SGM41603 [SGMICRO]
I2C Controlled 10A Bidirectional Switched-Capacitor Converter;
| 型号： | SGM41603 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | I2C Controlled 10A Bidirectional Switched-Capacitor Converter |
| 文件： | 总7页 (文件大小：467K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM41603
I2C Controlled 10A Bidirectional
Switched-Capacitor Converter
GENERAL DESCRIPTION
FEATURES
The SGM41603 is an efficient 2:1 bidirectional
switched-capacitor converter with integrated power
switches. It can deliver 10A in forward direction (2:1
voltage divider) and 5A in the reverse direction (1:2
voltage doubler). This device allows using a 2S Li+
power source as a 1S Li+ solution by inserting it
between the 2S battery pack and charger output, and
saves the existing 1S power architecture that is
powered from the same battery.
● Bidirectional Switched Capacitor Converter
Forward Direction 2:1 Conversion, Reverse
Direction 1:2 Conversion
2-Phase Interleaved Operation (90° or 180°)
8 Integrated N-Type MOSFET Switches
10A Output Current Capability
98.5% Peak Efficiency
● Low IQ Current: 59μA Forward Operating
● 6.7μA Shutdown Current
● I2C Interface with Interrupt Signaling
● Adjustable Soft-Start Current and Timeout
● 0.25MHz to 1.5MHz Adjustable Switching
Frequency
This 2-phase high switching frequency (1.5MHz, MAX)
and inductor-less topology allow low profile design with
small footprint. The high switching frequency also
reduces the size and quantity of the required capacitors.
Safe operation is assured by over-voltage, under-voltage,
over-current and thermal protections. Interference is
also minimized by the built-in frequency dithering option.
This device can achieve 98.5% efficiency which is the
highest in its class. Thermal management of such a low
loss device is simple, which makes it an ideal choice for
industrial, consumer, and medical applications.
● Low EMI with Switching Frequency Dithering
● Enable Input
● Out-of-Audio Option at Light Load
● Power Good Output
● Programmable V1X & V2X Over-Voltage Lockout
● Separate OCP Adjustment for Each Direction
● Thermal Alarm and Protection
● Available in a Green WLCSP-2.85×2.59-42B Package
The I2C interface allows flexible parameter settings
including OCP, OVLO, switching frequency thresholds
and soft-start currents and durations. The SGM41603
TYPICAL APPLICATION
is available in
package.
a
Green WLCSP-2.85×2.59-42B
APPLICATIONS
Smartphones, Tablets, Ultrabooks
Chromebooks, DSLR and Mirrorless Cameras
Power Banks, 2S Li+ Battery Applications
Smartphone Direct Charging, Portable Printers
Portable Gaming Devices, Two-Way Radios
Figure 1. Typical Application Circuit
SG Micro Corp
MARCH 30, 2023
www.sg-micro.com
I2C Controlled 10A Bidirectional
Switched-Capacitor Converter
SGM41603
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
064
SGM41603 WLCSP-2.85×2.59-42B
SGM41603YG/TR
XXXXX
XX#XX
Tape and Reel, 5000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code. XX#XX = Coordinate Information and Wafer ID Number.
Date Code - Year
Trace Code
Vendor Code
X X X X X
XX＃XX
Coordinate Information
Wafer ID Number ("A" = 01, "B" = 02, …"Y" = 25)
Coordinate Information
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
(CF1P - V1X), CF1N .............................................0V to 5.5V
(BST2P - CF2P), (BST2N - CF2N),..........................0V to 5V
(CF2P - V1X), CF2N .............................................0V to 5.5V
AVDD, (HVDD - V1X), VIO, EN................................0V to 5V
PGOOD.................................................................0V to 1.8V
SDA, SCL, IRQB ......................................................0V to 5V
Junction Temperature Range...................... -40℃ to +125℃
V2X to PGND..................................................... -0.3V to 16V
BSTxP to PGND ................................................ -0.3V to 16V
BSTxN to PGND.................................................. -0.3V to 8V
BSTxP to CFxP.................................................... -0.3V to 6V
BSTxN to CFxN ................................................... -0.3V to 6V
CFxP to PGND ....................................... -0.3V to (VV1X + 6V)
CFxN, V1X to PGND ........................................... -0.3V to 6V
PGND to AGND................................................ -0.3V to 0.3V
HVDD to AGND ...................................... -0.3V to (VV1X + 6V)
AVDD, NC, IRQB, VIO to AGND ......................... -0.3V to 6V
EN to AGND ...................................................... -0.3V to 16V
SDA, SCL to AGND..............................-0.3V to (VVIO + 0.3V)
PGOOD to AGND............................................. -0.3V to 2.0V
V1X Continuous RMS Current (From V2X to V1X)..........10A
Package Thermal Resistance
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
WLCSP-2.85×2.59-42B, θJA ...................................... 62℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................2000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
V2X.........................................................................5V to 11V
V1X.....................................................................2.8V to 5.5V
DISCLAIMER
SG Micro Corp reserves the right to make any change in
I
V1X (Voltage Divider Mode).....................................0A to 10A
IV2X (Voltage Doubler Mode) .....................................0A to 5A
(BST1P - CF1P), (BST1N - CF1N) ...........................0V to 5V
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MARCH 2023
2
I2C Controlled 10A Bidirectional
Switched-Capacitor Converter
SGM41603
PIN CONFIGURATION
(TOP VIEW)
1
2
3
4
5
6
7
CF1N
CF1N
CF1N
NC
V1X
V1X
V1X
V1X
V1X
V1X
V1X
CF1P
PGND
CF1P
A
B
C
D
E
F
PGND
AVDD
AGND
PGND
PGND
BST1N
SDA
BST1P
EN
CF1P
HVDD
PGOOD
CF2P
V2X
V2X
SCL
VIO
IRQB
BST2P
V1X
V2X
BST2N
CF2N
CF2N
CF2N
V2X
CF2P
CF2P
WLCSP-2.85×2.59-42B
SG Micro Corp
www.sg-micro.com
MARCH 2023
3
I2C Controlled 10A Bidirectional
Switched-Capacitor Converter
SGM41603
PIN DESCRIPTION
PIN
NAME
PGND
CF1N
V1X
TYPE (1)
P
FUNCTION
A1, B1, E1, F1
A2, A3, B3
Power Ground.
