W10492 [SEOUL]
Single Color LED, Pure White, ROHS COMPLIANT, SMD, 2 PIN;
| 型号： | W10492 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Single Color LED, Pure White, ROHS COMPLIANT, SMD, 2 PIN 光电 |
| 文件： | 总19页 (文件大小：535K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEOUL SEMICONDUCTOR
Z-POWER LED Series
Technical Datasheet for X1049X
Z-Power series is designed for high current operation and
high flux output applications.
Z-Power LED's thermal management perform exceeds
other power LED solutions.
It incorporates state of the art SMD design and Thermal
emission material.
Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive large
LCD backlights
Features
• Super high Flux output
and high Luminance
• Designed for high
current operation
• Low thermal resistance
• SMT solderbility
• Lead Free product
• RoHS compliant
Applications
• General Illumination
- Outdoor & Indoor architectural
lighting
- Decorative lighting
- Torch lighting
- Portable lighting (Flash and lamp)
and Reading lighting
- Traffic signaling
1
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Full Code of Z-Power LED Series
Full code form : X1 X2 X3 X4 X5 X6 – X7 X8 – X9 X10 X11 X12 X13
1. Part Number
- X1 : Color
- X2 : Z-Power LED series number
- X3 : LENS type
- X4 : Chip quantity (or Power Dissipation)
- X5 : Package outline size
- X6 : Type of PCB
2. Internal Number
- X7
- X8
3. Code Labeling
- X9 : Luminous flux (or Radiant flux for royal blue)
- X10 X11 X12 : Dominant wavelength (or x,y coordinates rank code)
- X13 : Forward voltage
4. Sticker Diagram on Reel & Aluminum Vinyl Bag
X X X X X X – X X
8
PART NO. :
QUANTITY : ###
LOT NUMBER : ##########
1
2
3
4
5
6
7
X X10 X11 X12 X13
BIN CODE :
9
For more information about binning and labeling, refer to the Application Note -1
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Outline Dimensions
1. Dome Type
9.8
(MAX)
Slug (+)
Cathode
Mark
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
3. Slug of package is connected to anode.
*The appearance and specifications of the product may be changed for improvement without
notice.
3
Rev 10 – 2007 / 08
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PCB Type Outline Dimensions
-
-
+
+
-
+
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
*The appearance and specifications of the product may be changed for improvement without
notice.
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Characteristics for Z-Power LED
1. Pure White (W10491, W10492)
1-1 Electro-Optical characteristics at IF=1400mA, TA=25ºC
Value
Typ
178
6300
70
Parameter
Symbol
Unit
Min
154
-
Max
Luminous Flux [1]
Correlated Color Temperature [3]
CRI
ФV
-
-
lm
K
[2]
CCT
Ra
-
-
-
Forward Voltage [4]
VF
3.0
3.5
4.0
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
110
4
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
2.5
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
1.6
6.4
A
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
*Notes :
PD
Tj
W
ºC
ºC
ºC
-
125
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
±20,000V HBM
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
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3. Warm White (N10491, N10492)
3-1 Electro-Optical characteristics at IF=1400mA, TA=25ºC
Value
Typ
120
3000
80
Parameter
Symbol
Unit
Min
91
-
Max
[2]
Luminous Flux [1]
Correlated Color Temperature [3]
CRI
ФV
-
-
lm
K
CCT
Ra
-
-
-
Forward Voltage [4]
VF
3.0
3.5
4.0
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
110
4
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
2.5
3-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
Power Dissipation
IF
PD
Tj
1.6
6.4
A
W
ºC
ºC
ºC
-
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
125
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
6
Rev 10 – 2007 / 08
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Color spectrum, TA=25ºC
1. Pure White
1 .0
S ta n d a rd e ye re s p o n s e c u rv e
0 .8
0 .6
0 .4
0 .2
0 .0
3 0 0
4 0 0
5 0 0
6 0 0
7 0 0
8 0 0
9 0 0
W a v e le n g th ( n m )
2. Warm White
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
3 0 0
4 0 0
5 0 0
6 0 0
7 0 0
8 0 0
9 0 0
W a v e le n g t h ( n m )
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Forward Current Characteristics
1. Forward Voltage vs. Forward Current, TA=25℃
1000
Pure White, Warm White
800
600
400
200
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Forward Voltage [V]
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2. Forward Current vs. Normalized Relative Luminous Flux, TA=25℃
1.0
Pure White, warm white
0.8
0.6
0.4
0.2
0.0
0
200
400
600
800
1000
1200
1400
Forward current(IF)
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3. Forward Current vs Chromaticity coordinate TA=25℃
Pure white
0.350
1400mA
1000mA
700mA
0.345
0.340
0.335
0.330
350mA
150mA
10mA
0.310
0.315
0.320
0.325
0.330
CIE(X)
Warm white
0.410
0.405
0.400
0.395
0.390
1400mA
1000mA
700mA
350mA
150mA
10mA
0.417
0.420
0.423
CIE(X)
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Typical Dome Type Radiation pattern
1. Pure White, Warm White
0
1.0
30
0.8
0.6
0.4
0.2
0.0
60
90
-80
-60
-40
-20
0
Directional angle (deg.)
