概述
数据手册SGM4056-10.5YTDB8G/TR 概述
High Input Voltage Charger
SGM4056-10.5YTDB8G/TR 数据手册
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PDF下载SGM4056
High Input Voltage Charger
GENERAL DESCRIPTION
FEATURES
The SGM4056 is a cost-effective, fully integrated high
input voltage single-cell Li-Ion battery charger. The
charger uses a CC/CV charge profile required by Li-Ion
battery. The charger accepts an input voltage up to
26.5V but is disabled when the input voltage exceeds
the OVP threshold, typically 6.8V (SGM4056-6.8) or
10.5V (SGM4056-10.5), to prevent excessive power
dissipation. The 26.5V rating eliminates the over-
voltage protection circuit required in a low input voltage
charger.
● Complete Charger for Single-Cell Li-Ion or
Polymer Batteries
● Integrated Pass Element and Current Sensor
● No External Blocking Diode Required
● Low Component Count and Cost
● Programmable Charge Current
● Programmable End-of-Charge Current
● Charge Current Thermal Foldback for Thermal
Protection
● 2.55V Trickle Charge Threshold
● 6.8V Input Over-Voltage Protection
for SGM4056-6.8
The charge current and the end-of-charge (EOC)
current are programmable with external resistors.
When the battery voltage is lower than typically 2.55V,
the charger preconditions the battery with typically 18%
of the programmed charge current. When the charge
current reduces to the programmable EOC current level
during the CV charge phase, an EOC indication is
provided by the CHG pin, which is an open-drain
output. An internal thermal foldback function protects
the charger from any thermal failure.
● 10.5V Input Over-Voltage Protection
for SGM4056-10.5
● 26.5V Maximum Voltage for the Power Input
● Power Presence and Charge Indications
● Less than 1μA Leakage Current off the Battery
When No Input Power Attached or Charger
Disabled
● Available in Green TDFN-3×3-8L, TDFN-2×3-8L,
TDFN-2×2-8L and SOIC-8 (Exposed Pad) Packages
Two indication pins (
and CHG ) allow simple
PPR
interface to a microprocessor or LEDs. When no
adapter is attached or when disabled, the charger
draws less than 1μA leakage current from the battery.
APPLICATIONS
Mobile Phones
Blue-Tooth Devices
PDAs
The SGM4056 is available in Green TDFN-3×3-8L,
TDFN-2×3-8L, TDFN-2×2-8L and SOIC-8 (Exposed
Pad) packages and is rated over the -40℃ to +85℃
temperature range.
MP3 Players
Stand-Alone Chargers
Other Handheld Devices
SG Micro Corp
OCTOBER2017–REV. A. 4
www.sg-micro.com
SGM4056
High Input Voltage Charger
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
VOVP
(V)
PACKAGE
DESCRIPTION
PACKAGE
MARKING
PACKING
OPTION
MODEL
ORDER NUMBER
SGM
G9DB
XXXXX
6.8V
TDFN-3×3-8L
SGM4056-6.8YTDB8G/TR
Tape and Reel, 3000
-40℃ to +85℃
SGB
XXXX
6.8V
6.8V
TDFN-2×3-8L
TDFN-2×2-8L
SGM4056-6.8YTDC8G/TR
SGM4056-6.8YTDE8G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
SG7
XXXX
SGM
SOIC-8
(Exposed Pad)
6.8V
SGM4056-6.8YPS8G/TR
4056-6.8YPS8 Tape and Reel, 2500
XXXXX
-40℃ to +85℃
-40℃ to +85℃
SGM4056
SGM
GADB
XXXXX
10.5V
TDFN-3×3-8L
SGM4056-10.5YTDB8G/TR
Tape and Reel, 3000
SGC
XXXX
10.5V
10.5V
TDFN-2×3-8L
TDFN-2×2-8L
SGM4056-10.5YTDC8G/TR
SGM4056-10.5YTDE8G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
SG8
XXXX
SGM
SOIC-8
(Exposed Pad)
10.5V
SGM4056-10.5YPS8G/TR 4056-10.5YPS8 Tape and Reel, 2500
XXXXX
-40℃ to +85℃
NOTE: XXXX = Date Code. XXXXX = Date Code and Vendor Code.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed may cause permanent damage
to the device. Functional operation of the device at these or
any otherconditions beyond those indicated in the operational
sectionof thespecification is not implied. Exposureto absolute
maximum rating conditions for extended periods may affect
reliability.
