SGM3140 [SGMICRO]

500mA Buck/Boost Charge Pump LED Driver;


型号：	SGM3140
厂家：	Shengbang Microelectronics Co, Ltd
描述：	500mA Buck/Boost Charge Pump LED Driver
文件：	总10页 (文件大小：704K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SGM3140

500mA Buck/Boost

Charge Pump LED Driver

GENERAL DESCRIPTION

FEATURES

The SGM3140 is a current-regulated buck/boost

charge pump LED driver capable of driving 500mA

output current. It is ideal for powering high brightness

LEDs for camera flash applications. The SGM3140 has

1×/2× operation mode to control the output current for

flash and torch modes.

● Input Voltage Range: 2.7V to 5.5V

● Up to 500mA Output Current

● Up to 90% Efficiency in Torch Mode

● Programmable Flash Current

● Automatic Buck/Boost Mode Conversion

● No External Inductors

● High Switching Frequency: 2.2MHz

● Low Reference for Low Loss Sensing: 47mV

● Less than 1μA Shutdown Current

● Automatic Soft-Start for Reducing Inrush Current

● Low Input and Output Ripple and Low EMI

● Protection Features

The supply voltage operates from 2.7V to 5.5V and is

well suited for various applications powered by a 1-cell

Li-Ion battery, as well as 3-cell or 4-cell NiCd, NiMH or

Alkaline batteries. The SGM3140 automatically converts

between boost and buck modes. Therefore, it ensures

that LED current cannot be restricted by the forward

voltage. High switching frequency makes it easy to use

tiny components. Small 0603 current sense resistors

can be used due to the low FB reference voltage.

 Output Over-Voltage Protection

 Over-Current Protection

 Thermal Shutdown

● Available in a Green TDFN-3×3-10L Package

The SGM3140 provides very low shutdown current and

soft-start function. Built-in soft-start circuitry avoids

excessive inrush current during startup. The SGM3140

also includes a comprehensive set of protection

features such as over-voltage protection, over-current

protection and thermal shutdown.

APPLICATIONS

White LED Torch or Flash for Cell

Phones, Camcorders and DSCs

Generic Lighting, Strobe and Flash Applications

White LED Backlighting

The SGM3140 is available in a Green TDFN-3×3-10L

package and is specified over an ambient temperature

range of -40℃ to +85℃.

General Purpose High Current Boost

TYPICAL APPLICATION

V_IN

VOUT

VIN

2.7V to 5.5V

C_IN

4.7µF

C_OUT

1µF

PGND

C_F

1µF

WLED

SGM3140

SGND

Torch Mode/Flash Mode

Enable

FLASH

RSET

R_SET

86.6kΩ

R_SENSE

0.33Ω

Figure 1. Typical Application Circuit

SG Micro Corp

OCTOBER2012–REV. A. 2

www.sg-micro.com

500mA Buck/Boost

SGM3140

Charge Pump LED Driver

PACKAGE/ORDERING INFORMATION

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

DESCRIPTION

ORDERING

NUMBER

PACKAGE

MARKING

PACKING

OPTION

MODEL

SGM

3140D

XXXXX

SGM3140

TDFN-3×3-10L

SGM3140YD10G/TR

Tape and Reel, 3000

-40℃ to +85℃

MARKING INFORMATION

NOTE: XXXXX = Date Code and Vendor Code.

X X X X X

Vendor Code

Date Code - Week

Date Code - Year

Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If

you have additional comments or questions, please contact your SGMICRO representative directly.

ABSOLUTE MAXIMUM RATINGS

ESD SENSITIVITY CAUTION

V_IN, V_OUT, C2........................................................ -0.3V to 6V

EN, C1, FLASH, FB, RSET Pins...............-0.3V to V_IN+ 0.3V

Output Current Pulse (Flash)..........................................0.8A

Output Current Continuous (Torch) ................................0.4A

Package Thermal Resistance

This integrated circuit can be damaged if ESD protections are

not considered carefully. SGMICRO recommends that all

integrated circuits be handled with appropriate precautions.