11
Rev 10 – 2007 / 08
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Ambient Temperature vs Allowable Forward Current
1. Pure White, Warm White
(TJMAX = 125 ºC)
2000
1500
1000
RjaT = 20 oC / W
RjaT = 15 oC / W
500
RjaT = 10 oC / W
0
0
20
40
60
80
100
120
140
Ambient Temperature TA (oC)
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Recommended Soldering
1. Solder pad
3 solder point
Thermal enhanced PCB
<Rear view>
Copper
2. Solder paste pattern
1. Paste thickness : 0.2mm
Note :
1. All dimensions are in millimeters (tolerance : ±0.2 )
2. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
13
Rev 10 – 2007 / 08
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Soldering profile, TA=25ºC
1. Reflow Soldering Conditions / Profile
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Cooling
-5 °C/sec
Rising
5 °C/sec
Pre-heating
180
150
0
Time
[Hr]
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered. When
repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
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Rev 10 – 2007 / 08
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Rectangular Type Reel Packaging - Rectangular type
10 pitch cumlative
tolerance on tape ±0.2
MIN 1.5
CENTER
DETALE"A"
5°TYPICAL
DETAIL 'A'
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
15
Rev 10 – 2007 / 08
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Rectangular Type Reel Packaging - Star type
10 pitch cumlative
tolerance on tape ±0.2
MIN 1.5
CENTER
DETALE"A"
5°TYPICAL
DETAIL 'A'
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
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Rev 10 – 2007 / 08
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Packaging Structure
Aluminum Vinyl Bag
PART NO. : ######-##
QUANTITY : 100
LOT NO. : ##########
BIN CODE NO. : #####
SEOUL SEMICONDUCTOR CO., LTD
Outer Box
SIZE(mm)
TYPE
a
c
b
350 350 370
c
Z POWER LED
PART NO. : ######-##
ORDER CODE : ######
Q'YT : ######
Z POWER LED
DATE : ######
SEOUL SEMICONDUCTOR CO.,LTD
b
a
Printed label on back of aluminum PCB
######-##-###
######-#####
Part No. - Internal No. - Bin Code
Lot No.
Note :
1. 6 reels are loaded in box
2. Scale none
3. For more information about binning and labeling, refer to the Application Note - 1
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Rev 10 – 2007 / 08
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Precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
(or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30
degrees Centigrade. Humidity 50% maximum.
• Precaution after opening packaging
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed.
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
components should be dried for 10-12hr at 60±5℃
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Anti radioactive ray design is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA(Isopropyl Alcohol) should be used.
• When the LEDs are illuminating, operating current should be decided after considering the
package maximum temperature.
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is connected to the anode. Therefore, we recommend to isolate the heat sink.
• Attaching LEDs, don’t use adhesives to generate organic vapor.
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Rev 10 – 2007 / 08
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Handling of Silicone resin LEDs
Z-Power LED is encapsulated by silicone resin for the highest flux efficiency.
Notes for handling of Silicone resin Z-Power LEDs
• Avoid touching silicone resin parts especially by sharp tools such as Tweezers
• Avoid leaving fingerprints on silicone resin parts.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on
the surface of the resin must be prevented.
• Please do not mold over the silicone lens with another resin.
(epoxy, urethane, etc)
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