VIN to GND........................................................ -0.3V to 30V
,
,
, IMIN, IREF, BAT to GND ....... -0.3V to 6V
EN
CHG
PPR
Storage Temperature Range........................-65℃ to +150℃
Package Thermal Resistance
TDFN-3×3-8L, θJA...................................................... 84℃/W
TDFN-2×3-8L, θJA.................................................... 110℃/W
TDFN-2×2-8L, θJA.................................................... 118℃/W
SOIC-8 (Exposed Pad), θJA ....................................... 58℃/W
Junction Temperature.................................................+150℃
Lead Temperature (Soldering 10 sec) ........................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
HBM.............................................................................4000V
MM.................................................................................200V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range.......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuitdesign, specificationor other related things if necessary
without notice at any time.
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
2
SGM4056
High Input Voltage Charger
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
1
8
7
6
BAT
IREF
IMIN
GND
VIN
1
8
7
6
5
VIN
PPR
CHG
EN
BAT
2
3
PPR
CHG
EN
2
3
4
IREF
IMIN
GND
4
5
SOIC-8 (Exposed Pad)
TDFN-3×3-8L/TDFN-2×3-8L/TDFN-2×2-8L
PIN DESCRIPTION
PIN
NAME
FUNCTION
Power Input. The absolute maximum input voltage is 26.5V. A 1μF or larger value X5R ceramic
capacitor is recommended to be placed very close to the input pin for decoupling purpose. Additional
capacitance may be required to provide a stable input voltage.
1
VIN
Open-drain Power Presence Indication. The open-drain MOSFET turns on when the input voltage is
above the POR threshold but below the OVP threshold and off otherwise. This pin is capable to sink
15mA (MIN) current to drive an LED. The maximum voltage rating for this pin is 5.5V. This pin is
2
3
PPR
CHG
independent on the
pin input.
EN
Open-drain Charge Indication. This pin outputs a logic low when a charge cycle starts and turns to high
impedance when the end-of-charge (EOC) condition is qualified. This pin is capable to sink 15mA (MIN)
current to drive an LED. When the charger is disabled, the
pin outputs high impedance.
CHG
Enable Input. This is a logic input pin to disable or enable the charger. Drive to high to disable the
charger. When this pin is driven to low or left floating, the charger is enabled. This pin has an internal
200kΩ pull-down resistor.
4
5
EN
GND
System Ground.
End-of-Charge (EOC) Current Programming Pin. Connect a resistor between this pin and the GND pin
to set the EOC current. The EOC current IMIN can be programmed by the following equation:
10070
(mA)
IMIN
=
− 0.5
6
IMIN
RIMIN
where RIMIN is in kΩ. The programmable range covers 5% (or 10mA, whichever is higher) to 50% of
IREF. When programmed to less than 5% or 10mA, the stability is not guaranteed.
Charge-Current Programming and Monitoring Pin. Connect a resistor between this pin and the GND pin
to set the charge current limit determined by the following equation:
12080
(mA)
IREF
=
− 4
7
8
IREF
BAT
RIREF
where RIREF is in kΩ. The resistor should be located very close to this pin. The IREF pin voltage also
monitors the actual charge current during the entire charge cycle, including the trickle, constant-current,
and constant-voltage phases. When disabled, VIREF = 0V.
Charger Output Pin. Connect this pin to the battery. A 1μF or larger X5R ceramic capacitor is
recommended for decoupling and stability purposes. When the
output is disabled.
pin is pulled to logic high, the BAT
EN
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
3
SGM4056
High Input Voltage Charger
ELECTRICAL CHARACTERISTICS
(VIN = 5V, RIMIN = 243kΩ, TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
RECOMMENDED OPERATING CONDITIONS
Maximum Supply Voltage
26.5
6.10
9.35
900
V
V
SGM4056-6.8
Operating
4.55
4.55
100
Supply Voltage
SGM4056-10.5
Programmed Charge Current
mA
POWER-ON RESET
Rising POR Threshold
Falling POR Threshold
VIN-BAT OFFSET VOLTAGE
Rising Edge
VPOR
3.21
2.86
3.95
3.60
4.55
4.35
V
V
V
use
BAT = 3.0V, RIREF = 120kΩ,
to indicate the comparator output.
