W42180-07 [SEOUL]
Single Color LED,;
| 型号： | W42180-07 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Single Color LED, 光电 |
| 文件： | 总29页 (文件大小：3861K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
X42180-07
X42180-07
Features
• Super high flux output
and high luminance
• Designed for high
current operation
Z-Power series is designed for
high current operation and
high flux output applications.
• Low thermal resistance
• SMT solderable
Z-Power LED's thermal performance
exceeds other power LED solutions.
• Lead free product
• RoHS compliant
It incorporates state of the art SMD design and Thermal
emission material.
Applications
• Mobile phone flash
Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive and
large LCD backlights.
• Automotive interior /
Exterior lighting
• Automotive signal lighting
• Automotive forward
lighting
• Torch
• Architectural lighting
• LCD TV / Monitor backlight
• Projector light source
• Traffic signals
• Task lighting
• Decorative / Pathway
lighting
• Remote / Solar powered
lighting
• Household appliances
*The appearance and specifications of the product may be changed
for improvement without notice.
Rev. 20
FEBRUARY. 2013
1
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Full Code of Z-Power LED Series
Full code form : X1 X2 X3 X4 X5 X6 X7 – X8 X9 – X10 X11 X12 X13X14
1. Part Number
- X1 : Color
- X2 : Z-Power LED series number
- X3 : LENS type
- X4 : Chip quantity (or Power Dissipation)
- X5 : Package outline size
- X6 : Type of PCB
- X7 : Grade of characteristic code
2. Internal Number
- X8, X9 : Revision No.
3. Code Labeling
- X10 : Luminous flux (or Radiant flux for royal blue)
- X11 X12 X13 : Dominant wavelength (or x,y coordinates rank code)
- X14 : Forward voltage
4. Sticker Diagram on Reel & Aluminum Vinyl Bag
RANK :
X10X11X12X13X14
QUANTITY : 500
LOT NUMBER : XXXXXXXXXX-XXX-XXX-XXXXXXX
SSC PART NUMBER : XXXXXXX-XX
X1X2X3X4X5X6X7-X8X9
For more information about binning and labeling, refer to the Application Note -1
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
2
Document No. : SSC-QP-7-07-24 (Rev.00)
Outline Dimension
1. Dome Type
SLUG
Cathode Mark
Lens
Body
Lead
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
3. Slug of package is connected to anode.
*The appearance and specifications of the product may be changed for improvement without
notice.
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
3
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
1. Pure White (W42180-07)
1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
80
Parameter
Symbol
Unit
Min
70
91
-
Max
[2]
T rank
U rank
ФV
91
lm
lm
Luminous Flux [1]
[2]
ФV
108
6300
73
118.5
Correlated Color Temperature [3]
CRI
CCT
Ra
-
-
-
K
-
-
Forward Voltage [4]
View Angle
VF
-
3.1
V
2Θ ½
RθJ-B
RθJ-C
127
10.1
8.5
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
Pd
Tj
3.28
145
W
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance.
[4] A tolerance of 0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC TJ 110 ºC)
RθJ-C is measured with only emitter.(25 ºC TJ 110 ºC)
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink.
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
4
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
2. Warm White (N42180-07)
2-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
72
Parameter
Symbol
Unit
Min
Max
Luminous Flux [1]
Correlated Color Temperature [3]
CRI
ФV
-
-
-
-
-
-
-
-
lm
K
[2]
CCT
Ra
3000
93
-
Forward Voltage [4]
View Angle
VF
3.1
V
2Θ 1/2
RθJ-B
RθJ-C
126
10.1
8.5
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
2-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
Pd
800
3.28
mA
W
Power Dissipation
145
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
Tj
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance
[4] A tolerance of 0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC TJ 110 ºC)
RθJ-C is measured with only emitter.(25 ºC TJ 110 ºC)
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
5
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
3. Warm White (N42180H-07)
3-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
90
Parameter
Symbol
Unit
Min
Max
Luminous Flux [1]
Correlated Color Temperature [3]
CRI
ФV
-
-
-
-
-
-
-
-
lm
K
[2]
CCT
Ra
3000
80
-
Forward Voltage [4]
View Angle
VF
3.1
V
2Θ 1/2
RθJ-B
RθJ-C
127
10.1
8.5
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
3-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
Pd
800
3.28
mA
W
Power Dissipation
145
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
Tj
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an iintegrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance
[4] A tolerance of 0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC TJ 110 ºC)
RθJ-C is measured with only emitter.(25 ºC TJ 110 ºC)
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
6
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
4. Natural White (S42180-07)
4-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
76
Parameter
Symbol
Unit
Min
Max
Luminous Flux [1]
Correlated Color Temperature [3]
CRI
ФV
-
-
-
-
-
-
-
-
lm
K
[2]
CCT
Ra
4000
93
-
Forward Voltage [4]
View Angle
VF
3.1
V
2Θ 1/2
RθJ-B
RθJ-C
126
10.1
8.5
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
4-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
Pd
800
3.28
145
mA
W
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
Tj
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance.
