YE101-IG0 [SEOUL]
Single Color LED, Yellow, Untinted Diffused, 1.2mm, 1.60 X 0.80 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, LEADLESS, PLASTIC PACKAGE-2;
| 型号： | YE101-IG0 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Single Color LED, Yellow, Untinted Diffused, 1.2mm, 1.60 X 0.80 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, LEADLESS, PLASTIC PACKAGE-2 光电 |
| 文件： | 总12页 (文件大小：413K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
YE101-IG0
CUSTOMER
Checked by
Approved by
SUPPLIER
Drawn by
Approved by
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
CONTENTS
1. Description
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Electro-optical characteristic diagram
5. Rank
6. Material
7. Outline Dimension
8. Packing
9. Soldering
10. Precaution for use
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
YE101-IG0
YE101-IG0
1. Description
Features
• 1.6 X 0.8 X 0.8 mm
-
-
-
Small size suitable for compact
• Untinted, Diffused flat mold
• Dominant Wavelength: 586nm
appliances
Surface-mounted and leadless chip
LED device
High brightness, wide variety of colors
are available
-
-
Tape and Reel packing
Increases the life time of battery
Applications
• Cellular phone’s
keypad lightning
• Other decoration
lighting
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
(Ta=25℃)
2. Absolute maximum ratings
Parameter
Symbol
Value
66
Unit
Power Dissipation
Forward Current
Pd
IF
mW
mA
mA
V
30
*1
Peak Forward Current
Reverse Voltage
IFM
100
VR
5
Operation Temperature
Storage Temperature
Topr.
Tstg.
-35 ~ 85
-40 ~ 100
℃
℃
*1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10
(Ta=25℃)
3. Electro-Optical Characteristics
Parameter
Symbol
Condition
IF=20 ㎃
VR=5V
Min
1.9
-
Typ
2.1
-
Max
2.2
10
Unit
V
Forward Voltage
Reverse Current
VF
IR
㎂
Luminous Intensity*2
Wavelength
IV
λd
IF=20 ㎃
IF=20 ㎃
IF=20 ㎃
47
583
-
70
586
30
110
590
-
mcd
nm
Spectral Bandwidth
Δλ
nm
Viewing Angle*3
2θ1/2
IF=20 ㎃
-
120
-
˚
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the
LED package.
*3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at
20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
(Tolerance : Iv ±10 %, λd ±2 nm, VF ±0.1 V)
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
4. Electro-Optical characteristic Diagram
Relative Luminous Intensity vs
Forward Current
Forward Current vs. Forward Voltage
100
140
120
100
80
10
60
40
1
20
0
0
5
10
15
20
25
30
35
0.1
1.7
Forward Current IF(mA)
1.8
1.9
2.0
2.1
2.2
2.3
2.4
Forward Votage V (V)
F
Ambient Temperature vs.
Allowable Forward Current
Radiation Diagram
30
20
10
0
90
120
60
150
30
180
0
0
20
40
60
80
100
Ambient temperature Ta(o&)
Rev.00
December 2010
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Document No. : SSC-QP-7-07-24 (Rev.00)
Spectrum
1.0
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength [nm]
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
5. Rank
IV
[mcd]
VF
[V]
Wd
[mcd]
Rank
47-70
70-110
47-70
1.9-2.2
1.9-2.2
1.9-2.2
1.9-2.2
1.9-2.2
1.9-2.2
583-586
583-586
586-588
586-588
588-590
588-590
05
06
07
08
09
10
70-110
47-70
70-110
6.Metarial
Item
PCB
chip
AlInGaP
wire
Gold
Encapsulate
Epoxy
Electrode
Au
Material
BT-Resin
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
7.Outline Dimension
( Tolerance: ±0.1, Unit: mm )
Polarity Mark
0.8
[Recommended Solder Pattern]
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
8. Packing
Tolerance: ±0.2, Unit: ㎜
(1) Quantity:4,000pcs./Reel
(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is
turned off from the carrier tape at10˚angle to be the carrier tape.
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
● Reel Packing Structure
Reel
RANK:
##
QUANTI TY: 4000
LOT NUMBER: ##########
SSCPART NUMBER: YE101-I G0
YE101-IG0
Aluminum Vinyl Bag
RANK:
##
QUANTI TY: 4000
LOT NUMBER: ##########
SSCPART NUMBER: YE101-I G0
YE101-IG0
Outer Box
*Material: Paper(SW3B(B))
SIZE(mm)
TYPE
a
c
b
7inch
245 220 142
c
CHIP LED
TUV
MADE IN KOREA
PART : YE101-IG0
CODE
:
Acriche
Q'YT : 40,000EA
LOT NO :
Semiconductor EcoLight
RoHS
DATE
:
b
SEOUL SEMICONDUCTOR CO.,LTD
a
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
9 . Soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
120~150 C
120 sec.
Max.
o
60sec. Max.
Above 200 C
2.5~5 C / sec.
o
Pre-heat time
Peak-Temperature
240℃ Max.
120sec. Max.
Soldering time
Condition
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
120 sec.
Max.
o
60sec. Max.
Above 220 C
o
150~200
C
1~5 C / sec.
o
Pre-heat time
Peak-Temperature
260℃ Max.
120sec. Max.
Soldering time
Condition
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
10. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : Max 30ºC
Humidity : Max 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in
followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
Rev.00
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
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