PPR
VPOR
VOS
VOS
110
60
200
mV
mV
VBAT = 4.5V, RIREF = 120kΩ, use
pin to
PPR
indicate the comparator output. (1)
Falling Edge
5
OVER-VOLTAGE PROTECTION
SGM4056-6.8
6.10
9.35
140
245
6.80
10.50
220
7.26
11.15
300
Over-Voltage
Protection Threshold
VOVP
V
SGM4056-10.5
SGM4056-6.8
SGM4056-10.5
VBAT = 4.3V, RIREF = 120kΩ,
use
to indicate the comparator output.
PPR
OVP Threshold
Hysteresis
VOVPHYS
mV
340
430
STANDBY CURRENT
BAT Pin Sink Current
VIN Pin Supply Current
VIN Pin Supply Current
ISTANDBY
IVIN
Charger disabled or the input is floating
VBAT = 4.3V, RIREF = 24.3kΩ, charger disabled
VBAT = 4.3V, RIREF = 24.3kΩ, charger enabled
1
μA
μA
μA
200
270
275
320
IVIN
VOLTAGE REGULATION
RIREF = 24.3kΩ, 4.55V < VIN < 6.10V,
charge current = 20mA
4.152
4.152
4.2
4.2
0.7
4.248
4.248
Output Voltage
VCH
V
RIREF = 24.3kΩ, 4.55V < VIN < 9.35V,
charge current = 20mA
VBAT = 3.8V, charge current = 500mA,
PMOS On Resistance
RDS (ON)
Ω
RIREF = 10kΩ
CHARGE CURRENT (2)
IREF Pin Output Voltage
Constant Charge Current
Trickle Charge Current
End-of-Charge Current
EOC Rising Threshold
VIREF
IREF
ITRK
IMIN
VBAT = 3.8V, RIREF = 120kΩ
RIREF = 24.3kΩ, VBAT = 2.8V to 3.8V
RIREF = 24.3kΩ, VBAT = 2.4V
RIREF = 24.3kΩ
1.162
440
55
1.215
500
90
1.262
560
135
75
V
mA
mA
mA
mA
20
40
RIREF = 24.3kΩ
315
370
435
PRECONDITIONING CHARGE THRESHOLD
Preconditioning Charge
Threshold Voltage
VMIN
VMINHYS
RIREF = 24.3kΩ
RIREF = 24.3kΩ
2.46
20
2.55
100
2.65
190
V
Preconditioning Voltage Hysteresis
mV
NOTES:
1. The 4.5V VBAT is selected so that the
output can be used as the indication for the offset comparator output indication. If
PPR
the VBAT is lower than the POR threshold, no output pin can be used for indication.
2. The charge current can be affected by the thermal foldback function if the IC under the test setup cannot dissipate the heat.
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
4
SGM4056
High Input Voltage Charger
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 5V, RIMIN = 243kΩ, TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
INTERNAL TEMPERATURE MONITORING
Charge Current Foldback Threshold
LOGIC INPUT AND OUTPUTS
TFOLD
115
℃
1.5
V
V
Pin Logic Input High
EN
0.8
Pin Logic Input Low
EN
150
15
200
24
250
kΩ
mA
Pin Internal Pull Down Resistance
EN
Sink Current when LOW
Pin Voltage = 1V
CHG
CHG
Leakage Current when High
VCHG = 5.5V
4.5
4.5
μA
mA
μA
Impedance
Pin Voltage = 1V
VPPR = 5.5V
15
24
Sink Current when LOW
PPR
PPR
Leakage Current when High
Impedance
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
5
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS
Preconditioning Charge Threshold Voltage
IREF Pin Output Voltage vs. Temperature
vs. Temperature
2.600
2.575
2.550
2.525
2.500
2.475
2.450
1.230
1.225
1.220
1.215
1.210
1.205
1.200
V
R
IN = 5V
IREF = 120kΩ
VIN = 5V
IREF = 24.3kΩ
R
VBAT = 3.8V
-50
-25
0
25
50
75
100
-50 -25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
Output Voltage vs. Temperature
Charge Current vs. Temperature
4.215
4.210
4.205
4.200
4.195
4.190
4.185
4.180
600
500
400
300
200
100
0
V
R
IN = 5V
IREF = 24.3kΩ
Charge Current = 20mA
R
IREF = 24.3kΩ
V
IN = 5V
VBAT = 3.8V
TDFN-3×3-8L
RIREF = 120kΩ
-50 -25
0
25
50 75 100 125 150
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
PPR Pin Current vs. Temperature (Sink)
CHG Pin Current vs. Temperature (Sink)
30.0
27.5
25.0
22.5
20.0
17.5
15.0
30.0
27.5
25.0
22.5
20.0
17.5
15.0
VIN = 5V
VBAT = 3.8V
VPPR = 1V
VIN = 5V
VBAT = 3.8V
VCHG = 1V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
6
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN Pin Supply Current vs. Temperature
VIN Pin Supply Current vs. Temperature
240
220
200
180
160
140
120
300
280
260
240
220
200
180
VIN = 5V
IREF = 24.3kΩ
IMIN = 243kΩ
VBAT = 4.3V
Charger Disabled
V
R
IN = 5V
IREF = 24.3kΩ
R
R
RIMIN = 243kΩ
VBAT = 4.3V
Charger Enabled
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
Over-Voltage Protection Threshold vs.