[4] A tolerance of 0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC TJ 110 ºC)
RθJ-C is measured with only emitter. (25 ºC TJ 110 ºC)
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
7
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
5. Natural White (S42180H-07)
5-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
98
Parameter
Symbol
Unit
Min
Max
Luminous Flux [1]
Correlated Color Temperature [3]
CRI
ФV
-
-
-
-
-
-
-
-
lm
K
[2]
CCT
Ra
4000
80
-
Forward Voltage [4]
View Angle
VF
3.1
V
2Θ 1/2
RθJ-B
RθJ-C
127
10.1
8.5
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
5-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
Pd
800
3.28
145
mA
W
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
Tj
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance.
[4] A tolerance of 0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC TJ 110 ºC)
RθJ-C is measured with only emitter. (25 ºC TJ 110 ºC)
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
8
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
6. Blue (B42180-07)
6-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
22
Parameter
Symbol
Unit
Min
-
Max
Luminous Flux [1]
Dominant Wavelength[3]
Forward Voltage [4]
View Angle
ФV
-
475
-
lm
nm
[2]
D
VF
455
-
465
3.2
V
2Θ 1/2
RθJ-B
RθJ-C
130
10.1
8.5
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
6-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
Pd
Tj
3.28
145
W
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of 0.5nm for dominant wavelength
[4] A tolerance of 0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC TJ 110 ºC)
RθJ-C is measured with only emitter.(25 ºC TJ 110 ºC)
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are in risk group2(Medium) according to IEC 62471
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
9
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
7. Royal Blue (D42180-07)
7-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
468
457
3.2
Parameter
Symbol
Unit
Min
-
Max
Radiant Power [1]
Dominant Wavelength [3]
Forward Voltage [4]
View Angle
ФV
-
460
-
mW
nm
[2]
D
VF
455
-
V
2Θ 1/2
RθJ-B
RθJ-C
130
10.1
8.5
deg.
ºC /W
ºC /W
Thermal resistance [5]
Thermal resistance [6]
7-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [7]
Pd
Tj
3.28
145
W
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total Radiant power output as measured with anintegrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance
[4] A tolerance of 0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC TJ 110 ºC)
RθJ-C is measured with only emitter.(25 ºC TJ 110 ºC)
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are in risk group2(Medium) according to IEC 62471
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
10
Document No. : SSC-QP-7-07-24 (Rev.00)
Characteristics for Z-Power LED
8. Photosynthetic Red (P42180-07)
11-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
240
660
2.4
Parameter
Symbol
Unit
Min
150
655
2.0
Max
280
665
3.0
Radiant Power [1]
Peak Wavelength[3]
Forward Voltage [4]
View Angle
ФV
mW
nm
[2]
P
VF
V
2Θ 1/2
RθJ-C
130
9
deg.
ºC /W
Thermal resistance [5]
11-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
Pd
700
2.1
mA
W
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity [6]
Tj
125
ºC
ºC
ºC
-
Topr
Tstg
-
-40 ~ +85
-40 ~ +100
±10,000V HBM
*Notes :
[1] SSC maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total Radiant power output as measured with an integrating sphere.
[3] Peak wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of 1nm for peak wavelength
[4] A tolerance of 0.06V on forward voltage measurements
[5] RθJ-C is measured with only emitter.