Flying Cap Phase 1 Negative Node. Connect at least two parallel 47µF capacitors between
CF1P and CF1N pins as close as possible to these pins.
P
A4, A5, B4, C4,
D4, E4, F4, F5
Lower Voltage (1X) Power Port. It is an input in forward mode and an output in reverse mode.
A 22μF capacitor is recommended between V1X and PGND.
P
Flying Cap Phase 1 Positive Node. Connect at least two parallel 47µF capacitors between
CF1P and CF1N pins as close as possible to these pins.
A6, A7, B6
CF1P
BST1N
BST1P
V2X
P
Bootstrap Capacitor Connection for QCL1 Gate Driver Supply. Place a 47nF or larger ceramic
capacitor between this pin and CF1N.
B2
P
Bootstrap Capacitor Connection for QCH1 Gate Driver Supply. Place a 47nF or larger ceramic
capacitor between this pin and CF1P.
B5
P
Higher Voltage (2X) Power Port. It is an input in forward and an output in reverse direction. A
22μF capacitor is recommended between V2X and PGND.
B7, C7, D7, E7
P
5V LDO Output. Decouple AVDD to AGND with at least 1μF high quality ceramic capacitor
(X5R or better). Do not connect any external load to AVDD.
C1
AVDD
SDA
AO
DIO
–
C2
I2C Interface Data Line.
C3
NC
No Connection. Leave this pin open.
Active High Device Enable Input.
C5
EN
DI
AO
P
(VV1X + 5V) LDO Output. Decouple HVDD to V1X with at least 1μF high quality ceramic
capacitor (X5R or better). Do not connect any external load to HVDD.
C6
D1
HVDD
AGND
SCL
Analog Ground.
D2
DI
P
I2C Interface Clock Line.
Input Voltage Supply for I/O Circuits. Bypass this pin to AGND with at least 1μF high quality
ceramic capacitor (X5R or better).
D3
VIO
Open-Drain Active Low Interrupt Output. Pull it up with a 100kΩ resistor to VIO. A low on
IRQB indicates a fault condition.
D5
IRQB
PGOOD
BST2N
CF2N
BST2P
CF2P
DO
DO
P
D6
Power Good Output.
Bootstrap Capacitor Connection for QCL2 Gate Driver Supply. Place a 47nF or larger ceramic
capacitor between this pin and CF2N.
E2
Flying Cap Phase 2 Negative Node. Connect at least two parallel 47µF capacitors between
CF2P and CF2N pins as close as possible to these pins.
E3, F2, F3
E5
P
Bootstrap Capacitor Connection for QCH2 Gate Driver Supply. Place a 47nF or larger ceramic
capacitor between this pin and CF2P.
P
Flying Cap Phase 2 Positive Node. Connect at least two parallel 47µF capacitors between
CF2P and CF2N pins as close as possible to these pins.
E6, F6, F7
P
NOTE:
1. P = Power, AI = Analog Input, AO = Analog Output, AIO = Analog Input/Output, DI = Digital Input, DO = Digital Output, DIO =
Digital Input/Output.
SG Micro Corp
www.sg-micro.com
MARCH 2023
4
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
WLCSP-2.85×2.59-42B
D
0.22
42 × Φ
0.20
A1 CORNER
E
0.40
0.40
TOP VIEW
RECOMMENDED LAND PATTERN (Unit: mm)
7
6
5
4
3
2
1
42 × Φd
A
B
C
D
E
F
C
A
A1
SEATING PLANE
ccc
C
e
e
SIDE VIEW
BOTTOM VIEW
Dimensions In Millimeters
Symbol
MIN
MOD
0.640
MAX
A
A1
D
0.602
0.186
2.823
2.563
0.240
0.678
0.226
2.883
2.623
0.280
0.206
2.853
E
2.593
d
0.260
e
0.400 BSC
0.050
ccc
-
-
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00260.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
WLCSP-2.85×2.59-42B
13″
12.4
2.70
3.00
0.80
4.0
8.0
2.0
12.0
Q2
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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