Temperature
Over-Voltage Protection Threshold vs.
Temperature
6.86
10.52
10.51
10.50
10.49
10.48
10.47
10.46
6.85
6.84
6.83
6.82
6.81
6.80
VBAT = 4.3V
VBAT = 4.3V
RIREF = 120kΩ
RIREF = 120kΩ
SGM4056-6.8
SGM4056-10.5
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
Trickle Charge Current vs. Temperature
PMOS On Resistance vs. Temperature
120
100
80
60
40
20
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
R
IREF = 24.3kΩ
VIN = 5V
VBAT = 2.4V
R
IREF = 10kΩ
RIREF = 120kΩ
Charge Current = 500mA
VBAT = 3.8V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
7
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Charge Current vs. Battery Voltage
Charge Current vs. Battery Voltage
800
700
600
500
400
300
200
600
500
400
300
200
100
0
TA = 0℃
TA = 25℃
TA = 40℃
V
IN = 5V
VIN = 5V
RIREF = 24.3kΩ
RIREF = 24.3kΩ
TDFN-3×3-8L
TDFN-3×3-8L
2.5 2.75
3
3.25 3.5 3.75
VBAT (V)
4
4.25
2.0
2.4
2.8
3.2
3.6
4.0
4.4
VBAT (V)
Trickle Charge Current vs. Supply Voltage
Charge Current vs. Supply Voltage
120
100
80
60
40
20
0
600
500
400
300
200
100
0
R
IREF = 24.3kΩ
R
IREF = 24.3kΩ
VBAT = 3.8V
TDFN-3×3-8L
SGM4056-10.5
VBAT = 2.4V
SGM4056-10.5
RIREF = 120kΩ
RIREF = 120kΩ
4
5
6
7
8
9
10
11
4
5
6
7
8
9
10
11
Supply Voltage (V)
Supply Voltage (V)
IREF Pin Voltage vs. Supply Voltage
Output Voltage vs. Supply Voltage
1.222
1.220
1.218
1.216
1.214
1.212
1.210
4.210
4.205
4.200
4.195
4.190
4.185
4.180
R
IREF = 120kΩ
R
IREF = 24.3kΩ
VBAT = 3.8V
Charge Current = 20mA
SGM4056-10.5
SGM4056-10.5
4
5
6
7
8
9
10
11
4
5
6
7
8
9
10
11
Supply Voltage (V)
Supply Voltage (V)
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
8
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
PPR Pin I-V Curve
CHG Pin I-V Curve
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 5V
VBAT = 3.8V
VIN = 5V
VBAT = 3.8V
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VPPR (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VCHG (V)
IREF Pin Voltage vs. Charge Current
Output Voltage vs. Charge Current
1.2
1.0
0.8
0.6
0.4
0.2
0.0
4.3
4.2
4.1
4.0
3.9
3.8
3.7
3.6
V
R
IN = 5V
IREF = 10kΩ
VIN= 5V
IREF = 24.3kΩ
R
SOIC-8 (Exposed Pad)
0
100
200
300
400
500
0
100
200
300
REF (mA)
400
500
600
IREF (mA)
I
Complete Charge Cycle (1500mAh Battery)
Battery Voltage
600
500
400
300
200
100
0
6
5
4
3
2
1
0
Charge Current
VIN = 5V
IREF = 24.3kΩ
IMIN = 243kΩ
R
R
CHG Voltage
0
1
2
3
4
Time (Hours)
SG Micro Corp
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OCTOBER 2017
9
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
End-of-Charge Current Programming ±2σ Tolerance Guide
Charge Current Programming ±2σ Tolerance Guide
+2σ
700
600
500
400
300
200
100
0
70
60
50
40
30
20
10
0
+2σ
mean
mean
-2σ
-2σ
0
100 200 300 400 500 600 700
Programmed Charge Current (mA)
0
10
20