Failureto observe proper handlingand installation procedures

can cause damage. ESD damage can range from subtle

performance degradation tocomplete device failure. Precision

integrated circuits may be more susceptible to damage

because even small parametric changes could cause the

device not to meet the published specifications.

TDFN-3×3-10L, θ_JA.................................................... 57℃/W

Operating Temperature Range.......................-40℃ to +85℃

Junction Temperature.................................................+150℃

Storage Temperature Range.......................-40℃ to +150℃

Lead Temperature (Soldering, 10s)............................+260℃

ESD Susceptibility

DISCLAIMER

HBM (EN Pin) ..............................................................1000V

HBM (All Other Pins) ...................................................2000V

MM.................................................................................200V

SG Micro Corp reserves the right to make any change in

circuit design, or specifications without prior notice.

OVERSTRESS CAUTION

Stresses beyond those listed in Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to

absolute maximum rating conditions for extended periods

may affect reliability. Functional operation of the device at any

conditions beyond those indicated in the Recommended

Operating Conditions section is not implied.

SG Micro Corp

www.sg-micro.com

OCTOBER 2012

500mA Buck/Boost

SGM3140

Charge Pump LED Driver

PIN CONFIGURATION

(TOP VIEW)

VIN

VOUT

PGND

SGND

GND

FLASH

RSET

TDFN-3×3-10L

PIN DESCRIPTION

NAME

VIN

FUNCTION

Charge Pump Input Voltage. Decouple with a 4.7μF or 10μF ceramic capacitor close to the device.

Positive Terminal of the Flying Capacitor. Connect a 1μF ceramic capacitor close to the device.

Negative Terminal of the Flying Capacitor. Connect a 1μF ceramic capacitor close to the device.

Logic Input to Toggle Operation between Flash and Torch Modes. In torch mode, FB is regulated to the

internal 47mV reference. In flash mode, FB reference voltage (V_FB) can be set by R_SETresistor. Choose

the external current sense resistor (R_SENSE) according to desired current in either torch mode or flash

mode.

Shutdown Control Input. Pull it high to VIN for normal operation. Pull it Low to ground for shutdown. In

normal operation, it is recommended to connect to VIN only after V_INhas settled when the VIN ramping

up is slow.

FLASH

RSET Pin. Connect a resistor from this pin to ground. When in Flash mode (FLASH = High), this resistor

RSET sets the FB regulation voltage by the following equation:

V_FB= (1.26V/R_SET) × 10.2kΩ.

Feedback Input for Current. Connect the current sense resistor from FB to GND.

SGND Internal Ground Pin. Control circuitry returns current to this pin.

PGND Power Ground Pin. Flying capacitor current returns through this pin.

Charge Pump Output Voltage. Decouple with at least 1μF external capacitor. If a larger capacitor is used,

the output ripple is smaller.

VOUT

Exposed

Pad

GND

Exposed Pad. It should be soldered to PCB board and connected to GND.

SG Micro Corp

www.sg-micro.com

OCTOBER 2012

500mA Buck/Boost

SGM3140

Charge Pump LED Driver

ELECTRICAL CHARACTERISTICS

(V_IN= 3.6V, C_IN= 4.7μF, C_OUT= C_F= 1μF, V_SHDN= V_IN, Full = -40℃ to +85℃, typical values are at T_A= +25℃, unless otherwise

noted.)

PARAMETER

SYMBOL

CONDITIONS

TEMP

Full

MIN

TYP

MAX UNITS

Input Supply Voltage

V_IN

2.7

5.5

V_IN= 2.7V to 5.5V, FLASH = 0V, I_LOAD= 100μA

FLASH = V_IN, 2× Mode

Full

0.3

Quiescent Current

I_Q

Shutdown Current

I_SHDN

V_EN= 0V, V_IN= 5.5V

μA

Oscillator Frequency

2.2

MHz

Charge Pump Equivalent

Resistance (2× Mode)

Charge Pump Equivalent

Resistance (1× Mode)

