SGM3726 [SGMICRO]
White LED Driver with PWM Dimming Control;型号: | SGM3726 |
厂家: | Shengbang Microelectronics Co, Ltd |
描述: | White LED Driver with PWM Dimming Control |
文件: | 总12页 (文件大小:545K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SGM3726
White LED Driver
with PWM Dimming Control
GENERAL DESCRIPTION
FEATURES
The SGM3726 is a high efficiency white LED driver with
a 1.25MHz boost converter. With the fixed switching
frequency and an internal 40V/1.1A switch FET, the
SGM3726 is designed for powering high brightness
LEDs in general lighting.
● Input Voltage Range: 3V to 20V
● Integrated 40V/1.1A Switch
● Up to 90% Efficiency
● Switching Frequency: 1.25MHz
● Feedback Voltage: 200mV
The SGM3726 is capable of driving up to 10 white
LEDs in series. The FB feedback voltage is regulated at
200mV typically. The default LED current is
programmed by an external RSET resistor. During the
operation, the LED current can be controlled by
applying a PWM signal to the CTRL pin. The feedback
voltage depends on the PWM signal duty cycle. For
PWM dimming control, there are no audible noises on
the output capacitor.
● PWM Dimming Control
● PWM Dimming Frequency: 5kHz to 100kHz
● 38V LED Open Protection for 10 LEDs
● 500kΩ Pull-Down Resistor on CTRL Pin
● Automatic Soft-Start for Reducing Inrush Current
● -40℃ to +85℃ Operating Temperature Range
● Available in Green TDFN-2×2-6L and TSOT-23-6
Packages
The SGM3726 integrates LED open protection. It
prevents the device from damaging due to the over-
voltage during LED open conditions.
APPLICATIONS
The SGM3726 is available in Green TDFN-2×2-6L and
TSOT-23-6 packages. It operates over an ambient
temperature range of -40℃ to +85℃.
Backlight for Media Form Factor Display
High Brightness LED Lighting
TYPICAL APPLICATION
L
10μH
D1
VIN
5V
VIN
SW
C1
1μF
CIN
22μF
SGM3726
COMP
GND
CCOMP
47nF
350mA
Enable and
PWM Dimming Control
CTRL
FB
RSET
0.57Ω
Figure 1. Typical Application Circuit
SG Micro Corp
www.sg-micro.com
SEPTEMBER2021–REV. B. 1
SGM3726
White LED Driver with PWM Dimming Control
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
3726
XXXX
TDFN-2×2-6L
TSOT-23-6
SGM3726YTDI6G/TR
SGM3726YTN6G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
SGM3726
SKBXX
MARKING INFORMATION
NOTE: XX = Date Code. XXXX = Date Code.
TDFN-2×2-6L
TSOT-23-6
X X X X
YYY X X
Date Code - Month
Date Code - Year
Serial Number
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
OVERSTRESS CAUTION
Supply Voltage on VIN....................................... -0.3V to 22V
Voltage on CTRL ................................................. -0.3V to 6V
Voltages on FB and COMP.................................. -0.3V to 3V
Voltage on SW................................................... -0.3V to 40V
Package Thermal Resistance
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
TDFN-2×2-6L, θJA.................................................... 120℃/W
TSOT-23-6, θJA ........................................................ 190℃/W
Storage Temperature Range........................-65℃ to +150℃
Junction Temperature.................................................+150℃
Operating Temperature Range.......................-40℃ to +85℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
MM.................................................................................300V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range...............................................3V to 20V
Operating Temperature Range.......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2021
2
SGM3726
White LED Driver with PWM Dimming Control
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
1
2
6
5
VIN
FB
FB
COMP
GND
VIN
1
2
3
6
5
4
COMP
CTRL
CTRL
SW
GND
3
4
SW
GND
TDFN-2×2-6L
TSOT-23-6
PIN DESCRIPTION
PIN
NAME
I/O
FUNCTION
TSOT-23-6 TDFN-2×2-6L
1
6
VIN
I
I
Input Supply Pin.
Boost Regulator Control Pin. It is used for enable control and PWM
dimming control.
2
5
CTRL
Boost Switching Node. The device monitors the output voltage on this pin
for LED open protection. Connect an inductor between the VIN and SW pins.
3
4
4
3
2
1
SW
GND
COMP
FB
I
O
O
I
Ground Pin.
Transconductance Error Amplifier Output. Connect an external capacitor
from COMP to GND to compensate the converter.
5
6
Feedback Input for Current. Connect the sense resistor from FB to GND.
Exposed
Pad
Exposed Pad. It should be soldered to the analog ground plane. If possible,
use thermal via connection to ground plane for enhanced power dissipation.
