Dominant Wavelength :  
592nm  
- Pb-free and RoHS complaint  
component.  
- High brightness, High efficiency  
- Tape and Reel packing.  
Applications  
ꢀ Cellular phone’s keypad  
- Increases the life time of battery.  
lightning  
ꢀ Information Boards  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
2. Absolute maximum ratings  
(Ta=25 )  
Unit  
Parameter  
Symbol  
Value  
Power Dissipation  
Forward Current  
Pd  
IF  
72  
30  
mW  
mA  
mA  
V
*1  
Peak Forward Current  
Reverse Voltage  
IFM  
100  
VR  
5
Operating Temperature  
Storage Temperature  
Topr.  
Tstg.  
-40 ~ 85  
-40 ~ 100  
*1 IFM conditions: Pulse width Tw 1msec and Duty ratio 1/10.  
3. Electro-Optical Characteristics  
(Ta=25 )  
Parameter  
Symbol Condition  
Min  
Typ  
Max  
Unit  
Forward Voltage  
Reverse Current  
Luminous Intensity*2  
Wavelength  
VF  
IR  
IF=20  
VR=5V  
IF=20  
IF=20  
1.8  
-
2.1  
-
2.4  
10  
V
uA  
Iv  
50  
589  
100  
592  
140  
598  
mcd  
nm  
d
Spectral Bandwidth  
Viewing Angle*3 (Y)  
IF=20  
IF=20  
-
-
12  
-
-
nm  
2
140  
˚
1/2  
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the  
mechanical axis of the LED package.  
*3 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.  
[Note] All measurements were made under the standardized environment of SSC.  
(Tolerance : Iv 10 %,  
2 nm, VF 0.1 V)  
d
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
4. Characteristic Diagrams  
Ta = 25o  
Forward Current vs.  
Forward Voltage  
Relative Luminous Intensity vs.  
Forward Current  
30  
25  
20  
15  
10  
5
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
0
5
10  
15  
20  
25  
30  
1.8  
1.9  
2.0  
2.1  
Forward Current [mA]  
Forward Voltage [V]  
Forward Current vs.  
Ambient Temperature  
Spectrum  
35  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
30  
25  
20  
15  
10  
5
0
-25  
0
25  
50  
75  
100  
400  
500  
600  
700  
Ambient Temperature  
[
]
Wavelength [nm]  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
Radiation Diagram  
Ta = 25o  
90  
120  
60  
150  
180  
30  
0
X
Y
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
5. Reliability Test  
Number Of  
Damaged  
Duration  
/ Cycle  
Item  
Test Conditions  
Operating at Room  
temperature  
20mA, @25  
500 hrs  
500 hrs  
500 hrs  
100 cycle  
1 time  
0/22  
0/22  
0/22  
0/22  
0/22  
Operating at High  
temperature  
20mA, @85  
Operating at High  
temperature  
/ High humidity  
20mA, @60 ,90%  
Thermal shock test  
-40~85 Shift (2hr/cycle)  
85 , 85% 24hrs ꢁ Reflow 3 times  
(Max 260 10sec) ꢁ Thermal shock  
30 cycle  
Thermal resistance  
Test  
MSL : 2a (30 , 60% : 4 weeks)  
*Criterion  
OK  
> Initial value * 0.5  
Initial value 0.1V  
Iv  
VF  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
6. Rank  
IF = 20mA  
BIN  
IV [mcd]  
VF [V]  
WD [nm]  
F
E
50-100  
100-140  
50-100  
1.8-2.4  
1.8-2.4  
1.8-2.4  
1.8-2.4  
1.8-2.4  
1.8-2.4  
589-592  
589-592  
592-595  
592-595  
595-598  
595-598  
D
C
B
A
100-140  
50-100  
100-140  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
7. Outline Dimension  
Tolerance 0.1, Unit :  
Polarity Mark  
Cathode  
Anode  
0.8  
[Recommended Solder Pattern]  
8. Material  
Item  
Substrate  
chip  
wire  
Encapsulate  
Epoxy  
Electrode  
Material  
BT-Resin PCB  
AlInGaP  
Gold  
Au Plated  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
9. Reel Structure  
(1) Quantity : 4000pcs/Reel  
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm  
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the  
cover tape is turned off from the carrier tape at 10 angle to be the carrier tape  
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a  
damp proof Package  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
10. Packing  
Reel  
RANK:  
XXX  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
HUMIDITY INDICATOR  
# # # #  
# # #  
DESI PAK  
Aluminum Vinyl Bag  
# # #  
# # #  
# # # # # # #  
RANK:  
XXX  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
Outer Box Structure  
SIDE  
1
RANK:  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
c
1
2
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
RoHS  
b
a
SIDE  
2
LOT NUMBER  
Rank  
QTY  
Material : Paper(SW3B(B))  
SIZE (mm)  
TYPE  
a
c
b
7inch 245 220 142  
SEOUL SEMICONDUCTOR CO., LTD.  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
11. Soldering profile  
(1) Lead Solder  
Lead Solder  
Lead Solder  
o
o
2.5~5 C / sec.  