30
40
50
60
70
Programmed End-of-Charge Current (mA)
SG Micro Corp
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OCTOBER 2017
10
SGM4056
High Input Voltage Charger
TYPICAL APPLICATION CIRCUITS
TO BATTERY
TO INPUT
1
8
7
6
VIN
BAT
IREF
IMIN
RIREF
C1
R1
D1
R2
D2
C2
RIMIN
SGM4056
3
2
CHG
4
PPR
OFF
EN
ON
GND
5
Figure 1. Typical Application Circuit Interfacing to Indication LEDs
TO INPUT
C1
TO BATTERY
C2
1
8
7
6
BAT
VIN
RIREF
IREF
IMIN
VCC
RIMIN
SGM4056
OFF
4
R1
R2
EN
3
2
CHG
PPR
ON
GND
5
Figure 2. Typical Application Circuit with the Indication Signals Interfacing to an MCU
COMPONENT DESCRIPTION FOR FIGURE 1 COMPONENT DESCRIPTION FOR FIGURE 2
PART
C1
C2
DESCRIPTION
1μF X5R ceramic cap
1μF X5R ceramic cap
PART
C1
C2
DESCRIPTION
1μF X5R ceramic cap
1μF X5R ceramic cap
RIREF 24.3kΩ, 1%, for 500mA charge current
RIMIN 243kΩ, 1%, for 40mA EOC current
RIREF 24.3kΩ, 1%, for 500mA charge current
RIMIN 243kΩ, 1%, for 40mA EOC current
R1, R2 300Ω, 5%
R1, R2 100kΩ, 5%
D1, D2 LEDs for indication
Trickle
CC
CV
4.2V
IREF
Charge Voltage
74% IREF
Charge Current
18% IREF
IMIN
CHG Indication
CHG
Time
Figure 3. Typical Charge Profile
SG Micro Corp
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OCTOBER 2017
11
SGM4056
High Input Voltage Charger
OPERATION
The SGM4056 charges a Li-Ion battery using a CC/CV
profile. The constant current IREF is set with the external
resistor RIREF (see Figure 1) and the constant voltage is
fixed at 4.2V. If the battery voltage is below a typical
2.55V trickle charge threshold, the SGM4056 charges
the battery with a trickle current of 18% of IREF until the
battery voltage rises above the trickle charge threshold.
Fast charge CC mode is maintained at the rate
determined by programming IREF until the cell voltage
rises to 4.2V. When the battery voltage reaches 4.2V,
the charger enters a CV mode and regulates the
battery voltage at 4.2V to fully charge the battery
without the risk of over charge. Upon reaching an
end-of-charge (EOC) current, the charger indicates the
drive an LED (see Figure 1) or to interface with a micro-
processor.
Power Good Range
The power good range is defined by the following three
conditions:
1. VIN > VPOR
2. VIN - VBAT > VOS
3. VIN < VOVP
where the VOS is the offset voltage for the input and
output voltage comparator, discussed shortly, and the
VOVP is the over-voltage protection threshold given in
the Electrical Characteristics table. All VPOR, VOS, and
VOVP have hysteresis, as given in the Electrical
Characteristics table. The charger will not charge the
battery if the input voltage is not in the power good
range.
charge completion with the
pin, but the charger
CHG
continues to output the 4.2V voltage. Figure 3 shows
the typical charge waveforms after the power is on.