―
GND
―
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2021
3
SGM3726
White LED Driver with PWM Dimming Control
ELECTRICAL CHARACTERISTICS
(VIN = 3.6V, VCTRL = VIN, CIN = 22μF, Full = -40℃ to +85℃, typical values are at TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Power Supply
Input Voltage Range
VIN
IQ
3
20
0.6
1
V
+25℃
+25℃
+25℃
+25℃
+25℃
Operating Quiescent Current into VIN
Shutdown Current
VFB = 400mV
VCTRL = GND, VIN = 4.2V
0.4
mA
μA
V
ISD
Under-Voltage Lockout Threshold
Under-Voltage Lockout Hysterisis
Enable and Reference Control
CTRL Logic High Voltage
UVLO VIN falling
VHYS
2.2
70
2.5
mV
VCTRLH VIN = 3V to 20V
VCTRLL VIN = 3V to 20V
RCTRL
Full
Full
1.5
V
V
CTRL Logic Low Voltage
0.35
800
CTRL Pull Down Resistor
CTRL Pulse Width to Shutdown
Power Switch
400
2.5
500
kΩ
ms
+25℃
+25℃
tOFF
CTRL high to low
N-Channel Leakage Current
Voltage and Current Control
Voltage Feedback Regulation Voltage
ILN_NFET
1
μA
VSW = 35V, TA = 25℃
+25℃
VREF
Full
Full
193
44
200
50
207.5
56
mV
mV
fPWM =10kHz, duty cycle = 25%
fPWM =10kHz, duty cycle = 10%
VFB = 200mV
Voltage Feedback Regulation Voltage
Under Brightness Control
VREF_PWM
Full
14
20
26
Voltage Feedback Input Bias Current
Oscillator Frequency
IFB
fS
tMIN_ON
ISINK
ISOURCE
GEA
Full
0.001
1.25
80
0.2
μA
MHz
ns
Full
Minimum ON Pulse Width
COMP Pin Sink Current
+25℃
+25℃
+25℃
Full
40
μA
COMP Pin Source Current
Error Amplifier Transconductance
OC and OLP
20
μA
160
280
400
39.5
100
µmho
N-Channel MOSFET Current Limit
Open LED Protection Threshold
VREF Filter Time Constant
PWM Brightness Control
PWM Dimming Frequency
Minimum PWM On-Time
ILIM
VOVP
tREF
1.1
38
A
V
+25℃
Full
Measured on the SW pin
35.5
130
μs
+25℃
fPWM
Full
5
kHz
ns
80
2.5
+25℃
+25℃
Minimum Stable Duty Cycle
Thermal Shutdown
DMIN
%
Thermal Shutdown Threshold
Thermal Shutdown Threshold Hysteresis
TSHDN
THYS
150
15
℃
℃
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2021
4
SGM3726
White LED Driver with PWM Dimming Control
RECOMMENDED COMPONENTS OF TEST CIRCUITS
Component
Component
22μF/C2012X7R1H226KT
1μF/C2012X7R1H105KT
Inductor
Diode
10μH/CD75NP-100KC
Capacitor
MBR0540
47nF/C0603X7S0J473M030BB
TYPICAL PERFORMANCE CHARACTERISTICS
Open LED Protection
Output Ripple at PWM Dimming
VFB
PWM
AC Coupled
VOUT
VOUT
ILED
IL
VIN = 3.6V, ILED = 20mA, L = 10μH
VIN = 3.6V, ILED = 20mA, L = 10μH, 8LEDs
Time (200μs/div)
f
PWM = 10kHz, 10LEDs
Time (100μs/div)
Switching Waveform
Switching Waveform
VSW
VSW
AC Coupled
VOUT
VOUT
AC Coupled
IL
IL
VIN = 5V, ILED = 350mA, L = 10μH, 3LEDs
Time (2μs/div)
VIN = 3.6V, ILED = 20mA, L = 10μH, 8LEDs
Time (2μs/div)
Start-Up
Start-Up
VCTRL
VCTRL
VOUT
VOUT
VCOMP
VCOMP
IL
IL
VIN = 5V, ILED = 350mA, L = 10μH, 3LEDs
VIN = 3.6V, ILED = 20mA, L = 10μH, 10LEDs
Time (2ms/div)
Time (2ms/div)
SG Micro Corp
SEPTEMBER 2021
www.sg-micro.com
5
SGM3726
White LED Driver with PWM Dimming Control
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Efficiency vs. Output Current
VIN = 8V
Efficiency vs. Output Current
100
90
80
70
60
50
100
90
80
70
60
50
VIN = 12V
VIN = 5V
VIN = 3V
VIN = 5V
VIN = 3.6V
3LEDs (9V), L = 10μH
10LEDs (32V), L = 10μH
0
50
100
150
200
250
300
0
5
10
15
20
25
30
Output Current (mA)
Output Current (mA)
Efficiency vs. Output Current
IN = 3.6V, L = 10μH
6LEDs
Feedback Voltage vs. PWM Duty Cycle
VIN = 3.6V
100
90
80
70
60
50
200
160
120
80
V
4LEDs
fPWM = 40kHz
8LEDs
10LEDs
40
fPWM = 20kHz
4LEDs (12.8V), 6LEDs (19.2V)
8LEDs (25.6V), 10LEDs (32V)
0
0
5
10
15
20
25
30
0
20
40
60
80
100
Output Current (mA)
PWM Duty Cycle (%)
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2021
6
SGM3726
White LED Driver with PWM Dimming Control
ADDITIONAL TYPICAL APPLICATIONS
L
10μH
D1
VIN
3V to 6V
VIN
SW
C1
1μF
CIN
22μF
3S9P
27 LEDs
SGM3726
COMP
GND
FB
CCOMP
47nF
Enable and
PWM Dimming Control
CTRL
RSET
1.1Ω
Figure 2. Drive 27 LEDs for Media Form Factor Display
L
10μH
D1
VIN
12V
VIN
SW
C1
1μF
CIN
22μF
SGM3726
COMP
GND
CCOMP
47nF
350mA
Enable and
PWM Dimming Control
CTRL
FB
RSET
0.57Ω
Figure 3. Drive 6 High Brightness LEDs
L
10μH
C4
1μF
D1
V
OUT = 12V
VIN
9V to 15V
VIN
SW
C1
CIN
22μF
SGM3726
L2
10μH
1μF
COMP
GND
CCOMP