Pre-heat  
120~150  
240 C Max.  
10 sec. Max.  
Pre-heat time  
Peak-Temperature  
120 sec. Max.  
240 Max.  
Pre-heating  
o
60sec. Max.  
Above 200 C  
120~150 C  
2.5~5 C / sec.  
o
Soldering time  
Condition  
120sec. Max.  
10 sec. Max.  
(2) Lead-Free Solder  
Lead-frame Solder  
o
Lead Free Solder  
o
1~5 C / sec.  
Pre-heat  
150~200  
260 C Max.  
10 sec. Max.  
Pre-heat time  
Peak-Temperature  
120 sec. Max.  
260 Max.  
Pre-heating  
o
60sec. Max.  
Above 220 C  
o
150~200 C  
1~5 C / sec.  
o
Soldering time  
Condition  
120sec. Max.  
10 sec. Max.  
(3) Hand Soldering conditions  
Do not exceed 3 seconds at maximum 280ºC under soldering iron.  
Note : In case that the soldered products are reused in soldering process,  
we don’t guarantee the products.  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  
12. Precaution for Use  
(1) Storage  
LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more  
after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is  
recommended. To avoid absorption of moisture, it is recommended to store in a dry box  
(or a desiccator) with a desiccant.  
* Shelf Life : 12 months at < 40ºC and 90%RH  
(2) Attention after open.  
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect  
the light transmission efficiency, causing the light intensity to drop. After opened and  
mounted the soldering shall be quickly.  
* Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or  
Stored at < 10% RH  
(3) Repack unused products with anti-moisture packing, fold to close any opening and  
then store in a dry place.  
(4) In the case of change color of indicator on desiccant, components shall be dried  
10-12hr at 60 5ºC.  
(5) When the LED is operating, the driving current should be determined after considering  
the maximum ambient temperature requirements.  
(6) When using multiple LEDs, It is recommended to connect a resistor on each LED.  
Otherwise, LEDs may vary due to variation in forward voltage of the LEDs.  
(7) The driving circuit must be designed to allow forward voltage only when it is ON or  
OFF. If the reverse voltage is applied to LED, migration can be generated resulting  
in LED damage  
(8) Any mechanical force or excessive vibration should be avoided during temperature  
cooling process to normal temperature after reflow.  
(9) Rapid cooling shall be avoided.  
(10) LED should not be placed on a flexible area on the PCB.  
(11) This device should not be used in any type of fluid such as water, oil, organic solvent  
etc. When washing is required, IPA should be used.  
(12) Anti radioactive ray design is not considered for the products.  
(13) Damage prevention from ESD or Surge.  
It is highly recommended to use the wrist-band or anti electrostatic gloves when handling  
the LED’s All devices, equipments and machines mush be properly grounded  
(14) The appearance and specifications of the product may be modified for improvement  
without notice.  
Rev. 02  
January 2012  
WWW.SEOULSEMICON.COM  
: SSC- QP- 7- 07- 25 (Rev.0.0)  

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