0.6

0.8

FLASH = V_IN, R_SET= 86.6kΩ

FLASH = GND

Full

131

150

165

FB Reference Voltage

V_FB

FB Pin Current

V_FB= 0.3V

μA

EN, FLASH Logic Low

EN, FLASH Logic High

EN, FLASH Pin Current

V_OUTTurn-On Time

Full

0.4

1.3

μA

μs

℃

V_IN= 3.6V, FB within 90% of regulation

250

145

Thermal Shutdown Temperature

SG Micro Corp

www.sg-micro.com

OCTOBER 2012

500mA Buck/Boost

SGM3140

Charge Pump LED Driver

TYPICAL PERFORMANCE CHARACTERISTICS

C_IN= 10μF, C_OUT= 4.7μF, C_F= 1μF, unless otherwise noted.

SG Micro Corp

www.sg-micro.com

OCTOBER 2012

500mA Buck/Boost

SGM3140

Charge Pump LED Driver

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

C_IN= 10μF, C_OUT= 4.7μF, C_F= 1μF, unless otherwise noted.

Output Current vs. Input Voltage

Efficiency vs. Input Voltage

600

500

400

300

200

100

Torch 150mA V_F= 2.96V Torch 200mA V_F= 3.06V

Flash 300mA V_F= 3.15V Flash 500mA VF = 3.33V

Torch 150mA V_F= 2.96V Torch 200mA V_F= 3.06V

Flash 300mA V_F= 3.15V Flash 500mA V_F= 3.33V

2.7

3.3

3.6

3.9

4.2

3.2

3.4

3.6

3.8

4.2

Input Voltage (V)

Battery Current vs. Input Voltage

Flash 500mA V_F= 3.33V

1200

1000

800

600

400

200

Torch 160mA V_F= 3.01V

2.7

3.3

3.6

3.9

4.2

Input Voltage (V)

SG Micro Corp

www.sg-micro.com

OCTOBER 2012

500mA Buck/Boost

SGM3140

Charge Pump LED Driver

EVALUATION BOARD LAYOUT

REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

OCTOBER 2012 ‒ REV.A.1 to REV.A.2

Page

Changed Absolute Maximum Ratings section......................................................................................................................................................2

Changed Electrical Characteristics section..........................................................................................................................................................4

JUNE 2011 ‒ REV.A to REV.A.1

Page

Changed Pin Description section.........................................................................................................................................................................2

Added Evaluation Board Layout section ............................................................................................................................................................11

Changes from Original (JULY 2010) to REV.A

Page

Changed from product preview to production data.............................................................................................................................................All

SG Micro Corp

www.sg-micro.com

OCTOBER 2012

PACKAGE INFORMATION

PACKAGE OUTLINE DIMENSIONS

TDFN-3×3-10L

N10

BOTTOM VIEW

TOP VIEW

2.4

1.7 2.8

0.6

SIDE VIEW

0.24

0.5

RECOMMENDED LAND PATTERN (Unit: mm)

Dimensions

In Millimeters

Dimensions

In Inches

Symbol

MIN

MAX

0.800

0.050

MIN

0.028

0.000

MAX

0.031

0.002

0.700

0.000

0.203 REF

0.008 REF

2.900

2.300

2.900

1.500

3.100

2.600

3.100

1.800

0.114

0.091

0.114

0.059

0.122

0.103

0.122

0.071

0.200 MIN

0.500 TYP

0.008 MIN

0.020 TYP

0.180

0.300

0.500

0.007

0.012

0.020

SG Micro Corp

TX00060.000

www.sg-micro.com

PACKAGE INFORMATION

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel Diameter

Reel Width (W1)

DIRECTION OF FEED

NOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL

Reel Width

Reel

Diameter

Pin1

Package Type

(mm)

(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant

TDFN-3×3-10L

13″

12.4

3.35

1.13

4.0

8.0

2.0

12.0

SG Micro Corp

TX10000.000

www.sg-micro.com

PACKAGE INFORMATION

CARTON BOX DIMENSIONS

NOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF CARTON BOX

Length

(mm)

Width

(mm)

Height

(mm)

Reel Type

Pizza/Carton

13″

386

280

370

SG Micro Corp

www.sg-micro.com

TX20000.000

SGM3140 [SGMICRO]

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