47nF
180mA
Enable and
PWM Dimming Control
CTRL
FB
RSET
1.1Ω
Figure 4. Drive 4 High Brightness LEDs with SEPIC Topology
SG Micro Corp
SEPTEMBER 2021
www.sg-micro.com
7
SGM3726
White LED Driver with PWM Dimming Control
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
SEPTEMBER 2021 ‒ REV.B to REV.B.1
Page
Changed Ordering Information section ................................................................................................................................................................2
Changed Package Outline Dimensions section .................................................................................................................................................17
JULY 2016 ‒ REV.A.4 to REV.B
Page
Change typical value of Oscillator Frequency ....................................................................................................................................................All
Change Marking Information section ...................................................................................................................................................................2
Changed Capacitor selection...............................................................................................................................................................................5
Changed Package Outline Dimensions section ........................................................................................................................................... 15, 16
MARCH 2015 ‒ REV.A.3 to REV.A.4
Page
Changed TDFN-2×2-6L, θJA.................................................................................................................................................................................2
MARCH 2015 ‒ REV.A.2 to REV.A.3
Page
New version.......................................................................................................................................................................................................All
JULY 2014 ‒ REV.A.1 to REV.A.2
Page
Added Mini PWM Duty Cycle: 2.5%.....................................................................................................................................................................9
JUNE 2014 ‒ REV.A to REV.A.1
Page
Changed Typical Application section ...................................................................................................................................................................3
Changed Application Information section...........................................................................................................................................................11
Changed Additional Typical Applications section......................................................................................................................................... 13, 14
Changes from Original (MARCH2014) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2021
8
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6L
D
e
N6
D1
L
E1
E
SEE DETAIL A
k
N3
N1
b
BOTTOM VIEW
TOP VIEW
1.40
0.65
A
A1
0.80
2.60
A2
SIDE VIEW
0.24
0.65
N2
N1
N2
N1
RECOMMENDED LAND PATTERN (Unit: mm)
DETAIL A
Pin #1 ID and Tie Bar Mark Options
NOTE: The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.600
2.100
1.450
2.100
0.850
0.075
0.043
0.075
0.024
0.083
0.057
0.083
0.034
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00055.001
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSOT-23-6
0.69
0.95
D
e
2.59
E1
E
0.99
b
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
θ
0.25
A1
c
A2
Dimensions In Millimeters
Symbol
MIN
-
MOD
MAX
1.100
0.100
1.000
0.500
0.200
3.050
1.700
2.950
A
A1
A2
b
-
0.000
0.700
0.300
0.080
2.820
1.550
2.650
-
-
-
c
-
D
E
-
-
E1
e
-
0.950 BSC
L
0.300
0°
-
-
0.600
8°
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00038.002
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-6L
TSOT-23-6
7″
7″
9.5
9.5
2.30
3.20
2.30
3.10
1.10
1.10
4.0
4.0
4.0
4.0
2.0
2.0
8.0
8.0
Q1
Q3
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
相关型号:
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