[6] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
11
Document No. : SSC-QP-7-07-24 (Rev.00)
Color Spectrum, TA=25ºC
1. Pure White(W42180-07)
1.0
Standard eye response curve
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
900
Wavelength (nm)
2. Warm White (N42180-07)
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
900
Wavelength (nm)
Rev. 20
FEBRUARY. 2013
12
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Color Spectrum, TA=25ºC
3. Warm White (N42180H-07)
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
900
Wavelength (nm)
4. Natural White (S42180-07)
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
900
Wavelength (nm)
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
13
Color Spectrum, TA=25ºC
5. Natural White (S42180H)
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
900
Wavelength (nm)
6. Blue(Royal Blue), Photosynthetic Red
1.0
B 421 80
P 421 80
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
W avelength (nm )
Rev. 20
FEBRUARY. 2013
14
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Junction Temperature Characteristics
1. Relative Light Output vs. Junction Temperature at IF=350mA
120
100
80
60
40
Natural White, Warm White
Pure White
Blue(Royal Blue)
20
0
25
50
75
100
125
Junction Temperature(OC)
100
80
60
40
20
0
P42180
25
50
75
100
125
Junction Temperature [oC]
Rev. 20
FEBRUARY. 2013
15
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Junction Temperature Characteristics
2. Forward Voltage Shift vs. Junction Temperature at IF=350mA
0.0
-0.2
-0.4
-0.6
-0.8
Pure White, Warm White, Natural White, Blue (Royal Blue)
P42180
-1.0
25
50
75
100
125
Junction Temperature [OC]
3. Wavelength Shift vs Junction Temperature at IF=350mA
12
Blue(Royal Blue)
10
8
6
4
2
0
25
50
75
100
125
Junction Temperature[oC]
Rev. 20
FEBRUARY. 2013
16
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current Characteristics
1. Forward Voltage vs. Forward Current , TA=25 ºc
800
Blue(Royal Blue), Green, Pure White
Warm White, Natural White
600
400
200
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Forward Voltage [V]
700
P42180
600
500
400
300
200
100
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Forward Voltage [V]
Rev. 20
FEBRUARY. 2013
17
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current Characteristics
2. Forward Current vs. Normalized Relative Luminous Flux, TA=25 ºc
2.5
Blue(Royal Blue), Green, Pure White
Warm White, Natural White
2.0
1.5
1.0
0.5
0.0
0
200
400
600
800
Forward Current [mA]
2.5
2.0
1.5
1.0
0.5
0.0
P42180
200
400
600
Forward Current [mA]
Rev. 20
FEBRUARY. 2013
18
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current Characteristics
3. Forward Current vs Wavelength Shift, TA=25 ºc
8
Blue(Royal Blue)
6
4
2
0
-2
-4
0
100
200
300
400
500
600
700
800
900
1000
Forward current(mA)
8
6
P42180
4
2
0
-2
-4
100
200
300
400
500
600
700
Forward current(mA)
Rev. 20
FEBRUARY. 2013
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
19
Ambient Temperature vs Allowable Forward Current
1-1. Pure White, Warm White, Natural White, Blue(Royal Blue)
(TJMAX = 145 ºC, @350mA)
400
350
300
250
RjaT = 60oC/W
RjaT = 50oC/W
200
RjaT = 40oC/W
150
RjaT = 30oC/W
100
50
0
0
25
50
75
100
125
150
Ambient Temperature [oC]
1-2. Pure White, Warm White, Natural White, Blue(Royal Blue)
(TJMAX = 145 ºC, @700mA)
800
700
600
500
RjaT = 40oC/W
RjaT = 30oC/W
400
RjaT = 20oC/W
300
200
100
0
0
25
50
75
100
125
150
Ambient Temperature [oC]
Rev. 20
FEBRUARY. 2013
20
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Ambient Temperature vs Allowable Forward Current
1-3. Photosynthetic Red (TJMAX = 125 ºC, at 350mA)
400
300
RjaT = 60oC/W
200
RjaT = 50oC/W
RjaT = 40oC/W
100
RjaT = 30oC/W
0
0
25
50
75
100
125
Ambient Temperature [oC]
1-4. Photosynthetic Red (TJMAX = 125 ºC, @700mA)
800
700
600
500
400
RjaT = 50oC/W
300
RjaT = 40oC/W
RjaT = 30oC/W
200
100
RjaT = 20oC/W
0
0
25
50
75
100
125
Ambient Temperature [oC]
Rev. 20
FEBRUARY. 2013
21
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Typical Dome Type Radiation pattern
1. Pure White
0
1.0
0.8
0.6
0.4
0.2
0.0
30
60
90
-90
-75
-60
-45
-30
-15
0
Angle(deg.)