The EOC current level IMIN is programmable with the
external resistor RIMIN (see Figure 1). The
pin
CHG
turns to low when the trickle charge starts and rises to
high impedance at the EOC. After the EOC is reached,
the charge current has to rise to typically 74% IREF for
Input and Output Comparator
The charger will not be enabled unless the input
voltage is higher than the battery voltage by an offset
voltage VOS. The purpose of this comparator is to
ensure that the charger is turned off when the input
power is removed from the charger. Without this
comparator, it is possible that the charger will fail to
power down when the input is removed and the current
can leak through the PFET pass element to continue
biasing the POR and the Pre-Regulator blocks.
the
pin to turn on again, as shown in Figure 3.
CHG
The current surge after EOC can be caused by a load
connected to the battery.
A thermal foldback function reduces the charge current
anytime when the die temperature reaches typically
115℃. This function guarantees safe operation when
the printed circuit board (PCB) is not capable of
dissipating the heat generated by the linear charger.
The SGM4056 accepts an input voltage up to 26.5V but
disables charging when the input voltage exceeds the
OVP threshold, typically 6.8V for SGM4056-6.8 and
10.5V for SGM4056-10.5, to protect against unqualified
or faulty AC adapters.
Dropout Voltage
The constant current may not be maintained due to the
RDS(ON) limit at a low input voltage. The worst case
RDS(ON) is at the maximum allowable operating
temperature.
PPR
Indication
CHG
Indication
The
pin is an open-drain output to indicate the
PPR
The
is an open-drain output capable of sinking at
CHG
presence of the AC adapter. Whenever the input
voltage is higher than the POR threshold, the pin
turns on the internal open-drain MOSFET to indicate a
logic low signal, independent on the pin input.
least 15mA current when the charger starts to charge,
and turns off when the EOC current is reached. The
PPR
signal is interfaced either with a microprocessor
CHG
EN
GPIO or an LED for indication.
When the internal open-drain FET is turned off, the
pin leaks less than 4.5µA current. When turned on,
PPR
the
pin is able to sink at least 15mA current under
PPR
all operating conditions. The
pin can be used to
PPR
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
12
SGM4056
High Input Voltage Charger
OPERATION (continued)
Operation without the Battery
EN
Input
The SGM4056 relies on a battery for stability and works
under LDO mode if the battery is not connected. With a
battery, the charger will be stable with an output
ceramic decoupling capacitor in the range of 1µF to
200µF. In LDO mode, its stability depends on load
current, COUT, etc. The maximum load current is limited
by the dropout voltage, the programmed IREF and the
thermal foldback.
is an active-low logic input to enable the charger.
EN
Drive the
pin to low or leave it floating to enable
EN
the charger. This pin has a 200kΩ internal pull-down
resistor so when left floating, the input is equivalent to
logic low. Drive this pin to high to disable the charger.
The threshold for high is given in the Electrical
Characteristics table.
IREF Pin
Thermal Foldback
The IREF pin has the two functions as described in the
Pin Description section. When setting the fast charge
current, the charge current is guaranteed to have 12%
accuracy with the charge current set at 500mA. When
monitoring the charge current, the accuracy of the IREF
pin voltage vs. the actual charge current has the same
accuracy as the gain from the IREF pin current to the
actual charge current.
The thermal foldback function starts to reduce the
charge current when the internal temperature reaches
a typical value of +115℃.
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
13
SGM4056
High Input Voltage Charger
APPLICATION INFORMATION
Input Capacitor Selection
Layout Guidance
The input capacitor is required to suppress the power
supply transient response during transitions. Mainly this
capacitor is selected to avoid oscillation during the start
up when the input supply is passing the POR threshold
and the VIN-BAT comparator offset voltage. When the
The SGM4056 uses thermally-enhanced TDFN and
SOIC packages that have an exposed thermal pad at
the bottom side of the packages. The layout should
connect as much as possible to copper on the exposed
pad. Typically the component layer is more effective in
dissipating heat. The thermal impedance can be further
reduced by using other layers of copper connecting to
the exposed pad through a thermal via array. Each
thermal via is recommended to have 0.3mm diameter
and 1mm distance from other thermal vias.
battery voltage is above the POR threshold, the VIN
-
VBAT offset voltage dominates the hysteresis value.
Typically, a 1µF X5R ceramic capacitor should be
sufficient to suppress the power supply noise.
