YGHR411-H [SEOUL]
Surface-mounted chip LED device; 表面贴装芯片LED器件
| 型号： | YGHR411-H |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Surface-mounted chip LED device |
| 文件： | 总13页 (文件大小：310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pb Free
Specification
YGHR411-H
SSC
Customer
Drawn
Approval
Approval
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
[ Contents ]
1. Description
2. Absolute maximum ratings
3. Electro-Optical characteristics
4. Characteristic diagrams
5. Reliability result
6. Rank
7. Outline Dimension
8. Material
9. Reel Structure
10. Packing
11. Soldering profile
12. Precaution for Use
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
YGHR411-H
YGHR411-H
1. Description
Features
- Small size suitable for compact
appliances.
• 1.6 X 1.5 X 0.5 mm
• Untited, Diffused flat mold
• Wavelength :
- Surface-mounted chip LED
device.
-. YG : 572 nm
- Pb-free and RoHS complaint
component.
-. HR : 620 nm
- High brightness, High efficiency
- Tape and Reel packing.
Applications
- Increases the life time of battery.
ꢀ Cellular phone’s keypad
lightning
ꢀ Information Boards
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
2. Absolute maximum ratings
(Ta=25 )
Unit
Parameter
Symbol
Value
Power Dissipation
Forward Current
Pd
IF
72
30
mW
mA
mA
V
*1
Peak Forward Current
Reverse Voltage
IFM
100
VR
5
Operating Temperature
Storage Temperature
Topr.
Tstg.
-40 ~ 85
-40 ~ 100
*1 IFM conditions: Pulse width Tw 1msec and Duty ratio 1/10.
3. Electro-Optical Characteristics
(Ta=25 )
Parameter
Symbol
Condition
color
Min
Typ
Max
Unit
YG
HR
YG
HR
YG
HR
YG
HR
YG
HR
YG
HR
1.9
1.85
-
2.0
2.0
-
2.4
2.4
10
10
65
140
576
625
-
Forward
Voltage
VF
IF=20
V
Reverse
Current
IR
IV
VR=5V
IF=20
-
-
35
60
568
610
-
55
Luminous
mcd
nm
nm
˚
Intensity*2
100
572
620
15
IF=20
IF=5
Wavelength
D
Spectral
Bandwidth
IF=20
IF=20
-
15
-
-
120
120
-
Viewing
Angle*3
2
1/2
-
-
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the
mechanical axis of the LED package.
*3 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] Tolerance : Iv
10%,
2nm, , VF
0.1V
D
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
4. Characteristic Diagrams
Ta = 25o
Forward Current vs.
Forward Voltage
Relative Luminous Intensity
vs. Forward Current
140
120
100
80
10
60
1
40
20
0.1
1.7
0
5
10
15
20
25
30
35
1.8
1.9
2.0
2.1
Forward Voltage V (V)
F
Forward Current vs.
Ambient Temperature (per die)
Spectrum
40
30
20
10
0
1.0
0.8
0.6
0.4
0.2
0.0
-25
0
25
50
75
100
300
400
500
600
700
800
Ambient temperature Ta(o
C)
Wavelength [nm]
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
Radiation Diagram
Ta = 25o
90
120
60
150
30
180
0
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
5. Reliability Test
Number Of
Damaged
Duration
/ Cycle
Item
Test Conditions
Operating at
Room
temperature
20mA, @25
500 hrs
500 hrs
500 hrs
100 cycle
1 time
0/22
0/22
0/22
0/22
0/22
Operating at High
temperature
20mA, @85
Operating at High
temperature
/ High humidity
20mA, @60 ,90%
Thermal shock
test
-40~85 Shift (2hr/cycle)
85 , 85% 24hrs ꢁ Reflow 3 times
(Max 260 10sec) ꢁ Thermal shock
30 cycle
Thermal
resistance
Test
MSL : 2a (30 , 60% : 4 weeks)
*Criterion
OK
> Initial value * 0.5
Initial value 0.1V
Iv
VF
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
6. Rank
IF = 20mA
IV[mcd]
VF[V]
Yellow
Wd[nm]
RANK
Yellow
Red
Red
Yellow
Red(5mA)
60~95
C
B
35~65
1.9~2.4
1.85~2.4
568~476
610~625
95~140
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
7. Outline Dimension
Tolerance 0.1, Unit :
(0.18)
Resin
1.5
0.2
Marking
2
1
4
3
PCB
0.5
0.2
0.6
0.8
Cathode
2
4
YG
HR
1
3
0.2
Anode
1.8
[ Recommended Solder Pattern]
8. Material
Item
Substrate
Chip (YG/HR)
wire
Encapsulate
Epoxy
Electrode
Material
BT-Resin PCB
AlInGaP
Gold
Au Plated
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
9. Reel Structure
0.1
4.0
0.05
+0.1
- 0
2.0
0.05
1.5
0.2
0.05
0.05
0.1
0.5
4.0
1.73
0.05
0.7
11.4
+0
- 3
180
0.3
9
0.2
2
22
0.2
13
Label
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10 angle to be the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a
damp proof Package
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
10. Packing
Reel
RANK:
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
# # # #
# # #
DESI PAK
Aluminum Vinyl Bag
# # #
# # #
# # # # # # #
RANK:
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
SIDE
1
RANK:
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
c
1
2
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
RoHS
b
a
SIDE
2
LOT NUMBER
Rank
QTY
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
11. Soldering profile
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
Pre-heat
120~150
240 C Max.
10 sec. Max.
Pre-heat time
Peak-Temperature
120 sec. Max.
240 Max.
Pre-heating
o
60sec. Max.
Above 200 C
120~150 C
2.5~5 C / sec.
o
Soldering time
Condition
120sec. Max.
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
o
1~5 C / sec.
Pre-heat
150~200
260 C Max.
10 sec. Max.
Pre-heat time
Peak-Temperature
120 sec. Max.
260 Max.
Pre-heating
o
60sec. Max.
Above 220 C
o
150~200 C
1~5 C / sec.
o
Soldering time
Condition
120sec. Max.
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process,
we don’t guarantee the products.
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
12. Precaution for Use
(1) Storage
LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more
after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is
recommended. To avoid absorption of moisture, it is recommended to store in a dry box
(or a desiccator) with a desiccant.
* Shelf Life : 12 months at < 40ºC and 90%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. After opened and
mounted the soldering shall be quickly.
* Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or
Stored at < 10% RH
(3) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(4) In the case of change color of indicator on desiccant, components shall be dried
10-12hr at 60 5ºC.
(5) When the LED is operating, the driving current should be determined after considering
the maximum ambient temperature requirements.
(6) When using multiple LEDs, It is recommended to connect a resistor on each LED.
Otherwise, LEDs may vary due to variation in forward voltage of the LEDs.
(7) The driving circuit must be designed to allow forward voltage only when it is ON or
OFF. If the reverse voltage is applied to LED, migration can be generated resulting
in LED damage
(8) Any mechanical force or excessive vibration should be avoided during temperature
cooling process to normal temperature after reflow.
(9) Rapid cooling shall be avoided.
(10) LED should not be placed on a flexible area on the PCB.
(11) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(12) Anti radioactive ray design is not considered for the products.
(13) Damage prevention from ESD or Surge.
It is highly recommended to use the wrist-band or anti electrostatic gloves when handling
the LED’s All devices, equipments and machines mush be properly grounded
(14) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
: SSC- QP- 7- 07- 25 (Rev.0.0)
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