2. Warm White, Natural White
0
1.0
0.8
0.6
0.4
0.2
0.0
30
60
90
-90
-75
-60
-45
-30
-15
0
Angle(deg.)
Rev. 20
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Document No. : SSC-QP-7-07-24 (Rev.00)
Typical Dome Type Radiation pattern
3. Blue(Royal Blue)
0
1.0
0.8
0.6
0.4
0.2
0.0
30
60
90
-80
-60
-40
-20
0
Angle(deg.)
4. Photosynthetic Red
0
1.0
0.8
0.6
0.4
0.2
0.0
30
60
90
-90
-75
-60
-45
-30
-15
0
Angle(deg.)
Rev. 20
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Document No. : SSC-QP-7-07-24 (Rev.00)
Recommended Solder pad
1. Solder pad
2. Solder paste pattern
Note :
1. All dimensions are in millimeters (tolerance : ±0.2 )
2. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
Rev. 20
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Document No. : SSC-QP-7-07-24 (Rev.00)
3. Reflow Soldering Conditions / Profile
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
260
240
220
200
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
Cooling
-5 °C/sec
Rising
5 °C/sec
Pre-heating
180
150
0
Time
[Hr]
4. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable, suitable tools have to be used.
3. The bottom of the emiter is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Rev. 20
FEBRUARY. 2013
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Document No. : SSC-QP-7-07-24 (Rev.00)
Emitter Type Reel Packaging
Note :
1. The number of loaded products in the reel is 500ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
Rev. 20
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Document No. : SSC-QP-7-07-24 (Rev.00)
Packaging Structure
Aluminum Vinyl Bag
PART NO. : ######-##
QUANTITY : ***
LOT NUMBER : #######-#######
BIN CODE : #######
Outer Box
SIZE(mm)
TYPE
a
c
b
350 350 370
c
ZLED
PART : W42180-**
ZLED
PO CODE : ##
Q'YT : ######
LOT NO : YMDD-#####
DATE : ######
b
SEOUL SEMICONDUCTOR CO.,LTD
a
Note :
1. 6~10 reels are loaded in box
2. Scale none
3. For more information about binning and labeling, refer to the Application Note - 1
Rev. 20
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Document No. : SSC-QP-7-07-24 (Rev.00)
precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
(or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30
degrees Centigrade. Humidity 50% maximum.
• Precaution after opening packaging
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed.
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
components should be dried for 10-12hr at 60±5℃
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Anti radioactive ray design is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA(Isopropyl Alcohol) should be used.
• When the LEDs are illuminating, operating current should be decided after considering the
package maximum temperature.
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should
be used for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is connected to the anode. Therefore, we recommend to isolate the heat sink.
Rev. 20
• Attaching LEDs, don’t use adhesives to generate organic vapor.
FEBRUARY. 2013
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Document No. : SSC-QP-7-07-24 (Rev.00)
Handling of Silicone resin LEDs
Z-Power LED is encapsulated by silicone resin for the highest flux efficiency.
Notes for handling of Silicone resin Z-Power LEDs
• Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers)
• Avoid leaving fingerprints on silicone resin parts.
• Dust sensitivity silicone resin need containers having cover for storage.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on
the surface of the resin must be prevent.
• Please do not force over 2000 gf impact or pressure diagonally on the silicon lens.
It will cause fatal damage of this product
• Please do not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
Please do not mold this product into another resin (epoxy, urethane, etc) and do not
handle this product with acid or sulfur material in sealed space.
Rev. 20
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Document No. : SSC-QP-7-07-24 (Rev.00)
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