Output Capacitor Selection
Input Power Sources
The criterion for selecting the output capacitor is to
maintain the stability of the charger as well as to
bypass any transient load current. The minimum
capacitance is a 1µF X5R ceramic capacitor. The
actual capacitance connected to the output is
dependent on the actual application requirement.
The input power source is typically a well-regulated wall
cube with 1-meter length wire or a USB port. The
SGM4056 can withstand up to 26.5V on the input
without damaging the IC. If the input voltage is higher
than typically 6.8V (SGM4056-6.8) or 10.5V
(SGM4056-10.5), the charger stops charging.
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
OCTOBER 2017 ‒ REV.A.3 to REV.A.4
Changed Electrical Characteristics section..........................................................................................................................................................5
MAY 2017 ‒ REV.A.2 to REV.A.3
Changed Absolute Maximum Ratings section......................................................................................................................................................2
MAY 2015 ‒ REV.A.1 to REV.A.2
Changed Pin Description section.........................................................................................................................................................................3
Added Typical Performance Characteristics section ..........................................................................................................................................10
NOVEMBER 2014 ‒ REV.A to REV.A.1
Changed Electrical Characteristics section..........................................................................................................................................................4
Changes from Original (JANUARY 2013) to REV.A
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
14
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-8L
D
e
N8
D1
k
E
E1
N4
N1
L
b
BOTTOM VIEW
TOP VIEW
2.3
1.5 2.725
A
A1
A2
0.675
SIDE VIEW
0.65
0.24
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
2.900
2.200
2.900
1.400
3.100
2.400
3.100
1.600
0.114
0.087
0.114
0.055
0.122
0.094
0.122
0.063
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.375
0.300
0.575
0.007
0.015
0.012
0.023
e
L
SG Micro Corp
www.sg-micro.com
TX00058.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×3-8L
D
e
N5
N8
k
L
E
E1
D1
N1
b
N4
BOTTOM VIEW
TOP VIEW
1.50
0.60
1.50
3.00
A
A1
A2
SIDE VIEW
0.25
0.50
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.924
1.400
2.924
1.400
2.076
1.600
3.076
1.600
0.076
0.055
0.115
0.055
0.082
0.063
0.121
0.063
D1
E
E1
k
0.200 MIN
0.500 TYP
0.008 MIN
0.020 TYP
b
0.200
0.224
0.300
0.376
0.008
0.009
0.012
0.015
e
L
SG Micro Corp
www.sg-micro.com
TX00057.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-8L
D
e
N8
E1
D1
L
E
k
N4
N1
b
BOTTOM VIEW
TOP VIEW
1.20
0.65
0.60 1.95
A
A1
A2
SIDE VIEW
0.24
0.50
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.500
2.100
1.300
2.100
0.700
0.075
0.043
0.075
0.020
0.083
0.051
0.083
0.028
D1
E
E1
k
0.200 MIN
0.500 TYP
0.008 MIN
0.020 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
SG Micro Corp
www.sg-micro.com
TX00056.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8 (Exposed Pad)
3.302
D
e
E1
E
2.413 5.56
E2
1.91
b
D1
1.27
0.61
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.067
0.004
0.061
0.020
0.010
0.201
0.134
0.157
0.244
0.099
A
A1
A2
b
1.700
0.100
1.550
0.510
0.250
5.100
3.402
4.000
6.200
2.513
0.000
1.350
0.330
0.170
4.700
3.202
3.800
5.800
2.313
0.000
0.053
0.013
0.007
0.185
0.126
0.150
0.228
0.091
c
D
D1
E
E1
E2
e
1.27 BSC
0.050 BSC
L
0.400
0°
1.270
8°
0.016
0°
0.050
8°
θ
SG Micro Corp
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TX00013.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-3×3-8L
TDFN-2×3-8L
TDFN-2×2-8L
13″
7″
12.4
9.5
3.35
2.30
2.30
6.40
3.35
3.30
2.30
5.40
1.13
1.10
1.10
2.10
4.0
4.0
4.0
4.0
8.0
4.0
4.0
8.0
2.0
2.0
2.0
2.0
12.0
8.0
Q1
Q2
Q1
Q1
7″
9.5
8.0
SOIC-8
(Exposed Pad)
13″
12.4
12.0
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
368
442
386
227
410
280
224
224
370
8
18
5
7″
13″
SG Micro Corp
www.sg-micro.com
TX20000.000
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